KR20240100348A - 수지 경화제, 경화성 수지 조성물, 경화물, 전자 디바이스, 적층판 재료, 전자부품 실링재, 에스테르 화합물, 에스테르 화합물의 제조방법 및 노볼락 수지의 제조방법 - Google Patents

수지 경화제, 경화성 수지 조성물, 경화물, 전자 디바이스, 적층판 재료, 전자부품 실링재, 에스테르 화합물, 에스테르 화합물의 제조방법 및 노볼락 수지의 제조방법 Download PDF

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Publication number
KR20240100348A
KR20240100348A KR1020247012869A KR20247012869A KR20240100348A KR 20240100348 A KR20240100348 A KR 20240100348A KR 1020247012869 A KR1020247012869 A KR 1020247012869A KR 20247012869 A KR20247012869 A KR 20247012869A KR 20240100348 A KR20240100348 A KR 20240100348A
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KR
South Korea
Prior art keywords
group
ester compound
general formula
resin
acid
Prior art date
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Pending
Application number
KR1020247012869A
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English (en)
Korean (ko)
Inventor
겐스케 히로타키
게이지로 세키
히로카쓰 나구라
겐지 호소이
Original Assignee
샌트랄 글래스 컴퍼니 리미티드
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Publication of KR20240100348A publication Critical patent/KR20240100348A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C67/00—Preparation of carboxylic acid esters
    • C07C67/14—Preparation of carboxylic acid esters from carboxylic acid halides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/003—Esters of saturated alcohols having the esterified hydroxy group bound to an acyclic carbon atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/017—Esters of hydroxy compounds having the esterified hydroxy group bound to a carbon atom of a six-membered aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/76—Esters of carboxylic acids having a carboxyl group bound to a carbon atom of a six-membered aromatic ring
    • C07C69/78—Benzoic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28—Chemically modified polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1020247012869A 2021-11-04 2022-10-28 수지 경화제, 경화성 수지 조성물, 경화물, 전자 디바이스, 적층판 재료, 전자부품 실링재, 에스테르 화합물, 에스테르 화합물의 제조방법 및 노볼락 수지의 제조방법 Pending KR20240100348A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021180602 2021-11-04
JPJP-P-2021-180602 2021-11-04
PCT/JP2022/040363 WO2023080072A1 (ja) 2021-11-04 2022-10-28 樹脂硬化剤、硬化性樹脂組成物、硬化物、電子デバイス、積層板材料、電子部品封止材、エステル化合物、エステル化合物の製造方法およびノボラック樹脂の製造方法

Publications (1)

Publication Number Publication Date
KR20240100348A true KR20240100348A (ko) 2024-07-01

Family

ID=86241120

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247012869A Pending KR20240100348A (ko) 2021-11-04 2022-10-28 수지 경화제, 경화성 수지 조성물, 경화물, 전자 디바이스, 적층판 재료, 전자부품 실링재, 에스테르 화합물, 에스테르 화합물의 제조방법 및 노볼락 수지의 제조방법

Country Status (5)

Country Link
JP (1) JPWO2023080072A1 (enrdf_load_stackoverflow)
KR (1) KR20240100348A (enrdf_load_stackoverflow)
CN (1) CN118076662A (enrdf_load_stackoverflow)
TW (1) TW202328043A (enrdf_load_stackoverflow)
WO (1) WO2023080072A1 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021059738A (ja) 2017-05-12 2021-04-15 Dic株式会社 活性エステル化合物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013159638A (ja) * 2012-02-01 2013-08-19 Toyo Ink Sc Holdings Co Ltd フッ素含有変性エステル樹脂を含む熱硬化性樹脂組成物
US12098238B2 (en) * 2020-02-28 2024-09-24 Central Glass Company, Limited Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin
KR20220158809A (ko) * 2020-03-27 2022-12-01 샌트랄 글래스 컴퍼니 리미티드 노볼락 수지, 에폭시 수지, 감광성 수지 조성물, 경화성 수지 조성물, 경화물, 전자 디바이스, 노볼락 수지의 제조 방법 및 에폭시 수지의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021059738A (ja) 2017-05-12 2021-04-15 Dic株式会社 活性エステル化合物

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Publication number Publication date
TW202328043A (zh) 2023-07-16
WO2023080072A1 (ja) 2023-05-11
JPWO2023080072A1 (enrdf_load_stackoverflow) 2023-05-11
CN118076662A (zh) 2024-05-24

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