JP7596670B2 - 基板を処理する装置、及び基板を処理する方法 - Google Patents

基板を処理する装置、及び基板を処理する方法 Download PDF

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Publication number
JP7596670B2
JP7596670B2 JP2020141126A JP2020141126A JP7596670B2 JP 7596670 B2 JP7596670 B2 JP 7596670B2 JP 2020141126 A JP2020141126 A JP 2020141126A JP 2020141126 A JP2020141126 A JP 2020141126A JP 7596670 B2 JP7596670 B2 JP 7596670B2
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Prior art keywords
substrate
chamber
wafer
stage
module
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Japanese (ja)
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JP2022036757A (ja
JP2022036757A5 (https=
Inventor
博充 阪上
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2020141126A priority Critical patent/JP7596670B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to KR1020257005056A priority patent/KR102914542B1/ko
Priority to CN202512035570.5A priority patent/CN121908844A/zh
Priority to KR1020257005057A priority patent/KR20250029269A/ko
Priority to PCT/JP2021/029759 priority patent/WO2022044834A1/ja
Priority to CN202180050414.3A priority patent/CN115916673B/zh
Priority to CN202512035566.9A priority patent/CN121908843A/zh
Priority to KR1020237008815A priority patent/KR102785462B1/ko
Priority to US18/021,157 priority patent/US12512354B2/en
Publication of JP2022036757A publication Critical patent/JP2022036757A/ja
Publication of JP2022036757A5 publication Critical patent/JP2022036757A5/ja
Priority to JP2024205691A priority patent/JP7790531B2/ja
Priority to JP2024205675A priority patent/JP7773690B2/ja
Application granted granted Critical
Publication of JP7596670B2 publication Critical patent/JP7596670B2/ja
Priority to US19/360,854 priority patent/US20260047386A1/en
Priority to US19/360,847 priority patent/US20260047385A1/en
Priority to JP2025230630A priority patent/JP2026031692A/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3204—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using magnetic elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00—Non-mechanical conveyors not otherwise provided for
    • B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
JP2020141126A 2020-08-24 2020-08-24 基板を処理する装置、及び基板を処理する方法 Active JP7596670B2 (ja)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP2020141126A JP7596670B2 (ja) 2020-08-24 2020-08-24 基板を処理する装置、及び基板を処理する方法
US18/021,157 US12512354B2 (en) 2020-08-24 2021-08-12 Substrate processing apparatus and substrate processing method
CN202512035570.5A CN121908844A (zh) 2020-08-24 2021-08-12 对基板进行处理的装置和对基板进行处理的方法
KR1020257005057A KR20250029269A (ko) 2020-08-24 2021-08-12 기판을 처리하는 장치 및 기판을 처리하는 방법
PCT/JP2021/029759 WO2022044834A1 (ja) 2020-08-24 2021-08-12 基板を処理する装置、及び基板を処理する方法
CN202180050414.3A CN115916673B (zh) 2020-08-24 2021-08-12 对基板进行处理的装置和对基板进行处理的方法
CN202512035566.9A CN121908843A (zh) 2020-08-24 2021-08-12 对基板进行处理的装置和对基板进行处理的方法
KR1020237008815A KR102785462B1 (ko) 2020-08-24 2021-08-12 기판을 처리하는 장치 및 기판을 처리하는 방법
KR1020257005056A KR102914542B1 (ko) 2020-08-24 2021-08-12 기판을 처리하는 장치 및 기판을 처리하는 방법
JP2024205691A JP7790531B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2024205675A JP7773690B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
US19/360,854 US20260047386A1 (en) 2020-08-24 2025-10-16 Substrate processing device and substrate processing method
US19/360,847 US20260047385A1 (en) 2020-08-24 2025-10-16 Substrate processing device and substrate processing method
JP2025230630A JP2026031692A (ja) 2020-08-24 2025-12-04 基板を処理する装置、及び基板を処理する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020141126A JP7596670B2 (ja) 2020-08-24 2020-08-24 基板を処理する装置、及び基板を処理する方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2024205691A Division JP7790531B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2024205675A Division JP7773690B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法

Publications (3)

Publication Number Publication Date
JP2022036757A JP2022036757A (ja) 2022-03-08
JP2022036757A5 JP2022036757A5 (https=) 2023-04-18
JP7596670B2 true JP7596670B2 (ja) 2024-12-10

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Application Number Title Priority Date Filing Date
JP2020141126A Active JP7596670B2 (ja) 2020-08-24 2020-08-24 基板を処理する装置、及び基板を処理する方法
JP2024205691A Active JP7790531B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2024205675A Active JP7773690B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2025230630A Pending JP2026031692A (ja) 2020-08-24 2025-12-04 基板を処理する装置、及び基板を処理する方法

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Application Number Title Priority Date Filing Date
JP2024205691A Active JP7790531B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2024205675A Active JP7773690B2 (ja) 2020-08-24 2024-11-26 基板を処理する装置、及び基板を処理する方法
JP2025230630A Pending JP2026031692A (ja) 2020-08-24 2025-12-04 基板を処理する装置、及び基板を処理する方法

Country Status (5)

Country Link
US (3) US12512354B2 (https=)
JP (4) JP7596670B2 (https=)
KR (3) KR20250029269A (https=)
CN (3) CN121908844A (https=)
WO (1) WO2022044834A1 (https=)

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KR102505763B1 (ko) * 2021-01-29 2023-03-02 고려대학교 산학협력단 자성 전사 장치와 자성 전자 장치의 제조 방법
US20240153800A1 (en) 2022-11-07 2024-05-09 Applied Materials, Inc. Semiconductor process equipment
US12273051B2 (en) 2022-12-14 2025-04-08 Applied Materials, Inc. Apparatus and method for contactless transportation of a carrier
IT202200026931A1 (it) * 2022-12-28 2024-06-28 Ima Spa Apparato di lavorazione elettromagnetico.
US12548743B2 (en) 2023-09-01 2026-02-10 Applied Materials, Inc. Passive lift pin assembly
JP2025058669A (ja) 2023-09-28 2025-04-09 東京エレクトロン株式会社 半導体製造装置、及び半導体製造装置における基板搬送方法
USD1122216S1 (en) 2023-10-02 2026-04-14 Applied Materials, Inc. Substrate carrier
USD1118552S1 (en) 2023-10-24 2026-03-17 Applied Materials, Inc. Substrate carrier
JP2025085890A (ja) 2023-11-27 2025-06-06 東京エレクトロン株式会社 搬送モジュール、及び半導体製造装置における基板搬送方法

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JP2020515026A (ja) 2018-03-09 2020-05-21 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空処理システムおよび真空処理システムを動作させる方法

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WO2019182952A1 (en) 2018-03-20 2019-09-26 Tokyo Electron Limited Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same

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Publication number Publication date
JP2025019257A (ja) 2025-02-06
JP2022036757A (ja) 2022-03-08
JP2026031692A (ja) 2026-02-24
JP2025019258A (ja) 2025-02-06
WO2022044834A1 (ja) 2022-03-03
US20260047386A1 (en) 2026-02-12
CN115916673A (zh) 2023-04-04
KR102785462B1 (ko) 2025-03-21
CN115916673B (zh) 2026-02-03
US12512354B2 (en) 2025-12-30
KR20250029986A (ko) 2025-03-05
KR20250029269A (ko) 2025-03-04
US20230317488A1 (en) 2023-10-05
CN121908844A (zh) 2026-04-21
US20260047385A1 (en) 2026-02-12
CN121908843A (zh) 2026-04-21
JP7790531B2 (ja) 2025-12-23
KR102914542B1 (ko) 2026-01-19
JP7773690B2 (ja) 2025-11-20
KR20230049730A (ko) 2023-04-13

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