KR20250029269A - 기판을 처리하는 장치 및 기판을 처리하는 방법 - Google Patents
기판을 처리하는 장치 및 기판을 처리하는 방법 Download PDFInfo
- Publication number
- KR20250029269A KR20250029269A KR1020257005057A KR20257005057A KR20250029269A KR 20250029269 A KR20250029269 A KR 20250029269A KR 1020257005057 A KR1020257005057 A KR 1020257005057A KR 20257005057 A KR20257005057 A KR 20257005057A KR 20250029269 A KR20250029269 A KR 20250029269A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- room
- wafer
- stage
- return
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L21/67709—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
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- H01L21/67028—
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- H01L21/67103—
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- H01L21/67126—
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- H01L21/6719—
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- H01L21/67196—
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- H01L21/67207—
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- H01L21/67751—
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- H01L21/68742—
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- H01L21/68764—
-
- H01L21/68785—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3308—Vertical transfer of a single workpiece
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020141126A JP7596670B2 (ja) | 2020-08-24 | 2020-08-24 | 基板を処理する装置、及び基板を処理する方法 |
| JPJP-P-2020-141126 | 2020-08-24 | ||
| PCT/JP2021/029759 WO2022044834A1 (ja) | 2020-08-24 | 2021-08-12 | 基板を処理する装置、及び基板を処理する方法 |
| KR1020237008815A KR102785462B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237008815A Division KR102785462B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250029269A true KR20250029269A (ko) | 2025-03-04 |
Family
ID=80353158
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257005057A Pending KR20250029269A (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
| KR1020257005056A Active KR102914542B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
| KR1020237008815A Active KR102785462B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257005056A Active KR102914542B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
| KR1020237008815A Active KR102785462B1 (ko) | 2020-08-24 | 2021-08-12 | 기판을 처리하는 장치 및 기판을 처리하는 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US12512354B2 (https=) |
| JP (4) | JP7596670B2 (https=) |
| KR (3) | KR20250029269A (https=) |
| CN (3) | CN121908844A (https=) |
| WO (1) | WO2022044834A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102505763B1 (ko) * | 2021-01-29 | 2023-03-02 | 고려대학교 산학협력단 | 자성 전사 장치와 자성 전자 장치의 제조 방법 |
| US20240153800A1 (en) | 2022-11-07 | 2024-05-09 | Applied Materials, Inc. | Semiconductor process equipment |
| US12273051B2 (en) | 2022-12-14 | 2025-04-08 | Applied Materials, Inc. | Apparatus and method for contactless transportation of a carrier |
| IT202200026931A1 (it) * | 2022-12-28 | 2024-06-28 | Ima Spa | Apparato di lavorazione elettromagnetico. |
| US12548743B2 (en) | 2023-09-01 | 2026-02-10 | Applied Materials, Inc. | Passive lift pin assembly |
| JP2025058669A (ja) | 2023-09-28 | 2025-04-09 | 東京エレクトロン株式会社 | 半導体製造装置、及び半導体製造装置における基板搬送方法 |
| USD1122216S1 (en) | 2023-10-02 | 2026-04-14 | Applied Materials, Inc. | Substrate carrier |
| USD1118552S1 (en) | 2023-10-24 | 2026-03-17 | Applied Materials, Inc. | Substrate carrier |
| JP2025085890A (ja) | 2023-11-27 | 2025-06-06 | 東京エレクトロン株式会社 | 搬送モジュール、及び半導体製造装置における基板搬送方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07117849A (ja) | 1993-10-22 | 1995-05-09 | Ebara Corp | 磁気浮上搬送装置 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614412A (ja) * | 1992-06-25 | 1994-01-21 | Ntn Corp | 磁気浮上搬送装置 |
| JPH07172578A (ja) * | 1993-12-15 | 1995-07-11 | Ebara Corp | トンネル搬送装置 |
| JP3909608B2 (ja) * | 1994-09-30 | 2007-04-25 | 株式会社アルバック | 真空処理装置 |
| JP4531247B2 (ja) | 2000-12-19 | 2010-08-25 | 株式会社アルバック | 真空処理装置 |
| JP2004018215A (ja) * | 2002-06-18 | 2004-01-22 | Tokyo Electron Ltd | フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法 |
| US7959395B2 (en) * | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
| JP4413789B2 (ja) * | 2005-01-24 | 2010-02-10 | 東京エレクトロン株式会社 | ステージ装置および塗布処理装置 |
| EP1717339A2 (de) * | 2005-04-20 | 2006-11-02 | Applied Films GmbH & Co. KG | Kontinuierliche Beschichtungsanlage |
| WO2010013333A1 (ja) * | 2008-07-31 | 2010-02-04 | 株式会社島津製作所 | 真空装置及び真空処理方法 |
| TWI676227B (zh) * | 2015-01-23 | 2019-11-01 | 美商應用材料股份有限公司 | 半導體工藝設備 |
| US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
| EP3405973A1 (en) * | 2016-01-18 | 2018-11-28 | Applied Materials, Inc. | Apparatus for transportation of a substrate carrier in a vacuum chamber, system for vacuum processing of a substrate, and method for transportation of a substrate carrier in a vacuum chamber |
| CN109496348B (zh) * | 2016-09-12 | 2022-01-18 | 应用材料公司 | 半导体工艺设备 |
| JP6972852B2 (ja) * | 2017-05-23 | 2021-11-24 | 東京エレクトロン株式会社 | 真空搬送モジュール及び基板処理装置 |
| JP6863114B2 (ja) * | 2017-06-16 | 2021-04-21 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP2019532485A (ja) | 2017-08-25 | 2019-11-07 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 真空チャンバ内でキャリアを搬送するための装置、及び真空チャンバ内でキャリアを搬送するための方法 |
| JP2020515026A (ja) * | 2018-03-09 | 2020-05-21 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 真空処理システムおよび真空処理システムを動作させる方法 |
| CN112106182A (zh) * | 2018-03-20 | 2020-12-18 | 东京毅力科创株式会社 | 结合有集成半导体加工模块的自感知校正异构平台及其使用方法 |
| JP2019182952A (ja) | 2018-04-05 | 2019-10-24 | 住友ベークライト株式会社 | フェノール樹脂組成物及び成形体 |
| JP7346020B2 (ja) | 2018-11-15 | 2023-09-19 | 株式会社アルバック | 磁気浮上搬送装置 |
| JP7316782B2 (ja) | 2018-12-14 | 2023-07-28 | キヤノントッキ株式会社 | 蒸着装置、電子デバイスの製造装置、および、蒸着方法 |
-
2020
- 2020-08-24 JP JP2020141126A patent/JP7596670B2/ja active Active
-
2021
- 2021-08-12 KR KR1020257005057A patent/KR20250029269A/ko active Pending
- 2021-08-12 KR KR1020257005056A patent/KR102914542B1/ko active Active
- 2021-08-12 CN CN202512035570.5A patent/CN121908844A/zh active Pending
- 2021-08-12 CN CN202180050414.3A patent/CN115916673B/zh active Active
- 2021-08-12 WO PCT/JP2021/029759 patent/WO2022044834A1/ja not_active Ceased
- 2021-08-12 KR KR1020237008815A patent/KR102785462B1/ko active Active
- 2021-08-12 US US18/021,157 patent/US12512354B2/en active Active
- 2021-08-12 CN CN202512035566.9A patent/CN121908843A/zh active Pending
-
2024
- 2024-11-26 JP JP2024205691A patent/JP7790531B2/ja active Active
- 2024-11-26 JP JP2024205675A patent/JP7773690B2/ja active Active
-
2025
- 2025-10-16 US US19/360,854 patent/US20260047386A1/en active Pending
- 2025-10-16 US US19/360,847 patent/US20260047385A1/en active Pending
- 2025-12-04 JP JP2025230630A patent/JP2026031692A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07117849A (ja) | 1993-10-22 | 1995-05-09 | Ebara Corp | 磁気浮上搬送装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2025019257A (ja) | 2025-02-06 |
| JP2022036757A (ja) | 2022-03-08 |
| JP2026031692A (ja) | 2026-02-24 |
| JP2025019258A (ja) | 2025-02-06 |
| WO2022044834A1 (ja) | 2022-03-03 |
| US20260047386A1 (en) | 2026-02-12 |
| CN115916673A (zh) | 2023-04-04 |
| KR102785462B1 (ko) | 2025-03-21 |
| CN115916673B (zh) | 2026-02-03 |
| US12512354B2 (en) | 2025-12-30 |
| KR20250029986A (ko) | 2025-03-05 |
| US20230317488A1 (en) | 2023-10-05 |
| CN121908844A (zh) | 2026-04-21 |
| US20260047385A1 (en) | 2026-02-12 |
| CN121908843A (zh) | 2026-04-21 |
| JP7790531B2 (ja) | 2025-12-23 |
| JP7596670B2 (ja) | 2024-12-10 |
| KR102914542B1 (ko) | 2026-01-19 |
| JP7773690B2 (ja) | 2025-11-20 |
| KR20230049730A (ko) | 2023-04-13 |
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