KR20250006078A - 연마제 및 연마 방법 - Google Patents

연마제 및 연마 방법 Download PDF

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Publication number
KR20250006078A
KR20250006078A KR1020247036689A KR20247036689A KR20250006078A KR 20250006078 A KR20250006078 A KR 20250006078A KR 1020247036689 A KR1020247036689 A KR 1020247036689A KR 20247036689 A KR20247036689 A KR 20247036689A KR 20250006078 A KR20250006078 A KR 20250006078A
Authority
KR
South Korea
Prior art keywords
abrasive
mass
polishing
less
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247036689A
Other languages
English (en)
Korean (ko)
Inventor
마사유키 하나노
준페이 가와키타
고지 하가
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250006078A publication Critical patent/KR20250006078A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020247036689A 2022-04-20 2022-04-20 연마제 및 연마 방법 Pending KR20250006078A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018286 WO2023203680A1 (ja) 2022-04-20 2022-04-20 研磨剤及び研磨方法

Publications (1)

Publication Number Publication Date
KR20250006078A true KR20250006078A (ko) 2025-01-10

Family

ID=88419450

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247036689A Pending KR20250006078A (ko) 2022-04-20 2022-04-20 연마제 및 연마 방법

Country Status (6)

Country Link
US (1) US20250188315A1 (https=)
EP (1) EP4495204A4 (https=)
JP (1) JPWO2023203680A1 (https=)
KR (1) KR20250006078A (https=)
CN (1) CN119032149A (https=)
WO (1) WO2023203680A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009526659A (ja) 2006-02-14 2009-07-23 キャボット マイクロエレクトロニクス コーポレイション インジウム錫酸化物表面をｃｍｐする組成物及び方法
JP2010114411A (ja) 2008-11-06 2010-05-20 Samsung Electro-Mechanics Co Ltd 化合物半導体発光素子及びその製造方法
JP2018125538A (ja) 2018-02-20 2018-08-09 ソニー株式会社 受光素子、撮像素子及び撮像装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3957924B2 (ja) * 1999-06-28 2007-08-15 株式会社東芝 Ｃｍｐ研磨方法
JP2007154176A (ja) * 2005-11-11 2007-06-21 Hitachi Chem Co Ltd Ｉｔｏ膜研磨用研磨液及び基板の研磨方法
US9631122B1 (en) * 2015-10-28 2017-04-25 Cabot Microelectronics Corporation Tungsten-processing slurry with cationic surfactant
KR20200032601A (ko) * 2018-09-18 2020-03-26 주식회사 케이씨텍 연마용 슬러리 조성물
KR20200032602A (ko) * 2018-09-18 2020-03-26 주식회사 케이씨텍 연마용 슬러리 조성물
KR102185042B1 (ko) * 2018-11-27 2020-12-01 주식회사 케이씨텍 연마용 슬러리 조성물
US10676647B1 (en) * 2018-12-31 2020-06-09 Cabot Microelectronics Corporation Composition for tungsten CMP
KR20210052694A (ko) * 2019-10-30 2021-05-11 삼성전자주식회사 Ito막 연마용 cmp 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009526659A (ja) 2006-02-14 2009-07-23 キャボット マイクロエレクトロニクス コーポレイション インジウム錫酸化物表面をｃｍｐする組成物及び方法
JP2010114411A (ja) 2008-11-06 2010-05-20 Samsung Electro-Mechanics Co Ltd 化合物半導体発光素子及びその製造方法
JP2018125538A (ja) 2018-02-20 2018-08-09 ソニー株式会社 受光素子、撮像素子及び撮像装置

Also Published As

Publication number Publication date
WO2023203680A1 (ja) 2023-10-26
EP4495204A4 (en) 2025-04-23
EP4495204A1 (en) 2025-01-22
CN119032149A (zh) 2024-11-26
JPWO2023203680A1 (https=) 2023-10-26
US20250188315A1 (en) 2025-06-12

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