KR20230015910A - 도금조, 도금 장치 및 전해 도금 방법 - Google Patents

도금조, 도금 장치 및 전해 도금 방법 Download PDF

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Publication number
KR20230015910A
KR20230015910A KR1020227040292A KR20227040292A KR20230015910A KR 20230015910 A KR20230015910 A KR 20230015910A KR 1020227040292 A KR1020227040292 A KR 1020227040292A KR 20227040292 A KR20227040292 A KR 20227040292A KR 20230015910 A KR20230015910 A KR 20230015910A
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KR
South Korea
Prior art keywords
plating
container
substrate
liquid
plating solution
Prior art date
Application number
KR1020227040292A
Other languages
English (en)
Korean (ko)
Inventor
마사히로 이토
Original Assignee
스미토모 덴코 프린트 써키트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 스미토모 덴코 프린트 써키트 가부시키가이샤 filed Critical 스미토모 덴코 프린트 써키트 가부시키가이샤
Publication of KR20230015910A publication Critical patent/KR20230015910A/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020227040292A 2020-05-26 2021-04-14 도금조, 도금 장치 및 전해 도금 방법 KR20230015910A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-091691 2020-05-26
JP2020091691 2020-05-26
PCT/JP2021/015510 WO2021241052A1 (ja) 2020-05-26 2021-04-14 メッキ槽、メッキ装置及び電解メッキ方法

Publications (1)

Publication Number Publication Date
KR20230015910A true KR20230015910A (ko) 2023-01-31

Family

ID=78744281

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227040292A KR20230015910A (ko) 2020-05-26 2021-04-14 도금조, 도금 장치 및 전해 도금 방법

Country Status (4)

Country Link
JP (1) JPWO2021241052A1 (ja)
KR (1) KR20230015910A (ja)
CN (1) CN115667593A (ja)
WO (1) WO2021241052A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004143478A (ja) 2002-10-22 2004-05-20 Ebara Udylite Kk 酸性銅めっき方法および酸性銅めっき装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3411103B2 (ja) * 1994-09-14 2003-05-26 イビデン株式会社 電解めっき方法、電解めっき装置、電解めっき用ラック
JP2011176085A (ja) * 2010-02-24 2011-09-08 Sumitomo Bakelite Co Ltd 基板の処理方法および処理装置
JP5279810B2 (ja) * 2010-12-27 2013-09-04 アルメックスＰｅ株式会社 平板形状物の表面処理装置
JP6937669B2 (ja) * 2017-11-21 2021-09-22 富士通インターコネクトテクノロジーズ株式会社 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004143478A (ja) 2002-10-22 2004-05-20 Ebara Udylite Kk 酸性銅めっき方法および酸性銅めっき装置

Also Published As

Publication number Publication date
WO2021241052A1 (ja) 2021-12-02
JPWO2021241052A1 (ja) 2021-12-02
CN115667593A (zh) 2023-01-31

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