KR20230156726A - 경화성 수지 조성물 - Google Patents
경화성 수지 조성물 Download PDFInfo
- Publication number
- KR20230156726A KR20230156726A KR1020237032568A KR20237032568A KR20230156726A KR 20230156726 A KR20230156726 A KR 20230156726A KR 1020237032568 A KR1020237032568 A KR 1020237032568A KR 20237032568 A KR20237032568 A KR 20237032568A KR 20230156726 A KR20230156726 A KR 20230156726A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- curable resin
- thermosetting resin
- weight loss
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 83
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- 239000011347 resin Substances 0.000 claims abstract description 70
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- 239000006247 magnetic powder Substances 0.000 claims abstract description 28
- 238000002411 thermogravimetry Methods 0.000 claims abstract description 22
- 238000007865 diluting Methods 0.000 claims abstract description 20
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims description 60
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- 239000000945 filler Substances 0.000 claims description 15
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- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/01—Magnetic additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-054190 | 2021-03-26 | ||
| JP2021054190 | 2021-03-26 | ||
| PCT/JP2022/013718 WO2022202939A1 (ja) | 2021-03-26 | 2022-03-23 | 硬化性樹脂組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230156726A true KR20230156726A (ko) | 2023-11-14 |
Family
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Family Applications (1)
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|---|---|---|---|
| KR1020237032568A Pending KR20230156726A (ko) | 2021-03-26 | 2022-03-23 | 경화성 수지 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7295506B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20230156726A (enrdf_load_stackoverflow) |
| CN (1) | CN117120553A (enrdf_load_stackoverflow) |
| TW (1) | TW202239616A (enrdf_load_stackoverflow) |
| WO (1) | WO2022202939A1 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024075717A1 (ja) * | 2022-10-07 | 2024-04-11 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 |
| JP2024125720A (ja) * | 2023-03-06 | 2024-09-19 | 味の素株式会社 | 樹脂組成物 |
| JP2024125721A (ja) * | 2023-03-06 | 2024-09-19 | 味の素株式会社 | 樹脂組成物 |
| TW202504971A (zh) * | 2023-07-21 | 2025-02-01 | 日商拓自達電線股份有限公司 | 熱硬化性樹脂組成物、硬化物及印刷配線板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203463A (ja) | 2000-01-21 | 2001-07-27 | Taiyo Ink Mfg Ltd | 層間接続用導電性ペースト、及びそれを用いた多層プリント配線板とその製造方法 |
| JP2007509487A (ja) | 2003-09-19 | 2007-04-12 | ヴァイアシステムズ グループ インコーポレイテッド | 閉ループ・バックドリル加工システム |
| JP2017017175A (ja) | 2015-07-01 | 2017-01-19 | 日本電気株式会社 | 多層配線基板、高周波回路、通信装置、及び多層配線基板の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103666364B (zh) * | 2012-09-13 | 2015-09-16 | 东睦新材料集团股份有限公司 | 金属软磁复合材料用有机绝缘粘结剂及制备金属软磁复合材料方法 |
| CN106024359B (zh) * | 2016-06-29 | 2018-07-03 | 深圳顺络电子股份有限公司 | 一种模压电感的制作方法 |
| CN111937501A (zh) * | 2018-03-30 | 2020-11-13 | 太阳油墨制造株式会社 | 固化性树脂组合物、其固化物和印刷电路板 |
| CN112424889B (zh) * | 2018-07-25 | 2024-12-24 | 味之素株式会社 | 磁性糊料 |
| EP3828901A4 (en) * | 2018-07-25 | 2022-05-04 | Ajinomoto Co., Inc. | MAGNETIC PASTE |
| CN113165063B (zh) * | 2018-11-22 | 2023-07-18 | 味之素株式会社 | 磁性糊料 |
| TWI850353B (zh) * | 2019-03-20 | 2024-08-01 | 日商味之素股份有限公司 | 樹脂組成物 |
| JP2021161211A (ja) * | 2020-03-31 | 2021-10-11 | 太陽インキ製造株式会社 | 液状熱硬化性樹脂組成物 |
-
2022
- 2022-03-01 TW TW111107361A patent/TW202239616A/zh unknown
- 2022-03-23 WO PCT/JP2022/013718 patent/WO2022202939A1/ja active Application Filing
- 2022-03-23 KR KR1020237032568A patent/KR20230156726A/ko active Pending
- 2022-03-23 JP JP2022561607A patent/JP7295506B2/ja active Active
- 2022-03-23 CN CN202280025075.8A patent/CN117120553A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203463A (ja) | 2000-01-21 | 2001-07-27 | Taiyo Ink Mfg Ltd | 層間接続用導電性ペースト、及びそれを用いた多層プリント配線板とその製造方法 |
| JP2007509487A (ja) | 2003-09-19 | 2007-04-12 | ヴァイアシステムズ グループ インコーポレイテッド | 閉ループ・バックドリル加工システム |
| JP2017017175A (ja) | 2015-07-01 | 2017-01-19 | 日本電気株式会社 | 多層配線基板、高周波回路、通信装置、及び多層配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7295506B2 (ja) | 2023-06-21 |
| JPWO2022202939A1 (enrdf_load_stackoverflow) | 2022-09-29 |
| TW202239616A (zh) | 2022-10-16 |
| WO2022202939A1 (ja) | 2022-09-29 |
| CN117120553A (zh) | 2023-11-24 |
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