JPWO2023203680A1 - - Google Patents
Info
- Publication number
- JPWO2023203680A1 JPWO2023203680A1 JP2024515813A JP2024515813A JPWO2023203680A1 JP WO2023203680 A1 JPWO2023203680 A1 JP WO2023203680A1 JP 2024515813 A JP2024515813 A JP 2024515813A JP 2024515813 A JP2024515813 A JP 2024515813A JP WO2023203680 A1 JPWO2023203680 A1 JP WO2023203680A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/018286 WO2023203680A1 (ja) | 2022-04-20 | 2022-04-20 | 研磨剤及び研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023203680A1 true JPWO2023203680A1 (https=) | 2023-10-26 |
Family
ID=88419450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024515813A Pending JPWO2023203680A1 (https=) | 2022-04-20 | 2022-04-20 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250188315A1 (https=) |
| EP (1) | EP4495204A4 (https=) |
| JP (1) | JPWO2023203680A1 (https=) |
| KR (1) | KR20250006078A (https=) |
| CN (1) | CN119032149A (https=) |
| WO (1) | WO2023203680A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3957924B2 (ja) * | 1999-06-28 | 2007-08-15 | 株式会社東芝 | Ｃｍｐ研磨方法 |
| JP2007154176A (ja) * | 2005-11-11 | 2007-06-21 | Hitachi Chem Co Ltd | Ｉｔｏ膜研磨用研磨液及び基板の研磨方法 |
| TWI341325B (en) | 2006-02-14 | 2011-05-01 | Cabot Microelectronics Corp | Compositions and methods for cmp of indium tin oxide surfaces |
| KR101004858B1 (ko) | 2008-11-06 | 2010-12-28 | 삼성엘이디 주식회사 | 화합물 반도체 발광 소자 및 그 제조방법 |
| US9631122B1 (en) * | 2015-10-28 | 2017-04-25 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant |
| JP6642599B2 (ja) | 2018-02-20 | 2020-02-05 | ソニー株式会社 | 受光素子、撮像素子及び撮像装置 |
| KR20200032601A (ko) * | 2018-09-18 | 2020-03-26 | 주식회사 케이씨텍 | 연마용 슬러리 조성물 |
| KR20200032602A (ko) * | 2018-09-18 | 2020-03-26 | 주식회사 케이씨텍 | 연마용 슬러리 조성물 |
| KR102185042B1 (ko) * | 2018-11-27 | 2020-12-01 | 주식회사 케이씨텍 | 연마용 슬러리 조성물 |
| US10676647B1 (en) * | 2018-12-31 | 2020-06-09 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| KR20210052694A (ko) * | 2019-10-30 | 2021-05-11 | 삼성전자주식회사 | Ito막 연마용 cmp 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법 |
-
2022
- 2022-04-20 JP JP2024515813A patent/JPWO2023203680A1/ja active Pending
- 2022-04-20 WO PCT/JP2022/018286 patent/WO2023203680A1/ja not_active Ceased
- 2022-04-20 CN CN202280094962.0A patent/CN119032149A/zh active Pending
- 2022-04-20 EP EP22938483.9A patent/EP4495204A4/en active Pending
- 2022-04-20 US US18/856,427 patent/US20250188315A1/en active Pending
- 2022-04-20 KR KR1020247036689A patent/KR20250006078A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023203680A1 (ja) | 2023-10-26 |
| EP4495204A4 (en) | 2025-04-23 |
| EP4495204A1 (en) | 2025-01-22 |
| CN119032149A (zh) | 2024-11-26 |
| US20250188315A1 (en) | 2025-06-12 |
| KR20250006078A (ko) | 2025-01-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250206 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260414 |