KR20220125246A - 베이퍼 챔버용의 윅 시트, 베이퍼 챔버 및 전자 기기 - Google Patents

베이퍼 챔버용의 윅 시트, 베이퍼 챔버 및 전자 기기 Download PDF

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Publication number
KR20220125246A
KR20220125246A KR1020227023024A KR20227023024A KR20220125246A KR 20220125246 A KR20220125246 A KR 20220125246A KR 1020227023024 A KR1020227023024 A KR 1020227023024A KR 20227023024 A KR20227023024 A KR 20227023024A KR 20220125246 A KR20220125246 A KR 20220125246A
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South Korea
Prior art keywords
vapor
sheet
passage
groove
flow path
Prior art date
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Pending
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KR1020227023024A
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English (en)
Korean (ko)
Inventor
가즈노리 오다
도시히코 다케다
신이치로 다카하시
다카유키 오타
Original Assignee
다이니폰 인사츠 가부시키가이샤
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Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20220125246A publication Critical patent/KR20220125246A/ko
Pending legal-status Critical Current

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Classifications

    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Catching Or Destruction (AREA)
  • Golf Clubs (AREA)
KR1020227023024A 2020-01-10 2021-01-08 베이퍼 챔버용의 윅 시트, 베이퍼 챔버 및 전자 기기 Pending KR20220125246A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-003029 2020-01-10
JP2020003029 2020-01-10
PCT/JP2021/000478 WO2021141110A1 (ja) 2020-01-10 2021-01-08 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよび電子機器

Publications (1)

Publication Number Publication Date
KR20220125246A true KR20220125246A (ko) 2022-09-14

Family

ID=76788618

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227023024A Pending KR20220125246A (ko) 2020-01-10 2021-01-08 베이퍼 챔버용의 윅 시트, 베이퍼 챔버 및 전자 기기

Country Status (6)

Country Link
US (2) US12256520B2 (https=)
JP (2) JPWO2021141110A1 (https=)
KR (1) KR20220125246A (https=)
CN (1) CN114846290B (https=)
TW (1) TW202130963A (https=)
WO (1) WO2021141110A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7593793B2 (ja) * 2020-11-26 2024-12-03 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
CN116964401A (zh) * 2021-03-10 2023-10-27 大日本印刷株式会社 蒸发室、蒸发室用的芯部片材以及电子设备
WO2022191240A1 (ja) 2021-03-10 2022-09-15 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用のウィックシート及び電子機器
CN116242176B (zh) * 2021-12-08 2026-01-09 亚浩电子五金塑胶（惠州）有限公司 均温板
WO2024249624A2 (en) * 2023-05-30 2024-12-05 The Board Of Trustees Of The University Of Illinois Ceramic surfaces for vapor chambers and heat pipes in thermal management
US12455122B2 (en) 2023-06-26 2025-10-28 International Business Machines Corporation Dynamically enhancing heat transfer through heat pipes

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082698A (ja) 2002-05-08 2008-04-10 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002039693A (ja) * 2000-07-21 2002-02-06 Toufuji Denki Kk フラット型ヒートパイプ
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
JP5334288B2 (ja) * 2008-09-05 2013-11-06 日本モレックス株式会社 ヒートパイプおよび電子機器
JP4811460B2 (ja) * 2008-12-24 2011-11-09 ソニー株式会社 熱輸送デバイス及び電子機器
JP6121893B2 (ja) * 2013-12-24 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプ
US10502498B2 (en) * 2015-07-20 2019-12-10 Delta Electronics, Inc. Slim vapor chamber
TWM532046U (zh) * 2016-06-02 2016-11-11 泰碩電子股份有限公司 具有液汽分離結構的均溫板
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
US10352626B2 (en) * 2016-12-14 2019-07-16 Shinko Electric Industries Co., Ltd. Heat pipe
US20200080791A1 (en) * 2016-12-20 2020-03-12 Fujikura Ltd. Heat dissipation module
TWI794886B (zh) * 2017-02-24 2023-03-01 日商大日本印刷股份有限公司 蒸氣腔、電子機器及蒸氣腔之製造方法
JP7137783B2 (ja) 2017-08-24 2022-09-15 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
KR20250005523A (ko) * 2017-09-28 2025-01-09 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 전자 기기, 베이퍼 챔버용 금속 시트 및 베이퍼 챔버의 제조 방법
JP6801700B2 (ja) * 2017-11-10 2020-12-16 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法
JP7011938B2 (ja) * 2017-12-28 2022-01-27 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
JP7155585B2 (ja) * 2018-03-30 2022-10-19 大日本印刷株式会社 ベーパーチャンバー、及び電子機器
JP7182071B2 (ja) * 2018-05-02 2022-12-02 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法
CN112902717B (zh) * 2018-05-30 2022-03-11 大日本印刷株式会社 蒸发室用片、蒸发室和电子设备
US20240151481A1 (en) * 2019-11-12 2024-05-09 Toyota Jidosha Kabushiki Kaisha Cooler and manufacturing method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008082698A (ja) 2002-05-08 2008-04-10 Furukawa Electric Co Ltd:The 薄型シート状ヒートパイプ

Also Published As

Publication number Publication date
JP2025157264A (ja) 2025-10-15
US12256520B2 (en) 2025-03-18
US20230026517A1 (en) 2023-01-26
TW202130963A (zh) 2021-08-16
WO2021141110A1 (ja) 2021-07-15
US20250212367A1 (en) 2025-06-26
JPWO2021141110A1 (https=) 2021-07-15
CN114846290A (zh) 2022-08-02
CN114846290B (zh) 2026-04-17

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