CN118575064A - 柔性传感器以及柔性传感器的制造方法 - Google Patents

柔性传感器以及柔性传感器的制造方法 Download PDF

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Publication number
CN118575064A
CN118575064A CN202280089744.8A CN202280089744A CN118575064A CN 118575064 A CN118575064 A CN 118575064A CN 202280089744 A CN202280089744 A CN 202280089744A CN 118575064 A CN118575064 A CN 118575064A
Authority
CN
China
Prior art keywords
support substrate
flexible sensor
main substrate
adhesive layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280089744.8A
Other languages
English (en)
Chinese (zh)
Inventor
金泽周介
板垣元士
小泉翔平
鬼头义昭
幡山胜弘
沈昌勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
National Institute of Advanced Industrial Science and Technology AIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp, National Institute of Advanced Industrial Science and Technology AIST filed Critical Nikon Corp
Publication of CN118575064A publication Critical patent/CN118575064A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N79/00—Integrated devices, or assemblies of multiple devices, comprising at least one solid-state element covered by group H10N70/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
CN202280089744.8A 2022-01-25 2022-11-22 柔性传感器以及柔性传感器的制造方法 Pending CN118575064A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022009277 2022-01-25
JP2022-009277 2022-01-25
PCT/JP2022/043157 WO2023145220A1 (ja) 2022-01-25 2022-11-22 フレキシブルセンサ及びフレキシブルセンサの製造方法

Publications (1)

Publication Number Publication Date
CN118575064A true CN118575064A (zh) 2024-08-30

Family

ID=87471416

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280089744.8A Pending CN118575064A (zh) 2022-01-25 2022-11-22 柔性传感器以及柔性传感器的制造方法

Country Status (5)

Country Link
US (1) US20240377180A1 (https=)
JP (1) JPWO2023145220A1 (https=)
KR (1) KR20240127396A (https=)
CN (1) CN118575064A (https=)
WO (1) WO2023145220A1 (https=)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758234B2 (ja) * 1992-04-16 1995-06-21 株式会社エニックス 半導体マトリクス型微細面圧分布センサ
JP3418561B2 (ja) 1997-12-26 2003-06-23 豊明 木村 導電性粒子−高分子系による歪みセンサー
JP2003203523A (ja) * 2002-01-08 2003-07-18 Fujikura Ltd 導電ペースト
US20050110767A1 (en) * 2003-11-24 2005-05-26 Elo Touchsystems, Inc. Method of manufacturing touch sensor with switch tape strips
JP2005283329A (ja) * 2004-03-30 2005-10-13 Sanyo Electric Co Ltd 感圧センサーパネルの製造方法
JP2014228454A (ja) * 2013-05-24 2014-12-08 株式会社フジクラ 圧力センサ
JP6274029B2 (ja) * 2014-06-18 2018-02-07 大日本印刷株式会社 圧力センサ装置およびその製造方法
JP6358081B2 (ja) * 2014-12-25 2018-07-18 大日本印刷株式会社 圧力センサ
JP6198804B2 (ja) * 2015-12-01 2017-09-20 日本写真印刷株式会社 多点計測用のひずみセンサとその製造方法
JP6912170B2 (ja) * 2016-09-14 2021-07-28 エルジー ディスプレイ カンパニー リミテッド 接触検知装置及びその駆動方法
KR102772195B1 (ko) * 2017-02-28 2025-02-26 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
JP2018189583A (ja) * 2017-05-10 2018-11-29 大日本印刷株式会社 圧力センサ装置
US11243126B2 (en) * 2017-07-27 2022-02-08 Nextinput, Inc. Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
JP2020085613A (ja) * 2018-11-22 2020-06-04 ムネカタインダストリアルマシナリー株式会社 歪みセンサアレイおよびその製造方法
JP7367932B2 (ja) * 2020-01-23 2023-10-24 大日本印刷株式会社 センサモジュール
JP7567196B2 (ja) * 2020-04-20 2024-10-16 Ｔｏｐｐａｎホールディングス株式会社 圧力センサおよび圧力センサアレイ
CN111883556B (zh) * 2020-07-13 2022-11-25 浙江清华柔性电子技术研究院 柔性触觉传感器及其制备方法
CN112284581B (zh) * 2020-10-27 2022-04-15 湖北长江新型显示产业创新中心有限公司 一种传感器、显示面板及电子设备

Also Published As

Publication number Publication date
JPWO2023145220A1 (https=) 2023-08-03
WO2023145220A1 (ja) 2023-08-03
KR20240127396A (ko) 2024-08-22
US20240377180A1 (en) 2024-11-14

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Effective date of registration: 20251121

Address after: Tokyo, Japan

Applicant after: Nikon

Country or region after: Japan

Address before: Tokyo, Japan

Applicant before: National Research and Development Corporation Industrial Technology Comprehensive Research Institute

Country or region before: Japan

Applicant before: Nikon

TA01 Transfer of patent application right