TW202317706A - 樹脂組成物及其硬化物以及使用其的積層體、靜電吸盤及電漿處理裝置 - Google Patents

樹脂組成物及其硬化物以及使用其的積層體、靜電吸盤及電漿處理裝置 Download PDF

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Publication number
TW202317706A
TW202317706A TW111138929A TW111138929A TW202317706A TW 202317706 A TW202317706 A TW 202317706A TW 111138929 A TW111138929 A TW 111138929A TW 111138929 A TW111138929 A TW 111138929A TW 202317706 A TW202317706 A TW 202317706A
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Taiwan
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resin composition
polyimide
thermally conductive
conductive filler
group
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TW111138929A
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English (en)
Chinese (zh)
Inventor
嶋田彰
木口一也
酒部庸平
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日商東麗股份有限公司
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Publication of TW202317706A publication Critical patent/TW202317706A/zh

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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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TW111138929A 2021-10-19 2022-10-14 樹脂組成物及其硬化物以及使用其的積層體、靜電吸盤及電漿處理裝置 TW202317706A (zh)

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US (1) US20240400825A1 (https=)
JP (1) JPWO2023068044A1 (https=)
KR (1) KR20240088682A (https=)
CN (1) CN118119667A (https=)
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US5935372A (en) * 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
JP4959778B2 (ja) * 2009-12-10 2012-06-27 信越化学工業株式会社 光硬化性樹脂組成物、該組成物を用いたフィルム状接着剤及び接着シート
JP5422413B2 (ja) 2010-01-25 2014-02-19 電気化学工業株式会社 放熱部材及びその製造方法
JP6065438B2 (ja) * 2012-07-25 2017-01-25 日立化成株式会社 プリプレグ、これを用いた積層板及び多層プリント配線板
JP6816551B2 (ja) * 2017-02-17 2021-01-20 昭和電工マテリアルズ株式会社 コアレス基板用熱硬化性樹脂組成物、コアレス基板用プリプレグ、コアレス基板、コアレス基板の製造方法及び半導体パッケージ
JP6621882B2 (ja) 2018-08-08 2019-12-18 東京エレクトロン株式会社 エッチング装置
JP7352173B2 (ja) * 2019-12-10 2023-09-28 東レ株式会社 組成物、硬化物、多層シート、放熱部品、並びに電子部品
US12217994B2 (en) * 2020-03-26 2025-02-04 Tomoegawa Corporation Electrostatic chuck device and sleeve for electrostatic chuck device

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