CN118265814A - 镀液 - Google Patents

镀液 Download PDF

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Publication number
CN118265814A
CN118265814A CN202380014609.1A CN202380014609A CN118265814A CN 118265814 A CN118265814 A CN 118265814A CN 202380014609 A CN202380014609 A CN 202380014609A CN 118265814 A CN118265814 A CN 118265814A
Authority
CN
China
Prior art keywords
sample
plating solution
pei compound
copper plating
pei
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380014609.1A
Other languages
English (en)
Chinese (zh)
Inventor
谷本由实
辻野峻
衣幡和男
横山千香子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCU Corp
Original Assignee
JCU Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JCU Corp filed Critical JCU Corp
Publication of CN118265814A publication Critical patent/CN118265814A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN202380014609.1A 2022-08-31 2023-06-26 镀液 Pending CN118265814A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022138480 2022-08-31
JP2022-138480 2022-08-31
PCT/JP2023/023544 WO2024048039A1 (ja) 2022-08-31 2023-06-26 めっき液

Publications (1)

Publication Number Publication Date
CN118265814A true CN118265814A (zh) 2024-06-28

Family

ID=90099390

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380014609.1A Pending CN118265814A (zh) 2022-08-31 2023-06-26 镀液

Country Status (5)

Country Link
EP (1) EP4582596A1 (https=)
JP (1) JP7553747B2 (https=)
KR (1) KR20250022205A (https=)
CN (1) CN118265814A (https=)
WO (1) WO2024048039A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119081106A (zh) * 2024-08-27 2024-12-06 南昌大学 一种高压电解液添加剂及其制备方法与应用

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001279228A (ja) * 2000-03-31 2001-10-10 Ajinomoto Co Inc 新規なキレート剤
US7316772B2 (en) * 2002-03-05 2008-01-08 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
DE10227362A1 (de) * 2002-06-19 2004-01-08 Basf Ag Komplexbildner für die Behandlung von Metall- und Kunstoffoberflächen
EP3415664B1 (en) 2017-06-16 2019-09-18 ATOTECH Deutschland GmbH Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
ES2800292T3 (es) 2017-11-09 2020-12-29 Atotech Deutschland Gmbh Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato
CN110117801B (zh) * 2019-06-21 2021-04-20 通元科技(惠州)有限公司 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119081106A (zh) * 2024-08-27 2024-12-06 南昌大学 一种高压电解液添加剂及其制备方法与应用

Also Published As

Publication number Publication date
WO2024048039A1 (ja) 2024-03-07
EP4582596A1 (en) 2025-07-09
JP7553747B2 (ja) 2024-09-18
KR20250022205A (ko) 2025-02-14
JPWO2024048039A1 (https=) 2024-03-07

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