KR20230095958A - 전자 디바이스 가공용 테이프 및 전자 디바이스 가공용 테이프의 제조 방법 - Google Patents

전자 디바이스 가공용 테이프 및 전자 디바이스 가공용 테이프의 제조 방법 Download PDF

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Publication number
KR20230095958A
KR20230095958A KR1020237014095A KR20237014095A KR20230095958A KR 20230095958 A KR20230095958 A KR 20230095958A KR 1020237014095 A KR1020237014095 A KR 1020237014095A KR 20237014095 A KR20237014095 A KR 20237014095A KR 20230095958 A KR20230095958 A KR 20230095958A
Authority
KR
South Korea
Prior art keywords
tape
drag
electronic device
outer edge
cut line
Prior art date
Application number
KR1020237014095A
Other languages
English (en)
Korean (ko)
Inventor
다카노리 츠치야
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20230095958A publication Critical patent/KR20230095958A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Dicing (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Making Paper Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020237014095A 2021-06-25 2022-03-23 전자 디바이스 가공용 테이프 및 전자 디바이스 가공용 테이프의 제조 방법 KR20230095958A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-105335 2021-06-25
JP2021105335A JP7536716B2 (ja) 2021-06-25 2021-06-25 電子デバイス加工用テープ及び電子デバイス加工用テープの製造方法
PCT/JP2022/013442 WO2022270074A1 (ja) 2021-06-25 2022-03-23 電子デバイス加工用テープ及び電子デバイス加工用テープの製造方法

Publications (1)

Publication Number Publication Date
KR20230095958A true KR20230095958A (ko) 2023-06-29

Family

ID=84544632

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237014095A KR20230095958A (ko) 2021-06-25 2022-03-23 전자 디바이스 가공용 테이프 및 전자 디바이스 가공용 테이프의 제조 방법

Country Status (5)

Country Link
JP (1) JP7536716B2 (zh)
KR (1) KR20230095958A (zh)
CN (1) CN116349003A (zh)
TW (1) TWI829140B (zh)
WO (1) WO2022270074A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011111530A (ja) 2009-11-26 2011-06-09 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2014017357A (ja) 2012-07-09 2014-01-30 Nitto Denko Corp 粘着テープ、粘着テープの貼付け方法および粘着テープ貼付け装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188323A (ja) 2008-02-08 2009-08-20 Furukawa Electric Co Ltd:The ウエハ加工用テープ
JP6790025B2 (ja) 2018-05-31 2020-11-25 古河電気工業株式会社 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011111530A (ja) 2009-11-26 2011-06-09 Hitachi Chem Co Ltd 接着シート及びその製造方法、並びに、半導体装置の製造方法及び半導体装置
JP2014017357A (ja) 2012-07-09 2014-01-30 Nitto Denko Corp 粘着テープ、粘着テープの貼付け方法および粘着テープ貼付け装置

Also Published As

Publication number Publication date
TW202301447A (zh) 2023-01-01
CN116349003A (zh) 2023-06-27
WO2022270074A1 (ja) 2022-12-29
JP2023003941A (ja) 2023-01-17
JP7536716B2 (ja) 2024-08-20
TWI829140B (zh) 2024-01-11

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