CN118119667A - 树脂组合物及其固化物以及使用了该固化物的叠层体、静电卡盘和等离子体处理装置 - Google Patents

树脂组合物及其固化物以及使用了该固化物的叠层体、静电卡盘和等离子体处理装置 Download PDF

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Publication number
CN118119667A
CN118119667A CN202280070009.2A CN202280070009A CN118119667A CN 118119667 A CN118119667 A CN 118119667A CN 202280070009 A CN202280070009 A CN 202280070009A CN 118119667 A CN118119667 A CN 118119667A
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resin composition
group
thermally conductive
conductive filler
polyimide
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CN202280070009.2A
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Chinese (zh)
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岛田彰
木口一也
酒部庸平
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Toray Industries Inc
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Toray Industries Inc
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CN202280070009.2A 2021-10-19 2022-10-05 树脂组合物及其固化物以及使用了该固化物的叠层体、静电卡盘和等离子体处理装置 Pending CN118119667A (zh)

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JP2021170659 2021-10-19
JP2021-170659 2021-10-19
PCT/JP2022/037230 WO2023068044A1 (ja) 2021-10-19 2022-10-05 樹脂組成物およびその硬化物ならびにそれを用いた積層体、静電チャックおよびプラズマ処理装置

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CN118119667A true CN118119667A (zh) 2024-05-31

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US (1) US20240400825A1 (https=)
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