KR20240127396A - 플렉서블 센서 및 플렉서블 센서의 제조 방법 - Google Patents
플렉서블 센서 및 플렉서블 센서의 제조 방법 Download PDFInfo
- Publication number
- KR20240127396A KR20240127396A KR1020247024154A KR20247024154A KR20240127396A KR 20240127396 A KR20240127396 A KR 20240127396A KR 1020247024154 A KR1020247024154 A KR 1020247024154A KR 20247024154 A KR20247024154 A KR 20247024154A KR 20240127396 A KR20240127396 A KR 20240127396A
- Authority
- KR
- South Korea
- Prior art keywords
- support substrate
- flexible sensor
- variable resistance
- adhesive layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/225—Measuring circuits therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N79/00—Integrated devices, or assemblies of multiple devices, comprising at least one solid-state element covered by group H10N70/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2022-009277 | 2022-01-25 | ||
| JP2022009277 | 2022-01-25 | ||
| PCT/JP2022/043157 WO2023145220A1 (ja) | 2022-01-25 | 2022-11-22 | フレキシブルセンサ及びフレキシブルセンサの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240127396A true KR20240127396A (ko) | 2024-08-22 |
Family
ID=87471416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247024154A Pending KR20240127396A (ko) | 2022-01-25 | 2022-11-22 | 플렉서블 센서 및 플렉서블 센서의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240377180A1 (https=) |
| JP (1) | JPWO2023145220A1 (https=) |
| KR (1) | KR20240127396A (https=) |
| CN (1) | CN118575064A (https=) |
| WO (1) | WO2023145220A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11241903A (ja) | 1997-12-26 | 1999-09-07 | Toyoaki Kimura | 導電性粒子―高分子系による歪みセンサ― |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758234B2 (ja) * | 1992-04-16 | 1995-06-21 | 株式会社エニックス | 半導体マトリクス型微細面圧分布センサ |
| JP2003203523A (ja) * | 2002-01-08 | 2003-07-18 | Fujikura Ltd | 導電ペースト |
| US20050110767A1 (en) * | 2003-11-24 | 2005-05-26 | Elo Touchsystems, Inc. | Method of manufacturing touch sensor with switch tape strips |
| JP2005283329A (ja) * | 2004-03-30 | 2005-10-13 | Sanyo Electric Co Ltd | 感圧センサーパネルの製造方法 |
| JP2014228454A (ja) * | 2013-05-24 | 2014-12-08 | 株式会社フジクラ | 圧力センサ |
| JP6274029B2 (ja) * | 2014-06-18 | 2018-02-07 | 大日本印刷株式会社 | 圧力センサ装置およびその製造方法 |
| JP6358081B2 (ja) * | 2014-12-25 | 2018-07-18 | 大日本印刷株式会社 | 圧力センサ |
| JP6198804B2 (ja) * | 2015-12-01 | 2017-09-20 | 日本写真印刷株式会社 | 多点計測用のひずみセンサとその製造方法 |
| JP6912170B2 (ja) * | 2016-09-14 | 2021-07-28 | エルジー ディスプレイ カンパニー リミテッド | 接触検知装置及びその駆動方法 |
| KR102772195B1 (ko) * | 2017-02-28 | 2025-02-26 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| JP2018189583A (ja) * | 2017-05-10 | 2018-11-29 | 大日本印刷株式会社 | 圧力センサ装置 |
| US11243126B2 (en) * | 2017-07-27 | 2022-02-08 | Nextinput, Inc. | Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture |
| JP2020085613A (ja) * | 2018-11-22 | 2020-06-04 | ムネカタインダストリアルマシナリー株式会社 | 歪みセンサアレイおよびその製造方法 |
| JP7367932B2 (ja) * | 2020-01-23 | 2023-10-24 | 大日本印刷株式会社 | センサモジュール |
| JP7567196B2 (ja) * | 2020-04-20 | 2024-10-16 | Toppanホールディングス株式会社 | 圧力センサおよび圧力センサアレイ |
| CN111883556B (zh) * | 2020-07-13 | 2022-11-25 | 浙江清华柔性电子技术研究院 | 柔性触觉传感器及其制备方法 |
| CN112284581B (zh) * | 2020-10-27 | 2022-04-15 | 湖北长江新型显示产业创新中心有限公司 | 一种传感器、显示面板及电子设备 |
-
2022
- 2022-11-22 WO PCT/JP2022/043157 patent/WO2023145220A1/ja not_active Ceased
- 2022-11-22 JP JP2023576648A patent/JPWO2023145220A1/ja active Pending
- 2022-11-22 KR KR1020247024154A patent/KR20240127396A/ko active Pending
- 2022-11-22 CN CN202280089744.8A patent/CN118575064A/zh active Pending
-
2024
- 2024-07-22 US US18/779,202 patent/US20240377180A1/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11241903A (ja) | 1997-12-26 | 1999-09-07 | Toyoaki Kimura | 導電性粒子―高分子系による歪みセンサ― |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023145220A1 (https=) | 2023-08-03 |
| WO2023145220A1 (ja) | 2023-08-03 |
| US20240377180A1 (en) | 2024-11-14 |
| CN118575064A (zh) | 2024-08-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-3-3-R10-R15-oth-X000 |
|
| R16-X000 | Change to inventor recorded |
St.27 status event code: A-3-3-R10-R16-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| R11 | Change to the name of applicant or owner or transfer of ownership requested |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R11-ASN-PN2301 (AS PROVIDED BY THE NATIONAL OFFICE) |