JPWO2023106206A1 - - Google Patents
Info
- Publication number
- JPWO2023106206A1 JPWO2023106206A1 JP2023566274A JP2023566274A JPWO2023106206A1 JP WO2023106206 A1 JPWO2023106206 A1 JP WO2023106206A1 JP 2023566274 A JP2023566274 A JP 2023566274A JP 2023566274 A JP2023566274 A JP 2023566274A JP WO2023106206 A1 JPWO2023106206 A1 JP WO2023106206A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
- C08G63/16—Dicarboxylic acids and dihydroxy compounds
- C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
- C08G63/181—Acids containing aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025157004A JP2025179238A (ja) | 2021-12-06 | 2025-09-22 | 積層体、接着剤組成物及び回路基板材料 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021197875 | 2021-12-06 | ||
| JP2021197876 | 2021-12-06 | ||
| JP2021197877 | 2021-12-06 | ||
| PCT/JP2022/044397 WO2023106206A1 (ja) | 2021-12-06 | 2022-12-01 | 積層体、接着剤組成物及び回路基板材料 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025157004A Division JP2025179238A (ja) | 2021-12-06 | 2025-09-22 | 積層体、接着剤組成物及び回路基板材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023106206A1 true JPWO2023106206A1 (https=) | 2023-06-15 |
| JPWO2023106206A5 JPWO2023106206A5 (https=) | 2024-03-15 |
Family
ID=86730293
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023566274A Pending JPWO2023106206A1 (https=) | 2021-12-06 | 2022-12-01 | |
| JP2025157004A Pending JP2025179238A (ja) | 2021-12-06 | 2025-09-22 | 積層体、接着剤組成物及び回路基板材料 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025157004A Pending JP2025179238A (ja) | 2021-12-06 | 2025-09-22 | 積層体、接着剤組成物及び回路基板材料 |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JPWO2023106206A1 (https=) |
| KR (1) | KR20240033256A (https=) |
| TW (1) | TW202330279A (https=) |
| WO (1) | WO2023106206A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025079399A1 (ja) * | 2023-10-13 | 2025-04-17 | コニカミノルタ株式会社 | 組成物、熱硬化性接着剤、積層体、積層体の製造方法、フレキシブル回路基板及び半導体装置 |
| KR102726919B1 (ko) * | 2024-08-12 | 2024-11-06 | 주식회사 대영파워펌프 | Pvdf 기반의 음향방출센서 및 그 제조방법 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014193965A (ja) * | 2013-03-29 | 2014-10-09 | Nippon Steel & Sumikin Chemical Co Ltd | 高熱伝導性樹脂組成物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂硬化物 |
| JP2017031301A (ja) * | 2015-07-31 | 2017-02-09 | 東洋インキScホールディングス株式会社 | 熱硬化性接着シート、およびその利用 |
| WO2018179707A1 (ja) * | 2017-03-28 | 2018-10-04 | 東洋紡株式会社 | カルボン酸基含有ポリエステル系接着剤組成物 |
| JP2021066865A (ja) * | 2019-10-23 | 2021-04-30 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
| JP2021088649A (ja) * | 2019-12-03 | 2021-06-10 | ナガセケムテックス株式会社 | 熱硬化性樹脂組成物 |
| JP2021134344A (ja) * | 2020-02-21 | 2021-09-13 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3924162B2 (ja) | 2001-12-17 | 2007-06-06 | ユニチカ株式会社 | 共重合ポリエステルおよび接着剤組成物 |
| CN114555749B (zh) | 2019-10-23 | 2024-04-26 | 三菱化学株式会社 | 柔性印刷电路板用粘接剂组合物、柔性印刷电路板用粘接剂和柔性印刷电路板 |
-
2022
- 2022-12-01 WO PCT/JP2022/044397 patent/WO2023106206A1/ja not_active Ceased
- 2022-12-01 JP JP2023566274A patent/JPWO2023106206A1/ja active Pending
- 2022-12-01 KR KR1020247004732A patent/KR20240033256A/ko active Pending
- 2022-12-05 TW TW111146545A patent/TW202330279A/zh unknown
-
2025
- 2025-09-22 JP JP2025157004A patent/JP2025179238A/ja active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014193965A (ja) * | 2013-03-29 | 2014-10-09 | Nippon Steel & Sumikin Chemical Co Ltd | 高熱伝導性樹脂組成物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂硬化物 |
| JP2017031301A (ja) * | 2015-07-31 | 2017-02-09 | 東洋インキScホールディングス株式会社 | 熱硬化性接着シート、およびその利用 |
| WO2018179707A1 (ja) * | 2017-03-28 | 2018-10-04 | 東洋紡株式会社 | カルボン酸基含有ポリエステル系接着剤組成物 |
| JP2021066865A (ja) * | 2019-10-23 | 2021-04-30 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
| JP2021088649A (ja) * | 2019-12-03 | 2021-06-10 | ナガセケムテックス株式会社 | 熱硬化性樹脂組成物 |
| JP2021134344A (ja) * | 2020-02-21 | 2021-09-13 | 三菱ケミカル株式会社 | 接着剤組成物及び接着剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202330279A (zh) | 2023-08-01 |
| WO2023106206A1 (ja) | 2023-06-15 |
| JP2025179238A (ja) | 2025-12-09 |
| KR20240033256A (ko) | 2024-03-12 |
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