KR20250040948A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR20250040948A
KR20250040948A KR1020257001852A KR20257001852A KR20250040948A KR 20250040948 A KR20250040948 A KR 20250040948A KR 1020257001852 A KR1020257001852 A KR 1020257001852A KR 20257001852 A KR20257001852 A KR 20257001852A KR 20250040948 A KR20250040948 A KR 20250040948A
Authority
KR
South Korea
Prior art keywords
resin composition
mass
less
cured product
viscosity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001852A
Other languages
English (en)
Korean (ko)
Inventor
이치로 오구라
다이치 오카자키
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20250040948A publication Critical patent/KR20250040948A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
KR1020257001852A 2022-07-26 2023-06-19 수지 조성물 Pending KR20250040948A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-118675 2022-07-26
JP2022118675 2022-07-26
PCT/JP2023/022554 WO2024024331A1 (ja) 2022-07-26 2023-06-19 樹脂組成物

Publications (1)

Publication Number Publication Date
KR20250040948A true KR20250040948A (ko) 2025-03-25

Family

ID=89706036

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257001852A Pending KR20250040948A (ko) 2022-07-26 2023-06-19 수지 조성물

Country Status (5)

Country Link
JP (1) JPWO2024024331A1 (enrdf_load_stackoverflow)
KR (1) KR20250040948A (enrdf_load_stackoverflow)
CN (1) CN119585335A (enrdf_load_stackoverflow)
TW (1) TW202432656A (enrdf_load_stackoverflow)
WO (1) WO2024024331A1 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340762U (enrdf_load_stackoverflow) 1986-09-02 1988-03-16
JP2010070605A (ja) 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255860A (ja) * 1984-05-31 1985-12-17 Sumitomo Bakelite Co Ltd 絶縁樹脂ペ−スト
US4732952A (en) * 1986-12-05 1988-03-22 Rohm And Haas Company "B stageable" high service temperature epoxy thermosets
JP5118830B2 (ja) * 2006-08-07 2013-01-16 共栄社化学株式会社 エポキシ基含有硬化性樹脂成分
JP5504553B2 (ja) * 2006-12-19 2014-05-28 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規エポキシ樹脂
JP6601634B2 (ja) * 2017-03-31 2019-11-06 協立化学産業株式会社 変性樹脂及びそれを含む硬化性樹脂組成物
JP2018189756A (ja) * 2017-04-28 2018-11-29 四国化成工業株式会社 感光性樹脂組成物及び感光性フィルム
JP2019112548A (ja) * 2017-12-25 2019-07-11 Dic株式会社 （メタ）アクリレート樹脂及び光学部材
CN109486264A (zh) * 2018-11-29 2019-03-19 安徽牡东通讯光缆有限公司 一种耐腐蚀光缆用环氧树脂涂层材料

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340762U (enrdf_load_stackoverflow) 1986-09-02 1988-03-16
JP2010070605A (ja) 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物

Also Published As

Publication number Publication date
JPWO2024024331A1 (enrdf_load_stackoverflow) 2024-02-01
WO2024024331A1 (ja) 2024-02-01
TW202432656A (zh) 2024-08-16
CN119585335A (zh) 2025-03-07

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250117

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application