CN119585335A - 树脂组合物 - Google Patents

树脂组合物 Download PDF

Info

Publication number
CN119585335A
CN119585335A CN202380054987.2A CN202380054987A CN119585335A CN 119585335 A CN119585335 A CN 119585335A CN 202380054987 A CN202380054987 A CN 202380054987A CN 119585335 A CN119585335 A CN 119585335A
Authority
CN
China
Prior art keywords
resin composition
composition according
mass
less
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380054987.2A
Other languages
English (en)
Chinese (zh)
Inventor
小椋一郎
冈崎大地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN119585335A publication Critical patent/CN119585335A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epoxy Resins (AREA)
CN202380054987.2A 2022-07-26 2023-06-19 树脂组合物 Pending CN119585335A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022118675 2022-07-26
JP2022-118675 2022-07-26
PCT/JP2023/022554 WO2024024331A1 (ja) 2022-07-26 2023-06-19 樹脂組成物

Publications (1)

Publication Number Publication Date
CN119585335A true CN119585335A (zh) 2025-03-07

Family

ID=89706036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380054987.2A Pending CN119585335A (zh) 2022-07-26 2023-06-19 树脂组合物

Country Status (5)

Country Link
JP (1) JPWO2024024331A1 (enrdf_load_stackoverflow)
KR (1) KR20250040948A (enrdf_load_stackoverflow)
CN (1) CN119585335A (enrdf_load_stackoverflow)
TW (1) TW202432656A (enrdf_load_stackoverflow)
WO (1) WO2024024331A1 (enrdf_load_stackoverflow)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255860A (ja) * 1984-05-31 1985-12-17 Sumitomo Bakelite Co Ltd 絶縁樹脂ペ−スト
JPS6340762U (enrdf_load_stackoverflow) 1986-09-02 1988-03-16
US4732952A (en) * 1986-12-05 1988-03-22 Rohm And Haas Company "B stageable" high service temperature epoxy thermosets
JP5118830B2 (ja) * 2006-08-07 2013-01-16 共栄社化学株式会社 エポキシ基含有硬化性樹脂成分
JP5504553B2 (ja) * 2006-12-19 2014-05-28 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、ビルドアップフィルム絶縁層用樹脂組成物、及び新規エポキシ樹脂
JP2010070605A (ja) 2008-09-17 2010-04-02 Dic Corp 液状エポキシ樹脂組成物、硬化物、その製造方法、及びプリント配線基板用樹脂組成物
JP6601634B2 (ja) * 2017-03-31 2019-11-06 協立化学産業株式会社 変性樹脂及びそれを含む硬化性樹脂組成物
JP2018189756A (ja) * 2017-04-28 2018-11-29 四国化成工業株式会社 感光性樹脂組成物及び感光性フィルム
JP2019112548A (ja) * 2017-12-25 2019-07-11 Dic株式会社 （メタ）アクリレート樹脂及び光学部材
CN109486264A (zh) * 2018-11-29 2019-03-19 安徽牡东通讯光缆有限公司 一种耐腐蚀光缆用环氧树脂涂层材料

Also Published As

Publication number Publication date
JPWO2024024331A1 (enrdf_load_stackoverflow) 2024-02-01
WO2024024331A1 (ja) 2024-02-01
TW202432656A (zh) 2024-08-16
KR20250040948A (ko) 2025-03-25

Similar Documents

Publication Publication Date Title
EP2796482B1 (en) Polymer powder, curable resin composition, and cured product thereof
JP3736611B2 (ja) フリップチップ型半導体装置用封止材及びフリップチップ型半導体装置
JP4213767B2 (ja) 電子部品用接着剤
US20190338171A1 (en) Thermally conductive paste and electronic device
JP7582065B2 (ja) 樹脂組成物
KR101995601B1 (ko) 수지 조성물 및 반도체 장치
CN114787307B (zh) 各向异性导电膜
JP2012077098A (ja) オーバーコート材及びそれを用いた半導体装置
CN114773780A (zh) 树脂组合物、树脂糊、固化物、半导体芯片封装及半导体装置
US20190264070A1 (en) Thermally conductive paste and electronic device
CN119585335A (zh) 树脂组合物
WO2014010258A1 (ja) 半導体封止用アクリル樹脂組成物とそれを用いた半導体装置およびその製造方法
TW202342571A (zh) 硬化性組成物
JP7673842B2 (ja) アンダーフィル材
CN108350320B (zh) 粘接剂组合物和结构体
JP5971609B2 (ja) 硬化性樹脂組成物及びこれを硬化した硬化物
JP2022111634A (ja) 導電性ペースト、高熱伝導性材料および半導体装置
CN108350341A (zh) 粘接剂组合物和结构体
JP2023079035A (ja) 樹脂組成物
JP7464198B2 (ja) 導電性ペースト、硬化物および半導体装置
JP2025001413A (ja) 樹脂組成物
CN119161723A (zh) 树脂组合物
TW202210539A (zh) 樹脂組成物
JP2024007477A (ja) 樹脂組成物
TW202309224A (zh) 接著劑組成物及連接結構體之製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination