KR20220132609A - 처리액, 처리액 수용체 - Google Patents

처리액, 처리액 수용체 Download PDF

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Publication number
KR20220132609A
KR20220132609A KR1020227029431A KR20227029431A KR20220132609A KR 20220132609 A KR20220132609 A KR 20220132609A KR 1020227029431 A KR1020227029431 A KR 1020227029431A KR 20227029431 A KR20227029431 A KR 20227029431A KR 20220132609 A KR20220132609 A KR 20220132609A
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KR
South Korea
Prior art keywords
acid
group
treatment liquid
preferable
acetate
Prior art date
Application number
KR1020227029431A
Other languages
English (en)
Korean (ko)
Inventor
야스오 스기시마
Original Assignee
후지필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 가부시키가이샤 filed Critical 후지필름 가부시키가이샤
Publication of KR20220132609A publication Critical patent/KR20220132609A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/10—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a boron compound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/16—Closures not otherwise provided for with means for venting air or gas
    • B65D51/1605—Closures not otherwise provided for with means for venting air or gas whereby the interior of the container is maintained in permanent gaseous communication with the exterior
    • B65D51/1616—Closures not otherwise provided for with means for venting air or gas whereby the interior of the container is maintained in permanent gaseous communication with the exterior by means of a filter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D51/00—Closures not otherwise provided for
    • B65D51/16—Closures not otherwise provided for with means for venting air or gas
    • B65D51/1633—Closures not otherwise provided for with means for venting air or gas whereby venting occurs by automatic opening of the closure, container or other element
    • B65D51/1644—Closures not otherwise provided for with means for venting air or gas whereby venting occurs by automatic opening of the closure, container or other element the element being a valve
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • External Artificial Organs (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020227029431A 2020-03-04 2021-02-05 처리액, 처리액 수용체 KR20220132609A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-036859 2020-03-04
JP2020036859 2020-03-04
PCT/JP2021/004398 WO2021176952A1 (ja) 2020-03-04 2021-02-05 処理液、処理液収容体

Publications (1)

Publication Number Publication Date
KR20220132609A true KR20220132609A (ko) 2022-09-30

Family

ID=77614304

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227029431A KR20220132609A (ko) 2020-03-04 2021-02-05 처리액, 처리액 수용체

Country Status (4)

Country Link
US (1) US20230002676A1 (ja)
KR (1) KR20220132609A (ja)
TW (1) TW202140752A (ja)
WO (1) WO2021176952A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113789230A (zh) * 2021-08-26 2021-12-14 安徽四季电子科技有限公司 一种玻璃前处理液、其配制方法及其应用
JP7271776B1 (ja) 2022-09-27 2023-05-11 東京応化工業株式会社 水性洗浄液及び電子デバイスの洗浄方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10414978B2 (en) 2016-12-14 2019-09-17 Samsung Electronics Co., Ltd. Etching composition and method for fabricating semiconductor device by using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6101816A (en) * 1998-04-28 2000-08-15 Advanced Technology Materials, Inc. Fluid storage and dispensing system
CN101010421B (zh) * 2004-08-31 2011-08-03 三洋化成工业株式会社 表面活性剂
WO2017119350A1 (ja) * 2016-01-05 2017-07-13 富士フイルム株式会社 処理液、基板の洗浄方法、及び、半導体デバイスの製造方法
KR102027795B1 (ko) * 2016-01-05 2019-10-02 후지필름 가부시키가이샤 처리액, 기판의 세정 방법, 및 반도체 디바이스의 제조 방법
WO2017126554A1 (ja) * 2016-01-22 2017-07-27 富士フイルム株式会社 処理液
KR102055154B1 (ko) * 2016-07-29 2019-12-12 후지필름 가부시키가이샤 처리액 및 기판 세정 방법
US10879076B2 (en) * 2017-08-25 2020-12-29 Versum Materials Us, Llc Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10414978B2 (en) 2016-12-14 2019-09-17 Samsung Electronics Co., Ltd. Etching composition and method for fabricating semiconductor device by using the same

Also Published As

Publication number Publication date
WO2021176952A1 (ja) 2021-09-10
TW202140752A (zh) 2021-11-01
US20230002676A1 (en) 2023-01-05

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