KR20220117227A - 수지 시트 및 그 제조 방법 - Google Patents

수지 시트 및 그 제조 방법 Download PDF

Info

Publication number
KR20220117227A
KR20220117227A KR1020227019959A KR20227019959A KR20220117227A KR 20220117227 A KR20220117227 A KR 20220117227A KR 1020227019959 A KR1020227019959 A KR 1020227019959A KR 20227019959 A KR20227019959 A KR 20227019959A KR 20220117227 A KR20220117227 A KR 20220117227A
Authority
KR
South Korea
Prior art keywords
boron nitride
bulk
particles
bulk boron
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227019959A
Other languages
English (en)
Korean (ko)
Inventor
유스케 사사키
겐지 미야타
미치하루 나카시마
Original Assignee
덴카 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 덴카 주식회사 filed Critical 덴카 주식회사
Publication of KR20220117227A publication Critical patent/KR20220117227A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/203—Solid polymers with solid and/or liquid additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H01L23/373—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020227019959A 2019-12-17 2020-12-11 수지 시트 및 그 제조 방법 Pending KR20220117227A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019227265 2019-12-17
JPJP-P-2019-227265 2019-12-17
PCT/JP2020/046334 WO2021125092A1 (ja) 2019-12-17 2020-12-11 樹脂シート及びその製造方法

Publications (1)

Publication Number Publication Date
KR20220117227A true KR20220117227A (ko) 2022-08-23

Family

ID=76476828

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227019959A Pending KR20220117227A (ko) 2019-12-17 2020-12-11 수지 시트 및 그 제조 방법

Country Status (6)

Country Link
US (1) US20230017856A1 (https=)
JP (1) JP7577687B2 (https=)
KR (1) KR20220117227A (https=)
CN (1) CN114829467B (https=)
TW (1) TWI855200B (https=)
WO (1) WO2021125092A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018203857A (ja) 2017-06-02 2018-12-27 日本ゼオン株式会社 熱伝導シート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060134A (ja) * 2001-08-17 2003-02-28 Polymatech Co Ltd 熱伝導性シート
JP6231031B2 (ja) 2015-02-24 2017-11-15 デンカ株式会社 熱伝導性粒子組成物、熱伝導性粒子組成物の製造方法、熱伝導性樹脂組成物および熱伝導性樹脂硬化体
JP6612584B2 (ja) 2015-10-28 2019-11-27 デンカ株式会社 エポキシ樹脂組成物、エポキシ樹脂シート、およびそれを用いた金属ベース回路基板
JP6786047B2 (ja) 2016-08-24 2020-11-18 三菱瓦斯化学株式会社 熱伝導シートの製造方法
JP6815152B2 (ja) * 2016-09-30 2021-01-20 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
EP3575369A4 (en) * 2017-01-30 2020-09-02 Sekisui Chemical Co., Ltd. RESIN AND LAMINATE MATERIAL
JPWO2018235918A1 (ja) 2017-06-23 2020-04-16 積水化学工業株式会社 樹脂材料、樹脂材料の製造方法及び積層体
JP7104503B2 (ja) * 2017-10-13 2022-07-21 デンカ株式会社 塊状窒化ホウ素粉末の製造方法及びそれを用いた放熱部材
US20220154059A1 (en) * 2019-03-27 2022-05-19 Denka Company Limited Boron nitride aggregated particles, thermal conductive resin composition, and heat dissipation member
JP7079378B2 (ja) 2019-03-28 2022-06-01 デンカ株式会社 窒化ホウ素粉末及びその製造方法、並びに、複合材及び放熱部材
EP4036174B1 (en) 2019-09-27 2025-05-21 FUJIFILM Corporation Composition for forming heat-conducting material, heat-conducting material, heat-conducting sheet, and device with heat-conducting layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018203857A (ja) 2017-06-02 2018-12-27 日本ゼオン株式会社 熱伝導シート

Also Published As

Publication number Publication date
US20230017856A1 (en) 2023-01-19
CN114829467A (zh) 2022-07-29
TW202132447A (zh) 2021-09-01
CN114829467B (zh) 2024-05-07
JP7577687B2 (ja) 2024-11-05
TWI855200B (zh) 2024-09-11
WO2021125092A1 (ja) 2021-06-24
JPWO2021125092A1 (https=) 2021-06-24

Similar Documents

Publication Publication Date Title
JP6313766B2 (ja) 窒化ホウ素−樹脂複合体回路基板、窒化ホウ素−樹脂複合体放熱板一体型回路基板
JP6023474B2 (ja) 熱伝導性絶縁シート、金属ベース基板及び回路基板、及びその製造方法
JP5330910B2 (ja) 樹脂組成物及びその用途
JP5652307B2 (ja) 加熱加圧成形用プリプレグおよび積層板
CN103068875B (zh) 树脂组合物及由该树脂组合物构成的成型体和基板材料以及含有该基板材料的电路基板
JP6612584B2 (ja) エポキシ樹脂組成物、エポキシ樹脂シート、およびそれを用いた金属ベース回路基板
TWI763868B (zh) 散熱片材、散熱片材之製造方法及積層體
JP5038007B2 (ja) 組成物、それを用いた金属ベース回路基板
JP7726065B2 (ja) 熱伝導性樹脂シート、積層放熱シート、放熱性回路基板、及び、パワー半導体デバイス
CN110546209B (zh) 树脂材料、树脂材料的制造方法及叠层体
KR101612596B1 (ko) 적층체 및 파워 반도체 모듈용 부품의 제조 방법
JP2012253167A (ja) 熱伝導性絶縁シート、金属ベース基板及び回路基板
JP2016192474A (ja) 造粒粉、放熱用樹脂組成物、放熱シート、放熱部材、および半導体装置
CN110546202A (zh) 树脂材料、树脂材料的制造方法以及叠层体
JP6458433B2 (ja) 造粒粉、放熱用樹脂組成物、放熱シート、半導体装置、および放熱部材
TW202033643A (zh) 散熱性樹脂組成物用無機粉體及使用此的散熱性樹脂組成物，以及該等的製造方法
JP2015189884A (ja) 熱硬化性樹脂組成物、樹脂シート、プリプレグ及び積層板
TWI774393B (zh) 樹脂組合物及電子零件
CN110234712A (zh) 树脂材料和叠层体
JP7257104B2 (ja) 積層体
EP4502000A1 (en) Thermosetting resin composition, resin cured product and composite molded body
JP7291118B2 (ja) 積層体
JP7643129B2 (ja) 樹脂組成物、熱伝導性樹脂シート、積層放熱シート、放熱性回路基板及びパワー半導体デバイス
JP2007153969A (ja) 高熱伝導性樹脂組成物および配線用基板
KR20220117227A (ko) 수지 시트 및 그 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701