KR20240088682A - 수지 조성물 및 그 경화물 및 그것을 사용한 적층체, 정전 척 및 플라즈마 처리 장치 - Google Patents
수지 조성물 및 그 경화물 및 그것을 사용한 적층체, 정전 척 및 플라즈마 처리 장치 Download PDFInfo
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- KR20240088682A KR20240088682A KR1020247006352A KR20247006352A KR20240088682A KR 20240088682 A KR20240088682 A KR 20240088682A KR 1020247006352 A KR1020247006352 A KR 1020247006352A KR 20247006352 A KR20247006352 A KR 20247006352A KR 20240088682 A KR20240088682 A KR 20240088682A
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- polyimide
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- C08K7/16—Solid spheres
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
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- C08K3/00—Use of inorganic substances as compounding ingredients
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- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
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- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
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- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
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- C08K2201/00—Specific properties of additives
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- C08L2203/00—Applications
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021170659 | 2021-10-19 | ||
| JPJP-P-2021-170659 | 2021-10-19 | ||
| PCT/JP2022/037230 WO2023068044A1 (ja) | 2021-10-19 | 2022-10-05 | 樹脂組成物およびその硬化物ならびにそれを用いた積層体、静電チャックおよびプラズマ処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240088682A true KR20240088682A (ko) | 2024-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247006352A Pending KR20240088682A (ko) | 2021-10-19 | 2022-10-05 | 수지 조성물 및 그 경화물 및 그것을 사용한 적층체, 정전 척 및 플라즈마 처리 장치 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240400825A1 (https=) |
| JP (1) | JPWO2023068044A1 (https=) |
| KR (1) | KR20240088682A (https=) |
| CN (1) | CN118119667A (https=) |
| TW (1) | TW202317706A (https=) |
| WO (1) | WO2023068044A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024062923A1 (https=) * | 2022-09-21 | 2024-03-28 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011151280A (ja) | 2010-01-25 | 2011-08-04 | Denki Kagaku Kogyo Kk | 放熱部材及びその製造方法 |
| JP6621882B2 (ja) | 2018-08-08 | 2019-12-18 | 東京エレクトロン株式会社 | エッチング装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5935372A (en) * | 1997-04-29 | 1999-08-10 | Occidental Chemical Corporation | Adhesive sealant for bonding metal parts to ceramics |
| JP4959778B2 (ja) * | 2009-12-10 | 2012-06-27 | 信越化学工業株式会社 | 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート |
| JP6065438B2 (ja) * | 2012-07-25 | 2017-01-25 | 日立化成株式会社 | プリプレグ、これを用いた積層板及び多層プリント配線板 |
| JP6816551B2 (ja) * | 2017-02-17 | 2021-01-20 | 昭和電工マテリアルズ株式会社 | コアレス基板用熱硬化性樹脂組成物、コアレス基板用プリプレグ、コアレス基板、コアレス基板の製造方法及び半導体パッケージ |
| JP7352173B2 (ja) * | 2019-12-10 | 2023-09-28 | 東レ株式会社 | 組成物、硬化物、多層シート、放熱部品、並びに電子部品 |
| US12217994B2 (en) * | 2020-03-26 | 2025-02-04 | Tomoegawa Corporation | Electrostatic chuck device and sleeve for electrostatic chuck device |
-
2022
- 2022-10-05 US US18/699,619 patent/US20240400825A1/en active Pending
- 2022-10-05 KR KR1020247006352A patent/KR20240088682A/ko active Pending
- 2022-10-05 WO PCT/JP2022/037230 patent/WO2023068044A1/ja not_active Ceased
- 2022-10-05 JP JP2022562652A patent/JPWO2023068044A1/ja active Pending
- 2022-10-05 CN CN202280070009.2A patent/CN118119667A/zh active Pending
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011151280A (ja) | 2010-01-25 | 2011-08-04 | Denki Kagaku Kogyo Kk | 放熱部材及びその製造方法 |
| JP6621882B2 (ja) | 2018-08-08 | 2019-12-18 | 東京エレクトロン株式会社 | エッチング装置 |
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| Publication number | Publication date |
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| TW202317706A (zh) | 2023-05-01 |
| WO2023068044A1 (ja) | 2023-04-27 |
| JPWO2023068044A1 (https=) | 2023-04-27 |
| CN118119667A (zh) | 2024-05-31 |
| US20240400825A1 (en) | 2024-12-05 |
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