JPWO2024048039A1 - - Google Patents
Info
- Publication number
- JPWO2024048039A1 JPWO2024048039A1 JP2024502553A JP2024502553A JPWO2024048039A1 JP WO2024048039 A1 JPWO2024048039 A1 JP WO2024048039A1 JP 2024502553 A JP2024502553 A JP 2024502553A JP 2024502553 A JP2024502553 A JP 2024502553A JP WO2024048039 A1 JPWO2024048039 A1 JP WO2024048039A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022138480 | 2022-08-31 | ||
| JP2022138480 | 2022-08-31 | ||
| PCT/JP2023/023544 WO2024048039A1 (ja) | 2022-08-31 | 2023-06-26 | めっき液 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024048039A1 true JPWO2024048039A1 (https=) | 2024-03-07 |
| JP7553747B2 JP7553747B2 (ja) | 2024-09-18 |
Family
ID=90099390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502553A Active JP7553747B2 (ja) | 2022-08-31 | 2023-06-26 | めっき液 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4582596A1 (https=) |
| JP (1) | JP7553747B2 (https=) |
| KR (1) | KR20250022205A (https=) |
| CN (1) | CN118265814A (https=) |
| WO (1) | WO2024048039A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119081106B (zh) * | 2024-08-27 | 2025-09-12 | 南昌大学 | 一种高压电解液添加剂及其制备方法与应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001279228A (ja) * | 2000-03-31 | 2001-10-10 | Ajinomoto Co Inc | 新規なキレート剤 |
| JP2004043957A (ja) * | 2002-03-05 | 2004-02-12 | Enthone Inc | 半導体用途のための電着銅における欠陥の減少 |
| JP2005536579A (ja) * | 2002-06-19 | 2005-12-02 | ビーエーエスエフ アクチェンゲゼルシャフト | 金属表面及びプラスチック表面の処理用錯生成剤 |
| CN110117801A (zh) * | 2019-06-21 | 2019-08-13 | 郑州知淘信息科技有限责任公司 | 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3415664B1 (en) | 2017-06-16 | 2019-09-18 | ATOTECH Deutschland GmbH | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating |
| ES2800292T3 (es) | 2017-11-09 | 2020-12-29 | Atotech Deutschland Gmbh | Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato |
-
2023
- 2023-06-26 JP JP2024502553A patent/JP7553747B2/ja active Active
- 2023-06-26 WO PCT/JP2023/023544 patent/WO2024048039A1/ja not_active Ceased
- 2023-06-26 EP EP23859809.8A patent/EP4582596A1/en active Pending
- 2023-06-26 KR KR1020257001322A patent/KR20250022205A/ko active Pending
- 2023-06-26 CN CN202380014609.1A patent/CN118265814A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001279228A (ja) * | 2000-03-31 | 2001-10-10 | Ajinomoto Co Inc | 新規なキレート剤 |
| JP2004043957A (ja) * | 2002-03-05 | 2004-02-12 | Enthone Inc | 半導体用途のための電着銅における欠陥の減少 |
| JP2005536579A (ja) * | 2002-06-19 | 2005-12-02 | ビーエーエスエフ アクチェンゲゼルシャフト | 金属表面及びプラスチック表面の処理用錯生成剤 |
| CN110117801A (zh) * | 2019-06-21 | 2019-08-13 | 郑州知淘信息科技有限责任公司 | 一种印制电路板盲孔填铜用镀铜添加剂及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024048039A1 (ja) | 2024-03-07 |
| EP4582596A1 (en) | 2025-07-09 |
| JP7553747B2 (ja) | 2024-09-18 |
| KR20250022205A (ko) | 2025-02-14 |
| CN118265814A (zh) | 2024-06-28 |
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