KR20220105136A - 수지 조성물 및 수지 조성물 충전 완료 시린지 - Google Patents

수지 조성물 및 수지 조성물 충전 완료 시린지 Download PDF

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Publication number
KR20220105136A
KR20220105136A KR1020220006765A KR20220006765A KR20220105136A KR 20220105136 A KR20220105136 A KR 20220105136A KR 1020220006765 A KR1020220006765 A KR 1020220006765A KR 20220006765 A KR20220006765 A KR 20220006765A KR 20220105136 A KR20220105136 A KR 20220105136A
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KR
South Korea
Prior art keywords
resin composition
resin
dome
dispensing
silicon wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020220006765A
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English (en)
Korean (ko)
Inventor
히로유키 사카우치
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20220105136A publication Critical patent/KR20220105136A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H01L23/295—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)
  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
KR1020220006765A 2021-01-19 2022-01-17 수지 조성물 및 수지 조성물 충전 완료 시린지 Pending KR20220105136A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006651A JP7540347B2 (ja) 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ
JPJP-P-2021-006651 2021-01-19

Publications (1)

Publication Number Publication Date
KR20220105136A true KR20220105136A (ko) 2022-07-26

Family

ID=82527478

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220006765A Pending KR20220105136A (ko) 2021-01-19 2022-01-17 수지 조성물 및 수지 조성물 충전 완료 시린지

Country Status (4)

Country Link
JP (2) JP7540347B2 (https=)
KR (1) KR20220105136A (https=)
CN (1) CN114806080A (https=)
TW (1) TW202237369A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ
JPWO2025142909A1 (https=) * 2023-12-27 2025-07-03

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP2012188555A (ja) 2011-03-10 2012-10-04 Sumitomo Bakelite Co Ltd 半導体装置および半導体装置の製造方法
KR20160074920A (ko) 2014-12-19 2016-06-29 에스케이하이닉스 주식회사 메모리 장치
KR20200127919A (ko) 2020-09-14 2020-11-11 강성구 커먼레일 디젤엔진의 인젝터 고장진단방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201302907A (zh) 2011-06-01 2013-01-16 住友電木股份有限公司 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置
JP6009751B2 (ja) 2011-10-04 2016-10-19 積水化学工業株式会社 フリップチップ実装用封止剤及び半導体チップ実装体の製造方法
JP6540858B2 (ja) 2018-04-27 2019-07-10 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
JP7302331B2 (ja) 2019-06-26 2023-07-04 味の素株式会社 樹脂組成物
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP2012188555A (ja) 2011-03-10 2012-10-04 Sumitomo Bakelite Co Ltd 半導体装置および半導体装置の製造方法
KR20160074920A (ko) 2014-12-19 2016-06-29 에스케이하이닉스 주식회사 메모리 장치
KR20200127919A (ko) 2020-09-14 2020-11-11 강성구 커먼레일 디젤엔진의 인젝터 고장진단방법

Also Published As

Publication number Publication date
JP7540347B2 (ja) 2024-08-27
JP2022110920A (ja) 2022-07-29
JP7736098B2 (ja) 2025-09-09
CN114806080A (zh) 2022-07-29
TW202237369A (zh) 2022-10-01
JP2024069215A (ja) 2024-05-21

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