KR20230047000A - 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기 - Google Patents

금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기 Download PDF

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Publication number
KR20230047000A
KR20230047000A KR1020220122119A KR20220122119A KR20230047000A KR 20230047000 A KR20230047000 A KR 20230047000A KR 1020220122119 A KR1020220122119 A KR 1020220122119A KR 20220122119 A KR20220122119 A KR 20220122119A KR 20230047000 A KR20230047000 A KR 20230047000A
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KR
South Korea
Prior art keywords
layer
metal
polyimide
clad laminate
polyimide layer
Prior art date
Application number
KR1020220122119A
Other languages
English (en)
Korean (ko)
Inventor
유타 시시도
야스히로 아다치
Original Assignee
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Publication of KR20230047000A publication Critical patent/KR20230047000A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
KR1020220122119A 2021-09-30 2022-09-27 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기 KR20230047000A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021162374 2021-09-30
JPJP-P-2021-162374 2021-09-30

Publications (1)

Publication Number Publication Date
KR20230047000A true KR20230047000A (ko) 2023-04-06

Family

ID=85770946

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220122119A KR20230047000A (ko) 2021-09-30 2022-09-27 금속 피복 적층판, 회로 기판, 전자 디바이스 및 전자 기기

Country Status (4)

Country Link
JP (1) JP2023051810A (ja)
KR (1) KR20230047000A (ja)
CN (1) CN115891346A (ja)
TW (1) TW202316920A (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006051800A (ja) 2004-07-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブル積層板及びその製造方法
JP2020104340A (ja) 2018-12-26 2020-07-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006051800A (ja) 2004-07-13 2006-02-23 Nippon Steel Chem Co Ltd フレキシブル積層板及びその製造方法
JP2020104340A (ja) 2018-12-26 2020-07-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板

Also Published As

Publication number Publication date
CN115891346A (zh) 2023-04-04
TW202316920A (zh) 2023-04-16
JP2023051810A (ja) 2023-04-11

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