JP7553747B2 - めっき液 - Google Patents

めっき液 Download PDF

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Publication number
JP7553747B2
JP7553747B2 JP2024502553A JP2024502553A JP7553747B2 JP 7553747 B2 JP7553747 B2 JP 7553747B2 JP 2024502553 A JP2024502553 A JP 2024502553A JP 2024502553 A JP2024502553 A JP 2024502553A JP 7553747 B2 JP7553747 B2 JP 7553747B2
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JP
Japan
Prior art keywords
sample
plating solution
copper plating
pei compound
polyethyleneimine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024502553A
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English (en)
Japanese (ja)
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JPWO2024048039A1 (https=
Inventor
由実 谷本
峻 辻野
和男 衣幡
千香子 横山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
JCU Corp
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Publication date
Application filed by JCU Corp filed Critical JCU Corp
Publication of JPWO2024048039A1 publication Critical patent/JPWO2024048039A1/ja
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Publication of JP7553747B2 publication Critical patent/JP7553747B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2024502553A 2022-08-31 2023-06-26 めっき液 Active JP7553747B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022138480 2022-08-31
JP2022138480 2022-08-31
PCT/JP2023/023544 WO2024048039A1 (ja) 2022-08-31 2023-06-26 めっき液

Publications (2)

Publication Number Publication Date
JPWO2024048039A1 JPWO2024048039A1 (https=) 2024-03-07
JP7553747B2 true JP7553747B2 (ja) 2024-09-18

Family

ID=90099390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502553A Active JP7553747B2 (ja) 2022-08-31 2023-06-26 めっき液

Country Status (5)

Country Link
EP (1) EP4582596A1 (https=)
JP (1) JP7553747B2 (https=)
KR (1) KR20250022205A (https=)
CN (1) CN118265814A (https=)
WO (1) WO2024048039A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119081106B (zh) * 2024-08-27 2025-09-12 南昌大学 一种高压电解液添加剂及其制备方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001279228A (ja) 2000-03-31 2001-10-10 Ajinomoto Co Inc 新規なキレート剤
JP2004043957A (ja) 2002-03-05 2004-02-12 Enthone Inc 半導体用途のための電着銅における欠陥の減少
JP2005536579A (ja) 2002-06-19 2005-12-02 ビーエーエスエフ アクチェンゲゼルシャフト 金属表面及びプラスチック表面の処理用錯生成剤
CN110117801A (zh) 2019-06-21 2019-08-13 郑州知淘信息科技有限责任公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3415664B1 (en) 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
ES2800292T3 (es) 2017-11-09 2020-12-29 Atotech Deutschland Gmbh Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001279228A (ja) 2000-03-31 2001-10-10 Ajinomoto Co Inc 新規なキレート剤
JP2004043957A (ja) 2002-03-05 2004-02-12 Enthone Inc 半導体用途のための電着銅における欠陥の減少
JP2005536579A (ja) 2002-06-19 2005-12-02 ビーエーエスエフ アクチェンゲゼルシャフト 金属表面及びプラスチック表面の処理用錯生成剤
CN110117801A (zh) 2019-06-21 2019-08-13 郑州知淘信息科技有限责任公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法

Also Published As

Publication number Publication date
WO2024048039A1 (ja) 2024-03-07
EP4582596A1 (en) 2025-07-09
KR20250022205A (ko) 2025-02-14
JPWO2024048039A1 (https=) 2024-03-07
CN118265814A (zh) 2024-06-28

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