JPWO2024024331A1 - - Google Patents
Info
- Publication number
- JPWO2024024331A1 JPWO2024024331A1 JP2024536848A JP2024536848A JPWO2024024331A1 JP WO2024024331 A1 JPWO2024024331 A1 JP WO2024024331A1 JP 2024536848 A JP2024536848 A JP 2024536848A JP 2024536848 A JP2024536848 A JP 2024536848A JP WO2024024331 A1 JPWO2024024331 A1 JP WO2024024331A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022118675 | 2022-07-26 | ||
| PCT/JP2023/022554 WO2024024331A1 (ja) | 2022-07-26 | 2023-06-19 | 樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024024331A1 true JPWO2024024331A1 (enrdf_load_stackoverflow) | 2024-02-01 |
Family
ID=89706036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024536848A Pending JPWO2024024331A1 (enrdf_load_stackoverflow) | 2022-07-26 | 2023-06-19 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024024331A1 (enrdf_load_stackoverflow) |
| KR (1) | KR20250040948A (enrdf_load_stackoverflow) |
| CN (1) | CN119585335A (enrdf_load_stackoverflow) |
| TW (1) | TW202432656A (enrdf_load_stackoverflow) |
| WO (1) | WO2024024331A1 (enrdf_load_stackoverflow) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60255860A (ja) * | 1984-05-31 | 1985-12-17 | Sumitomo Bakelite Co Ltd | 絶縁樹脂ペ−スト |
| JPS6340762U (enrdf_load_stackoverflow) | 1986-09-02 | 1988-03-16 | ||
| US4732952A (en) * | 1986-12-05 | 1988-03-22 | Rohm And Haas Company | "B stageable" high service temperature epoxy thermosets |
| JP5118830B2 (ja) * | 2006-08-07 | 2013-01-16 | 共栄社化学株式会社 | エポキシ基含有硬化性樹脂成分 |
| JP5504553B2 (ja) * | 2006-12-19 | 2014-05-28 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規エポキシ樹脂 |
| JP2010070605A (ja) | 2008-09-17 | 2010-04-02 | Dic Corp | 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物 |
| JP6601634B2 (ja) * | 2017-03-31 | 2019-11-06 | 協立化学産業株式会社 | 変性樹脂及びそれを含む硬化性樹脂組成物 |
| JP2018189756A (ja) * | 2017-04-28 | 2018-11-29 | 四国化成工業株式会社 | 感光性樹脂組成物及び感光性フィルム |
| JP2019112548A (ja) * | 2017-12-25 | 2019-07-11 | Dic株式会社 | （メタ）アクリレート樹脂及び光学部材 |
| CN109486264A (zh) * | 2018-11-29 | 2019-03-19 | 安徽牡东通讯光缆有限公司 | 一种耐腐蚀光缆用环氧树脂涂层材料 |
-
2023
- 2023-06-19 JP JP2024536848A patent/JPWO2024024331A1/ja active Pending
- 2023-06-19 CN CN202380054987.2A patent/CN119585335A/zh active Pending
- 2023-06-19 WO PCT/JP2023/022554 patent/WO2024024331A1/ja active Application Filing
- 2023-06-19 KR KR1020257001852A patent/KR20250040948A/ko active Pending
- 2023-07-05 TW TW112125045A patent/TW202432656A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024024331A1 (ja) | 2024-02-01 |
| TW202432656A (zh) | 2024-08-16 |
| CN119585335A (zh) | 2025-03-07 |
| KR20250040948A (ko) | 2025-03-25 |