KR20240033256A - 적층체, 접착제 조성물 및 회로 기판 재료 - Google Patents

적층체, 접착제 조성물 및 회로 기판 재료 Download PDF

Info

Publication number
KR20240033256A
KR20240033256A KR1020247004732A KR20247004732A KR20240033256A KR 20240033256 A KR20240033256 A KR 20240033256A KR 1020247004732 A KR1020247004732 A KR 1020247004732A KR 20247004732 A KR20247004732 A KR 20247004732A KR 20240033256 A KR20240033256 A KR 20240033256A
Authority
KR
South Korea
Prior art keywords
polyester resin
adhesive composition
film
laminate
carboxylic acids
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247004732A
Other languages
English (en)
Korean (ko)
Inventor
나츠미 무코자카
다카유키 나카네
Original Assignee
미쯔비시 케미컬 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쯔비시 케미컬 주식회사 filed Critical 미쯔비시 케미컬 주식회사
Publication of KR20240033256A publication Critical patent/KR20240033256A/ko
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16Dicarboxylic acids and dihydroxy compounds
    • C08G63/18Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181Acids containing aromatic rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020247004732A 2021-12-06 2022-12-01 적층체, 접착제 조성물 및 회로 기판 재료 Pending KR20240033256A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2021-197875 2021-12-06
JPJP-P-2021-197877 2021-12-06
JP2021197875 2021-12-06
JP2021197876 2021-12-06
JPJP-P-2021-197876 2021-12-06
JP2021197877 2021-12-06
PCT/JP2022/044397 WO2023106206A1 (ja) 2021-12-06 2022-12-01 積層体、接着剤組成物及び回路基板材料

Publications (1)

Publication Number Publication Date
KR20240033256A true KR20240033256A (ko) 2024-03-12

Family

ID=86730293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247004732A Pending KR20240033256A (ko) 2021-12-06 2022-12-01 적층체, 접착제 조성물 및 회로 기판 재료

Country Status (4)

Country Link
JP (2) JPWO2023106206A1 (https=)
KR (1) KR20240033256A (https=)
TW (1) TW202330279A (https=)
WO (1) WO2023106206A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102726919B1 (ko) * 2024-08-12 2024-11-06 주식회사 대영파워펌프 Pvdf 기반의 음향방출센서 및 그 제조방법

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025079399A1 (ja) * 2023-10-13 2025-04-17 コニカミノルタ株式会社 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183365A (ja) 2001-12-17 2003-07-03 Unitika Ltd 共重合ポリエステルおよび接着剤組成物
JP2017031301A (ja) 2015-07-31 2017-02-09 東洋インキScホールディングス株式会社 熱硬化性接着シート、およびその利用
WO2021079670A1 (ja) 2019-10-23 2021-04-29 三菱ケミカル株式会社 フレキシブルプリント配線板用接着剤組成物、フレキシブルプリント配線板用接着剤及びフレキシブルプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014193965A (ja) * 2013-03-29 2014-10-09 Nippon Steel & Sumikin Chemical Co Ltd 高熱伝導性樹脂組成物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂硬化物
KR102433526B1 (ko) * 2017-03-28 2022-08-17 도요보 가부시키가이샤 카르복실산 기 함유 폴리에스테르계 접착제 조성물
JP7211403B2 (ja) * 2019-10-23 2023-01-24 三菱ケミカル株式会社 接着剤組成物及び接着剤
JP2021088649A (ja) * 2019-12-03 2021-06-10 ナガセケムテックス株式会社 熱硬化性樹脂組成物
JP7127674B2 (ja) * 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183365A (ja) 2001-12-17 2003-07-03 Unitika Ltd 共重合ポリエステルおよび接着剤組成物
JP2017031301A (ja) 2015-07-31 2017-02-09 東洋インキScホールディングス株式会社 熱硬化性接着シート、およびその利用
WO2021079670A1 (ja) 2019-10-23 2021-04-29 三菱ケミカル株式会社 フレキシブルプリント配線板用接着剤組成物、フレキシブルプリント配線板用接着剤及びフレキシブルプリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102726919B1 (ko) * 2024-08-12 2024-11-06 주식회사 대영파워펌프 Pvdf 기반의 음향방출센서 및 그 제조방법

Also Published As

Publication number Publication date
TW202330279A (zh) 2023-08-01
WO2023106206A1 (ja) 2023-06-15
JP2025179238A (ja) 2025-12-09
JPWO2023106206A1 (https=) 2023-06-15

Similar Documents

Publication Publication Date Title
CN110268030B (zh) 含有羧酸基的聚酯系粘合剂组合物
KR101660083B1 (ko) 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착성 시트 및 이것을 접착제층으로서 포함하는 프린트 배선판
JP7388484B2 (ja) 接着剤組成物及び接着剤
KR20110099763A (ko) 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착 시트 및 이것을 접착층으로서 포함하는 프린트 배선판
KR102846556B1 (ko) 수지 조성물, 본딩 필름, 수지 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름
CN114040943B (zh) 树脂组合物、带有树脂组合物层的层叠体、层叠体、及电磁波屏蔽膜
TW202144454A (zh) 聚酯、薄膜、黏接劑組成物、黏接片、疊層體、以及印刷配線板
JP2025179238A (ja) 積層体、接着剤組成物及び回路基板材料
WO2020158360A1 (ja) ダイマージオール共重合ポリイミドウレタン樹脂を含む接着剤組成物
KR20230113299A (ko) 수지 조성물, 본딩 필름, 수지 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름
CN110036054B (zh) 含羧酸基的高分子化合物以及含有其的粘合剂组合物
CN118076698A (zh) 交联聚酯树脂、粘接剂组合物和粘接片
KR102860051B1 (ko) 플렉시블 프린트 배선판용 접착제 조성물, 플렉시블 프린트 배선판용 접착제 및 플렉시블 프린트 배선판
JP7127674B2 (ja) 接着剤組成物及び接着剤
JP7586092B2 (ja) 樹脂組成物、樹脂組成物層付き積層体、積層体、フレキシブル銅張積層板、フレキシブルフラットケーブル、及び、電磁波シールドフィルム
JP7279842B2 (ja) ポリエステル系樹脂、接着剤組成物及び接着剤
KR20250096679A (ko) 접착제 조성물, 및 이것을 함유하는 접착 시트, 적층체 및 프린트 배선판
WO2024009969A1 (ja) 接着剤組成物、ボンディングフィルム、接着剤組成物層付き積層体、積層体、及び、電磁波シールドフィルム
CN117940528A (zh) 层叠体、粘接剂组合物及电路基板材料
JP7156562B1 (ja) フレキシブルプリント配線板用接着剤組成物
JP7823504B2 (ja) 接着剤組成物及び接着剤
TW202611165A (zh) 樹脂組成物、黏接性薄膜、疊層體、印刷配線板
JP2024007384A (ja) 接着剤組成物及び接着剤
WO2025182483A1 (ja) 樹脂組成物、接着性フィルム、積層体、プリント配線板

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000