KR20240056584A - 레지스트 하층막 형성 조성물 - Google Patents
레지스트 하층막 형성 조성물 Download PDFInfo
- Publication number
- KR20240056584A KR20240056584A KR1020247011587A KR20247011587A KR20240056584A KR 20240056584 A KR20240056584 A KR 20240056584A KR 1020247011587 A KR1020247011587 A KR 1020247011587A KR 20247011587 A KR20247011587 A KR 20247011587A KR 20240056584 A KR20240056584 A KR 20240056584A
- Authority
- KR
- South Korea
- Prior art keywords
- underlayer film
- resist underlayer
- resist
- formula
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H01L21/0271—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
- H10P76/2041—Photolithographic processes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-148885 | 2021-09-13 | ||
| JP2021148885 | 2021-09-13 | ||
| PCT/JP2022/032852 WO2023037949A1 (ja) | 2021-09-13 | 2022-08-31 | レジスト下層膜形成組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240056584A true KR20240056584A (ko) | 2024-04-30 |
Family
ID=85506686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247011587A Pending KR20240056584A (ko) | 2021-09-13 | 2022-08-31 | 레지스트 하층막 형성 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240377748A1 (https=) |
| JP (1) | JPWO2023037949A1 (https=) |
| KR (1) | KR20240056584A (https=) |
| CN (1) | CN118215887A (https=) |
| TW (1) | TW202328817A (https=) |
| WO (1) | WO2023037949A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2022075339A1 (https=) * | 2020-10-07 | 2022-04-14 | ||
| KR20240101079A (ko) * | 2022-12-23 | 2024-07-02 | 삼성전자주식회사 | 반도체 포토레지스트용 조성물 및 이를 이용한 패턴 형성 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005526270A (ja) | 2002-02-11 | 2005-09-02 | ブルーワー サイエンス アイ エヌ シー. | ハロゲン化反射防止膜 |
| KR20060003850A (ko) | 2005-12-27 | 2006-01-11 | 한국유지관리 주식회사 | 미세조정이 가능한 어댑터 타입의 광섬유격자 센서용고정구 |
| KR20200111068A (ko) | 2019-03-18 | 2020-09-28 | 한국세라믹기술원 | 내플라즈마 세라믹의 가속수명 시험방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1977220B (zh) * | 2004-07-02 | 2010-12-01 | 日产化学工业株式会社 | 含有具有卤原子的萘环的形成光刻用下层膜的组合物 |
| KR20190028651A (ko) * | 2016-07-15 | 2019-03-19 | 닛산 가가쿠 가부시키가이샤 | 히단토인환을 갖는 화합물을 포함하는 레지스트 하층막형성 조성물 |
| JPWO2020111068A1 (ja) * | 2018-11-29 | 2021-10-28 | Jsr株式会社 | レジスト下層膜形成用組成物、レジスト下層膜及びレジストパターン形成方法 |
-
2022
- 2022-08-31 JP JP2023546908A patent/JPWO2023037949A1/ja active Pending
- 2022-08-31 WO PCT/JP2022/032852 patent/WO2023037949A1/ja not_active Ceased
- 2022-08-31 KR KR1020247011587A patent/KR20240056584A/ko active Pending
- 2022-08-31 CN CN202280074666.4A patent/CN118215887A/zh active Pending
- 2022-08-31 US US18/691,185 patent/US20240377748A1/en active Pending
- 2022-09-06 TW TW111133660A patent/TW202328817A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005526270A (ja) | 2002-02-11 | 2005-09-02 | ブルーワー サイエンス アイ エヌ シー. | ハロゲン化反射防止膜 |
| KR20060003850A (ko) | 2005-12-27 | 2006-01-11 | 한국유지관리 주식회사 | 미세조정이 가능한 어댑터 타입의 광섬유격자 센서용고정구 |
| KR20200111068A (ko) | 2019-03-18 | 2020-09-28 | 한국세라믹기술원 | 내플라즈마 세라믹의 가속수명 시험방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240377748A1 (en) | 2024-11-14 |
| WO2023037949A1 (ja) | 2023-03-16 |
| TW202328817A (zh) | 2023-07-16 |
| JPWO2023037949A1 (https=) | 2023-03-16 |
| CN118215887A (zh) | 2024-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |