KR20230140547A - 장치 진단 시스템, 장치 진단 장치, 반도체 장치 제조 시스템 및 장치 진단 방법 - Google Patents
장치 진단 시스템, 장치 진단 장치, 반도체 장치 제조 시스템 및 장치 진단 방법 Download PDFInfo
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- KR20230140547A KR20230140547A KR1020237005520A KR20237005520A KR20230140547A KR 20230140547 A KR20230140547 A KR 20230140547A KR 1020237005520 A KR1020237005520 A KR 1020237005520A KR 20237005520 A KR20237005520 A KR 20237005520A KR 20230140547 A KR20230140547 A KR 20230140547A
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- semiconductor manufacturing
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/024—Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/04—Program control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/048—Monitoring; Safety
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0221—Preprocessing measurements, e.g. data collection rate adjustment; Standardization of measurements; Time series or signal analysis, e.g. frequency analysis or wavelets; Trustworthiness of measurements; Indexes therefor; Measurements using easily measured parameters to estimate parameters difficult to measure; Virtual sensor creation; De-noising; Sensor fusion; Unconventional preprocessing inherently present in specific fault detection methods like PCA-based methods
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
- G05B23/0283—Predictive maintenance, e.g. involving the monitoring of a system and, based on the monitoring results, taking decisions on the maintenance schedule of the monitored system; Estimating remaining useful life [RUL]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N20/00—Machine learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/10—Services
-
- H01L21/67253—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Mathematical Physics (AREA)
- Business, Economics & Management (AREA)
- Theoretical Computer Science (AREA)
- Tourism & Hospitality (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Medical Informatics (AREA)
- Data Mining & Analysis (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Economics (AREA)
- Computing Systems (AREA)
- Human Resources & Organizations (AREA)
- Marketing (AREA)
- Primary Health Care (AREA)
- Strategic Management (AREA)
- General Business, Economics & Management (AREA)
- Drying Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/014006 WO2023181265A1 (ja) | 2022-03-24 | 2022-03-24 | 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230140547A true KR20230140547A (ko) | 2023-10-06 |
Family
ID=88100691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237005520A Pending KR20230140547A (ko) | 2022-03-24 | 2022-03-24 | 장치 진단 시스템, 장치 진단 장치, 반도체 장치 제조 시스템 및 장치 진단 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12530023B2 (https=) |
| JP (1) | JP7564334B2 (https=) |
| KR (1) | KR20230140547A (https=) |
| CN (1) | CN117121169A (https=) |
| TW (1) | TWI838134B (https=) |
| WO (1) | WO2023181265A1 (https=) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000259222A (ja) | 1999-03-04 | 2000-09-22 | Hitachi Ltd | 機器監視・予防保全システム |
| JP2006324316A (ja) | 2005-05-17 | 2006-11-30 | Hitachi High-Technologies Corp | プラズマ処理装置 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002016123A (ja) | 2000-06-29 | 2002-01-18 | Hitachi Ltd | 試料処理装置および処理方法 |
| US6658423B1 (en) | 2001-01-24 | 2003-12-02 | Google, Inc. | Detecting duplicate and near-duplicate files |
| JP4128339B2 (ja) | 2001-03-05 | 2008-07-30 | 株式会社日立製作所 | 試料処理装置用プロセスモニタ及び試料の製造方法 |
| JP3660896B2 (ja) | 2001-07-26 | 2005-06-15 | 株式会社日立製作所 | プラズマ処理装置のメンテナンス方法 |
| US6616759B2 (en) | 2001-09-06 | 2003-09-09 | Hitachi, Ltd. | Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor |
| JP2003197609A (ja) | 2001-12-27 | 2003-07-11 | Tokyo Electron Ltd | プラズマ処理装置の監視方法及びプラズマ処理装置 |
| WO2004019396A1 (ja) | 2002-08-13 | 2004-03-04 | Tokyo Electron Limited | プラズマ処理方法及びプラズマ処理装置 |
| JP4363860B2 (ja) | 2003-02-04 | 2009-11-11 | 株式会社日立ハイテクノロジーズ | 真空処理装置の異物管理装置及び異物管理方法 |
| JP4119295B2 (ja) * | 2003-04-07 | 2008-07-16 | 東京エレクトロン株式会社 | 保守・診断データ蓄積サーバ、保守・診断データの蓄積・取得システム、保守・診断データの蓄積・提供システム |
| JP2004335841A (ja) | 2003-05-09 | 2004-11-25 | Tokyo Electron Ltd | プラズマ処理装置の予測装置及び予測方法 |
| KR100976648B1 (ko) | 2003-05-16 | 2010-08-18 | 도쿄엘렉트론가부시키가이샤 | 헬스 인덱스 처리 시스템 및 이를 이용한 방법 |
| JP2004349419A (ja) | 2003-05-21 | 2004-12-09 | Tokyo Electron Ltd | プラズマ処理装置の異常原因判定方法及び異常原因判定装置 |
| US6993404B2 (en) | 2003-07-11 | 2006-01-31 | Mks Instruments, Inc. | Graphical user interface with process quality indicator |
| JP4448335B2 (ja) | 2004-01-08 | 2010-04-07 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| JP2006086325A (ja) | 2004-09-16 | 2006-03-30 | Tokyo Electron Ltd | クリーニングの終点検出方法 |
| US7191082B2 (en) | 2005-01-19 | 2007-03-13 | Tokyo Electron Limited | Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method |
| JP5192122B2 (ja) | 2005-01-19 | 2013-05-08 | 東京エレクトロン株式会社 | 基板処理装置の検査方法及び検査プログラム |
| US7289863B2 (en) | 2005-08-18 | 2007-10-30 | Brooks Automation, Inc. | System and method for electronic diagnostics of a process vacuum environment |
| US7596718B2 (en) | 2006-05-07 | 2009-09-29 | Applied Materials, Inc. | Ranged fault signatures for fault diagnosis |
| JP2008034877A (ja) | 2007-10-10 | 2008-02-14 | Hitachi Ltd | 半導体装置の製造方法および製造システム |
| JP5416443B2 (ja) | 2009-03-19 | 2014-02-12 | 大日本スクリーン製造株式会社 | 故障予知システムおよび故障予知方法 |
| JP6501601B2 (ja) | 2014-05-20 | 2019-04-17 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び基板処理プログラム |
| JP6156850B2 (ja) | 2014-12-25 | 2017-07-05 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理装置の部材の交換判断方法 |
| US10032681B2 (en) | 2016-03-02 | 2018-07-24 | Lam Research Corporation | Etch metric sensitivity for endpoint detection |
| JP2018083958A (ja) | 2016-11-21 | 2018-05-31 | 株式会社タムロン | 薄膜成膜装置の異常検出装置及び薄膜成膜装置の異常検出方法 |
| JP6877200B2 (ja) | 2017-03-15 | 2021-05-26 | 東京エレクトロン株式会社 | 基板処理装置の制御装置及び基板処理表示方法 |
| JP6602512B2 (ja) * | 2017-06-14 | 2019-11-06 | 三菱電機株式会社 | 経年劣化診断装置及び経年劣化診断方法 |
| JP6676020B2 (ja) * | 2017-09-20 | 2020-04-08 | 株式会社日立ハイテク | プラズマ処理装置及びプラズマ処理装置状態予測方法 |
| JP6799550B2 (ja) | 2018-01-16 | 2020-12-16 | 東京エレクトロン株式会社 | プラズマ処理装置の部品をクリーニングする方法 |
| JP6990634B2 (ja) * | 2018-08-21 | 2022-02-03 | 株式会社日立ハイテク | 状態予測装置及び半導体製造装置 |
| US11953528B2 (en) * | 2019-01-11 | 2024-04-09 | Panasonic Intellectual Property Management Co., Ltd. | Diagnosis system, diagnosis method, program, and recording medium |
| US11133204B2 (en) | 2019-01-29 | 2021-09-28 | Applied Materials, Inc. | Chamber matching with neural networks in semiconductor equipment tools |
| US11348813B2 (en) | 2019-01-31 | 2022-05-31 | Applied Materials, Inc. | Correcting component failures in ion implant semiconductor manufacturing tool |
| JP6696059B1 (ja) | 2019-03-04 | 2020-05-20 | Sppテクノロジーズ株式会社 | 基板処理装置のプロセス判定装置、基板処理システム及び基板処理装置のプロセス判定方法 |
| JP7227351B2 (ja) | 2019-03-19 | 2023-02-21 | 株式会社Kokusai Electric | 半導体装置の製造方法、予兆検知プログラム、及び基板処理装置 |
| CN114207593B (zh) * | 2019-06-10 | 2025-10-21 | 沃特世科技爱尔兰有限公司 | 用于分析仪器性能诊断的技术 |
| WO2021065295A1 (ja) | 2019-09-30 | 2021-04-08 | パナソニックIpマネジメント株式会社 | プラズマ処理の異常判定システムおよび異常判定方法 |
| WO2021240572A1 (ja) | 2020-05-25 | 2021-12-02 | 株式会社日立ハイテク | 半導体装置製造システムおよび半導体装置製造方法 |
| JPWO2021255784A1 (https=) * | 2020-06-15 | 2021-12-23 | ||
| WO2022103720A1 (en) * | 2020-11-12 | 2022-05-19 | Lam Research Corporation | Predictive maintenance for semiconductor manufacturing equipment |
-
2022
- 2022-03-24 JP JP2023512213A patent/JP7564334B2/ja active Active
- 2022-03-24 US US18/026,201 patent/US12530023B2/en active Active
- 2022-03-24 CN CN202280005626.4A patent/CN117121169A/zh active Pending
- 2022-03-24 KR KR1020237005520A patent/KR20230140547A/ko active Pending
- 2022-03-24 WO PCT/JP2022/014006 patent/WO2023181265A1/ja not_active Ceased
-
2023
- 2023-02-22 TW TW112106472A patent/TWI838134B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000259222A (ja) | 1999-03-04 | 2000-09-22 | Hitachi Ltd | 機器監視・予防保全システム |
| JP2006324316A (ja) | 2005-05-17 | 2006-11-30 | Hitachi High-Technologies Corp | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7564334B2 (ja) | 2024-10-08 |
| WO2023181265A1 (ja) | 2023-09-28 |
| CN117121169A (zh) | 2023-11-24 |
| TW202338627A (zh) | 2023-10-01 |
| US12530023B2 (en) | 2026-01-20 |
| US20240310827A1 (en) | 2024-09-19 |
| TWI838134B (zh) | 2024-04-01 |
| JPWO2023181265A1 (https=) | 2023-09-28 |
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