KR20240021304A - 익스팬드 장치 및 익스팬드 방법 - Google Patents
익스팬드 장치 및 익스팬드 방법 Download PDFInfo
- Publication number
- KR20240021304A KR20240021304A KR1020247001665A KR20247001665A KR20240021304A KR 20240021304 A KR20240021304 A KR 20240021304A KR 1020247001665 A KR1020247001665 A KR 1020247001665A KR 20247001665 A KR20247001665 A KR 20247001665A KR 20240021304 A KR20240021304 A KR 20240021304A
- Authority
- KR
- South Korea
- Prior art keywords
- sheet member
- wafer
- expand
- ring
- ultraviolet
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 53
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 238000007665 sagging Methods 0.000 claims abstract description 12
- 230000001678 irradiating effect Effects 0.000 claims description 14
- 238000011282 treatment Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 description 76
- 238000001816 cooling Methods 0.000 description 43
- 238000012545 processing Methods 0.000 description 42
- 239000004065 semiconductor Substances 0.000 description 19
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- 238000012546 transfer Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000012634 fragment Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dicing (AREA)
- Small-Scale Networks (AREA)
- Interconnected Communication Systems, Intercoms, And Interphones (AREA)
- Circuit For Audible Band Transducer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/033739 WO2023042261A1 (ja) | 2021-09-14 | 2021-09-14 | エキスパンド装置およびエキスパンド方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240021304A true KR20240021304A (ko) | 2024-02-16 |
Family
ID=85601990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247001665A KR20240021304A (ko) | 2021-09-14 | 2021-09-14 | 익스팬드 장치 및 익스팬드 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042261A1 (zh) |
| KR (1) | KR20240021304A (zh) |
| CN (1) | CN117716470A (zh) |
| TW (1) | TWI824409B (zh) |
| WO (1) | WO2023042261A1 (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180050010A (ko) | 2016-11-04 | 2018-05-14 | 정인호 | 비소성 방식의 기능성 내장타일 제조방법 및 이에 의하여 제조된 기능성 내장타일 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006054246A (ja) * | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | ウエーハの分離方法 |
| JP5791866B2 (ja) * | 2009-03-06 | 2015-10-07 | 株式会社ディスコ | ワーク分割装置 |
| JP5554033B2 (ja) * | 2009-08-26 | 2014-07-23 | リンテック株式会社 | 光照射装置及び光照射方法 |
| JP5013148B1 (ja) * | 2011-02-16 | 2012-08-29 | 株式会社東京精密 | ワーク分割装置及びワーク分割方法 |
| JP6298635B2 (ja) * | 2014-01-10 | 2018-03-20 | 株式会社ディスコ | 分割装置及び被加工物の分割方法 |
| JP2018050010A (ja) * | 2016-09-23 | 2018-03-29 | 株式会社ディスコ | 加工方法 |
| JP2018206936A (ja) * | 2017-06-02 | 2018-12-27 | 東京エレクトロン株式会社 | 基板処理システム、基板処理方法 |
-
2021
- 2021-09-14 JP JP2023547968A patent/JPWO2023042261A1/ja active Pending
- 2021-09-14 KR KR1020247001665A patent/KR20240021304A/ko unknown
- 2021-09-14 WO PCT/JP2021/033739 patent/WO2023042261A1/ja active Application Filing
- 2021-09-14 CN CN202180101113.9A patent/CN117716470A/zh active Pending
-
2022
- 2022-02-10 TW TW111104884A patent/TWI824409B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180050010A (ko) | 2016-11-04 | 2018-05-14 | 정인호 | 비소성 방식의 기능성 내장타일 제조방법 및 이에 의하여 제조된 기능성 내장타일 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023042261A1 (ja) | 2023-03-23 |
| TW202312254A (zh) | 2023-03-16 |
| CN117716470A (zh) | 2024-03-15 |
| JPWO2023042261A1 (zh) | 2023-03-23 |
| TWI824409B (zh) | 2023-12-01 |
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