KR20250044782A - 에칭액 조성물 - Google Patents

에칭액 조성물 Download PDF

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Publication number
KR20250044782A
KR20250044782A KR1020257007856A KR20257007856A KR20250044782A KR 20250044782 A KR20250044782 A KR 20250044782A KR 1020257007856 A KR1020257007856 A KR 1020257007856A KR 20257007856 A KR20257007856 A KR 20257007856A KR 20250044782 A KR20250044782 A KR 20250044782A
Authority
KR
South Korea
Prior art keywords
etching
inhibitor
silicon nitride
composition
silicon oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257007856A
Other languages
English (en)
Korean (ko)
Inventor
쇼 나가오
다카오 미쓰이
Original Assignee
라사 인더스트리즈, 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 라사 인더스트리즈, 리미티드 filed Critical 라사 인더스트리즈, 리미티드
Publication of KR20250044782A publication Critical patent/KR20250044782A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H01L21/306—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
KR1020257007856A 2022-12-08 2023-08-03 에칭액 조성물 Pending KR20250044782A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022196435 2022-12-08
JPJP-P-2022-196435 2022-12-08
PCT/JP2023/028410 WO2024122103A1 (ja) 2022-12-08 2023-08-03 エッチング液組成物

Publications (1)

Publication Number Publication Date
KR20250044782A true KR20250044782A (ko) 2025-04-01

Family

ID=91379139

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257007856A Pending KR20250044782A (ko) 2022-12-08 2023-08-03 에칭액 조성물

Country Status (4)

Country Link
JP (1) JPWO2024122103A1 (https=)
KR (1) KR20250044782A (https=)
TW (1) TWI881428B (https=)
WO (1) WO2024122103A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263258A1 (ja) * 2024-06-17 2025-12-26 ラサ工業株式会社 エッチング液組成物
WO2026075173A1 (ja) * 2024-10-04 2026-04-09 花王株式会社 エッチング液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018207108A (ja) 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
JP2020096160A (ja) 2018-08-31 2020-06-18 花王株式会社 エッチング液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5332197B2 (ja) * 2007-01-12 2013-11-06 東ソー株式会社 エッチング用組成物及びエッチング方法
CN107345137A (zh) * 2016-05-04 2017-11-14 Oci有限公司 能够抑制颗粒出现的蚀刻溶液
CN117568038A (zh) * 2016-12-26 2024-02-20 秀博瑞殷株式公社 蚀刻用组合物和使用该蚀刻用组合物制造半导体器件的方法
KR102399990B1 (ko) * 2017-09-06 2022-05-23 엔테그리스, 아이엔씨. 질화 규소를 포함하는 기판을 에칭하는 조성물 및 방법
KR102264002B1 (ko) * 2017-10-20 2021-06-11 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP7233252B2 (ja) * 2019-03-07 2023-03-06 関東化学株式会社 窒化ケイ素エッチング液組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018207108A (ja) 2017-06-05 2018-12-27 バーサム マテリアルズ ユーエス，リミティド ライアビリティ カンパニー 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液
JP2020096160A (ja) 2018-08-31 2020-06-18 花王株式会社 エッチング液

Also Published As

Publication number Publication date
TWI881428B (zh) 2025-04-21
TW202424159A (zh) 2024-06-16
WO2024122103A1 (ja) 2024-06-13
JPWO2024122103A1 (https=) 2024-06-13

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St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000