KR20250022205A - 도금액 - Google Patents

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Publication number
KR20250022205A
KR20250022205A KR1020257001322A KR20257001322A KR20250022205A KR 20250022205 A KR20250022205 A KR 20250022205A KR 1020257001322 A KR1020257001322 A KR 1020257001322A KR 20257001322 A KR20257001322 A KR 20257001322A KR 20250022205 A KR20250022205 A KR 20250022205A
Authority
KR
South Korea
Prior art keywords
sample
plating solution
pei compound
copper plating
polyethyleneimine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001322A
Other languages
English (en)
Korean (ko)
Inventor
유미 다니모토
슌 츠지노
šœ 츠지노
가즈오 이바타
치카코 요코야마
Original Assignee
가부시끼가이샤 제이씨유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 제이씨유 filed Critical 가부시끼가이샤 제이씨유
Publication of KR20250022205A publication Critical patent/KR20250022205A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020257001322A 2022-08-31 2023-06-26 도금액 Pending KR20250022205A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-138480 2022-08-31
JP2022138480 2022-08-31
PCT/JP2023/023544 WO2024048039A1 (ja) 2022-08-31 2023-06-26 めっき液

Publications (1)

Publication Number Publication Date
KR20250022205A true KR20250022205A (ko) 2025-02-14

Family

ID=90099390

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257001322A Pending KR20250022205A (ko) 2022-08-31 2023-06-26 도금액

Country Status (5)

Country Link
EP (1) EP4582596A1 (https=)
JP (1) JP7553747B2 (https=)
KR (1) KR20250022205A (https=)
CN (1) CN118265814A (https=)
WO (1) WO2024048039A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119081106B (zh) * 2024-08-27 2025-09-12 南昌大学 一种高压电解液添加剂及其制备方法与应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020523481A (ja) 2017-06-16 2020-08-06 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 水性酸性銅電気めっき浴および銅コーティングの電解析出方法
JP2020536168A (ja) 2017-11-09 2020-12-10 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 電解銅析出用のめっき組成物、その使用、および基材の少なくとも１つの表面上に銅層または銅合金層を電解析出させる方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001279228A (ja) * 2000-03-31 2001-10-10 Ajinomoto Co Inc 新規なキレート剤
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
CN110117801B (zh) * 2019-06-21 2021-04-20 通元科技(惠州)有限公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020523481A (ja) 2017-06-16 2020-08-06 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 水性酸性銅電気めっき浴および銅コーティングの電解析出方法
JP2020536168A (ja) 2017-11-09 2020-12-10 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 電解銅析出用のめっき組成物、その使用、および基材の少なくとも１つの表面上に銅層または銅合金層を電解析出させる方法

Also Published As

Publication number Publication date
WO2024048039A1 (ja) 2024-03-07
EP4582596A1 (en) 2025-07-09
JP7553747B2 (ja) 2024-09-18
JPWO2024048039A1 (https=) 2024-03-07
CN118265814A (zh) 2024-06-28

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250114

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application