JPWO2023145220A1 - - Google Patents

Info

Publication number
JPWO2023145220A1
JPWO2023145220A1 JP2023576648A JP2023576648A JPWO2023145220A1 JP WO2023145220 A1 JPWO2023145220 A1 JP WO2023145220A1 JP 2023576648 A JP2023576648 A JP 2023576648A JP 2023576648 A JP2023576648 A JP 2023576648A JP WO2023145220 A1 JPWO2023145220 A1 JP WO2023145220A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023576648A
Other languages
Japanese (ja)
Other versions
JPWO2023145220A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023145220A1 publication Critical patent/JPWO2023145220A1/ja
Publication of JPWO2023145220A5 publication Critical patent/JPWO2023145220A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/225—Measuring circuits therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N79/00—Integrated devices, or assemblies of multiple devices, comprising at least one solid-state element covered by group H10N70/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2206—Special supports with preselected places to mount the resistance strain gauges; Mounting of supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP2023576648A 2022-01-25 2022-11-22 Pending JPWO2023145220A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022009277 2022-01-25
PCT/JP2022/043157 WO2023145220A1 (ja) 2022-01-25 2022-11-22 フレキシブルセンサ及びフレキシブルセンサの製造方法

Publications (2)

Publication Number Publication Date
JPWO2023145220A1 true JPWO2023145220A1 (https=) 2023-08-03
JPWO2023145220A5 JPWO2023145220A5 (https=) 2024-10-02

Family

ID=87471416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576648A Pending JPWO2023145220A1 (https=) 2022-01-25 2022-11-22

Country Status (5)

Country Link
US (1) US20240377180A1 (https=)
JP (1) JPWO2023145220A1 (https=)
KR (1) KR20240127396A (https=)
CN (1) CN118575064A (https=)
WO (1) WO2023145220A1 (https=)

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06288845A (ja) * 1992-04-16 1994-10-18 Enitsukusu:Kk 半導体マトリクス型微細面圧分布センサ
JP2003203523A (ja) * 2002-01-08 2003-07-18 Fujikura Ltd 導電ペースト
US20050110767A1 (en) * 2003-11-24 2005-05-26 Elo Touchsystems, Inc. Method of manufacturing touch sensor with switch tape strips
JP2005283329A (ja) * 2004-03-30 2005-10-13 Sanyo Electric Co Ltd 感圧センサーパネルの製造方法
JP2014228454A (ja) * 2013-05-24 2014-12-08 株式会社フジクラ 圧力センサ
JP2016004940A (ja) * 2014-06-18 2016-01-12 大日本印刷株式会社 圧力センサ装置およびその製造方法
JP2016121974A (ja) * 2014-12-25 2016-07-07 大日本印刷株式会社 圧力センサ
JP2017101982A (ja) * 2015-12-01 2017-06-08 日本写真印刷株式会社 多点計測用のひずみセンサとその製造方法
JP2018044837A (ja) * 2016-09-14 2018-03-22 エルジー ディスプレイ カンパニー リミテッド 接触検知装置及びその駆動方法
US20180247994A1 (en) * 2017-02-28 2018-08-30 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
JP2018189583A (ja) * 2017-05-10 2018-11-29 大日本印刷株式会社 圧力センサ装置
JP2020085613A (ja) * 2018-11-22 2020-06-04 ムネカタインダストリアルマシナリー株式会社 歪みセンサアレイおよびその製造方法
CN111883556A (zh) * 2020-07-13 2020-11-03 浙江清华柔性电子技术研究院 柔性触觉传感器及其制备方法
US20200378845A1 (en) * 2017-07-27 2020-12-03 Nextiput, Inc. Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
US20210143232A1 (en) * 2020-10-27 2021-05-13 Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. Sensor, display panel and electronic device
JP2021117032A (ja) * 2020-01-23 2021-08-10 大日本印刷株式会社 センサモジュール
JP2021174809A (ja) * 2020-04-20 2021-11-01 凸版印刷株式会社 圧力センサおよび圧力センサアレイ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3418561B2 (ja) 1997-12-26 2003-06-23 豊明 木村 導電性粒子−高分子系による歪みセンサー

Patent Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06288845A (ja) * 1992-04-16 1994-10-18 Enitsukusu:Kk 半導体マトリクス型微細面圧分布センサ
JP2003203523A (ja) * 2002-01-08 2003-07-18 Fujikura Ltd 導電ペースト
US20050110767A1 (en) * 2003-11-24 2005-05-26 Elo Touchsystems, Inc. Method of manufacturing touch sensor with switch tape strips
JP2005283329A (ja) * 2004-03-30 2005-10-13 Sanyo Electric Co Ltd 感圧センサーパネルの製造方法
JP2014228454A (ja) * 2013-05-24 2014-12-08 株式会社フジクラ 圧力センサ
JP2016004940A (ja) * 2014-06-18 2016-01-12 大日本印刷株式会社 圧力センサ装置およびその製造方法
JP2016121974A (ja) * 2014-12-25 2016-07-07 大日本印刷株式会社 圧力センサ
JP2017101982A (ja) * 2015-12-01 2017-06-08 日本写真印刷株式会社 多点計測用のひずみセンサとその製造方法
JP2018044837A (ja) * 2016-09-14 2018-03-22 エルジー ディスプレイ カンパニー リミテッド 接触検知装置及びその駆動方法
US20180247994A1 (en) * 2017-02-28 2018-08-30 Samsung Display Co., Ltd. Display apparatus and method of manufacturing the same
JP2018189583A (ja) * 2017-05-10 2018-11-29 大日本印刷株式会社 圧力センサ装置
US20200378845A1 (en) * 2017-07-27 2020-12-03 Nextiput, Inc. Wafer bonded piezoresistive and piezoelectric force sensor and related methods of manufacture
JP2020085613A (ja) * 2018-11-22 2020-06-04 ムネカタインダストリアルマシナリー株式会社 歪みセンサアレイおよびその製造方法
JP2021117032A (ja) * 2020-01-23 2021-08-10 大日本印刷株式会社 センサモジュール
JP2021174809A (ja) * 2020-04-20 2021-11-01 凸版印刷株式会社 圧力センサおよび圧力センサアレイ
CN111883556A (zh) * 2020-07-13 2020-11-03 浙江清华柔性电子技术研究院 柔性触觉传感器及其制备方法
US20210143232A1 (en) * 2020-10-27 2021-05-13 Hubei Yangtze Industrial Innovation Center of Advanced Display Co., Ltd. Sensor, display panel and electronic device

Also Published As

Publication number Publication date
WO2023145220A1 (ja) 2023-08-03
KR20240127396A (ko) 2024-08-22
US20240377180A1 (en) 2024-11-14
CN118575064A (zh) 2024-08-30

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