KR20240047480A - 열전도성 실리콘 조성물 및 상기 조성물을 사용하여 갭 충전제를 제조하는 방법 - Google Patents
열전도성 실리콘 조성물 및 상기 조성물을 사용하여 갭 충전제를 제조하는 방법 Download PDFInfo
- Publication number
- KR20240047480A KR20240047480A KR1020247010667A KR20247010667A KR20240047480A KR 20240047480 A KR20240047480 A KR 20240047480A KR 1020247010667 A KR1020247010667 A KR 1020247010667A KR 20247010667 A KR20247010667 A KR 20247010667A KR 20240047480 A KR20240047480 A KR 20240047480A
- Authority
- KR
- South Korea
- Prior art keywords
- thermally conductive
- component
- group
- silicone composition
- conductive silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/117—Inorganic material
- H01M50/119—Metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
- H01M50/1245—Primary casings; Jackets or wrappings characterised by the material having a layered structure characterised by the external coating on the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
- H01M50/126—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/131—Primary casings; Jackets or wrappings characterised by physical properties, e.g. gas permeability, size or heat resistance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/14—Primary casings; Jackets or wrappings for protecting against damage caused by external factors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-162258 | 2021-09-30 | ||
| JP2021162261 | 2021-09-30 | ||
| JP2021162258 | 2021-09-30 | ||
| JPJP-P-2021-162261 | 2021-09-30 | ||
| JP2021162279 | 2021-09-30 | ||
| JPJP-P-2021-162279 | 2021-09-30 | ||
| PCT/JP2022/031105 WO2023053760A1 (ja) | 2021-09-30 | 2022-08-17 | 熱伝導性シリコーン組成物および該組成物を使用するギャップフィラーの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240047480A true KR20240047480A (ko) | 2024-04-12 |
Family
ID=85782302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247010667A Pending KR20240047480A (ko) | 2021-09-30 | 2022-08-17 | 열전도성 실리콘 조성물 및 상기 조성물을 사용하여 갭 충전제를 제조하는 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240392175A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4410899A4 (cg-RX-API-DMAC7.html) |
| JP (2) | JP7368656B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240047480A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2023053760A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4410899A4 (en) * | 2021-09-30 | 2025-04-09 | Wacker Chemie AG | Thermally conductive silicone composition and method for producing gap filler using said composition |
| CN120641467A (zh) * | 2023-01-17 | 2025-09-12 | 瓦克化学股份公司 | 导热硅酮组合物及用于制备其的方法 |
| KR102942603B1 (ko) * | 2023-04-25 | 2026-03-24 | 주식회사 엘투와이 | 방열 몰딩제 및 이를 이용하여 형성된 방열 필름 |
| JP7346761B1 (ja) | 2023-04-27 | 2023-09-19 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性シリコーン組成物および熱伝導性シリコーン組成物の製造方法 |
| KR20260074947A (ko) * | 2023-09-29 | 2026-05-27 | 세키스이가가쿠 고교가부시키가이샤 | 배터리용 경화성 접착제 |
| WO2026029118A1 (ja) * | 2024-07-31 | 2026-02-05 | 積水化学工業株式会社 | 2液硬化型熱伝導性組成物、その製造方法、熱伝導性部材、及びバッテリアセンブリ |
| WO2026057147A1 (de) * | 2024-09-10 | 2026-03-19 | Wacker Chemie Ag | Wärmeleitfähige siliconzusammensetzung |
| JP2026075046A (ja) | 2024-10-21 | 2026-05-07 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性シリコーン組成物 |
| WO2026105522A1 (ja) * | 2024-11-12 | 2026-05-21 | 信越化学工業株式会社 | 熱伝導性硬化型シリコーン組成物及びその硬化方法 |
| JP7735613B1 (ja) * | 2024-12-25 | 2025-09-08 | 株式会社フコク | 熱伝導性硬化性シリコーン組成物、前記組成物を硬化してなる硬化物ないしギャップフィラー、前記組成物を得るための2液型シリコーン組成物セット、及び前記組成物の製造方法 |
| WO2026140104A1 (ja) * | 2024-12-25 | 2026-07-02 | 株式会社フコク | 熱伝導性硬化性シリコーン組成物、前記組成物を硬化してなる硬化物ないしギャップフィラー、前記組成物を得るための2液型シリコーン組成物セット、及び前記組成物の製造方法 |
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| US5424384A (en) * | 1994-05-10 | 1995-06-13 | Dow Corning Corporation | Curable organosiloxane compositions containing low temperature reactive adhesion additives |
| US5399651A (en) * | 1994-05-10 | 1995-03-21 | Dow Corning Corporation | Adhesion promoting additives and low temperature curing organosiloxane compositions containing same |
| EP0699717A3 (en) * | 1994-08-30 | 1997-01-02 | Dow Corning | Organopolysiloxane compositions curable into products having good adhesiveness and reduced flammability |
| US5486565A (en) * | 1994-12-02 | 1996-01-23 | Dow Corning Corporation | Organosilicon compounds and low temperature curing organosiloxane compositions containing same |
| US5973044A (en) * | 1998-08-28 | 1999-10-26 | Dow Corning Corporation | Adhesion promoting organosilicon compositions |
| EP0982349A3 (en) * | 1998-08-28 | 2001-01-17 | Dow Corning Corporation | Adhesion promoting organosiloxane compositions |
| JP3447226B2 (ja) * | 1998-09-07 | 2003-09-16 | 信越化学工業株式会社 | 酸化亜鉛充填付加反応硬化型シリコーンゴム組成物及びその硬化物 |
| JP4727017B2 (ja) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
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| WO2021132349A1 (ja) * | 2019-12-26 | 2021-07-01 | ダウ・東レ株式会社 | 硬化性オルガノポリシロキサン組成物及びその硬化物、保護剤又は接着剤、並びに電気・電子機器 |
| JP7276212B2 (ja) * | 2020-03-17 | 2023-05-18 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその製造方法 |
| EP4410899A4 (en) * | 2021-09-30 | 2025-04-09 | Wacker Chemie AG | Thermally conductive silicone composition and method for producing gap filler using said composition |
| JP7778030B2 (ja) * | 2022-04-06 | 2025-12-01 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性組成物および該組成物を使用する熱伝導性部材の製造方法 |
-
2022
- 2022-08-17 EP EP22873965.2A patent/EP4410899A4/en active Pending
- 2022-08-17 KR KR1020247010667A patent/KR20240047480A/ko active Pending
- 2022-08-17 JP JP2023547179A patent/JP7368656B2/ja active Active
- 2022-08-17 US US18/696,504 patent/US20240392175A1/en active Pending
- 2022-08-17 WO PCT/JP2022/031105 patent/WO2023053760A1/ja not_active Ceased
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2023
- 2023-10-10 JP JP2023174889A patent/JP2023168633A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP4410899A1 (en) | 2024-08-07 |
| JP2023168633A (ja) | 2023-11-24 |
| US20240392175A1 (en) | 2024-11-28 |
| JP7368656B2 (ja) | 2023-10-24 |
| WO2023053760A1 (ja) | 2023-04-06 |
| JPWO2023053760A1 (cg-RX-API-DMAC7.html) | 2023-04-06 |
| EP4410899A4 (en) | 2025-04-09 |
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