JPWO2021241052A1 - - Google Patents

Info

Publication number
JPWO2021241052A1
JPWO2021241052A1 JP2022527570A JP2022527570A JPWO2021241052A1 JP WO2021241052 A1 JPWO2021241052 A1 JP WO2021241052A1 JP 2022527570 A JP2022527570 A JP 2022527570A JP 2022527570 A JP2022527570 A JP 2022527570A JP WO2021241052 A1 JPWO2021241052 A1 JP WO2021241052A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022527570A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021241052A1 publication Critical patent/JPWO2021241052A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022527570A 2020-05-26 2021-04-14 Pending JPWO2021241052A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020091691 2020-05-26
PCT/JP2021/015510 WO2021241052A1 (ja) 2020-05-26 2021-04-14 メッキ槽、メッキ装置及び電解メッキ方法

Publications (1)

Publication Number Publication Date
JPWO2021241052A1 true JPWO2021241052A1 (ja) 2021-12-02

Family

ID=78744281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527570A Pending JPWO2021241052A1 (ja) 2020-05-26 2021-04-14

Country Status (4)

Country Link
JP (1) JPWO2021241052A1 (ja)
KR (1) KR20230015910A (ja)
CN (1) CN115667593A (ja)
WO (1) WO2021241052A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3411103B2 (ja) * 1994-09-14 2003-05-26 イビデン株式会社 電解めっき方法、電解めっき装置、電解めっき用ラック
JP3803968B2 (ja) 2002-10-22 2006-08-02 荏原ユージライト株式会社 酸性銅めっき方法および酸性銅めっき装置
JP2011176085A (ja) * 2010-02-24 2011-09-08 Sumitomo Bakelite Co Ltd 基板の処理方法および処理装置
JP5279810B2 (ja) * 2010-12-27 2013-09-04 アルメックスＰｅ株式会社 平板形状物の表面処理装置
JP6937669B2 (ja) * 2017-11-21 2021-09-22 富士通インターコネクトテクノロジーズ株式会社 基板処理装置

Also Published As

Publication number Publication date
KR20230015910A (ko) 2023-01-31
WO2021241052A1 (ja) 2021-12-02
CN115667593A (zh) 2023-01-31

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Legal Events

Date Code Title Description
A625 Written request for application examination (by other person)

Free format text: JAPANESE INTERMEDIATE CODE: A625

Effective date: 20231023