JP7540347B2 - 樹脂組成物及び樹脂組成物充填済みシリンジ - Google Patents

樹脂組成物及び樹脂組成物充填済みシリンジ Download PDF

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Publication number
JP7540347B2
JP7540347B2 JP2021006651A JP2021006651A JP7540347B2 JP 7540347 B2 JP7540347 B2 JP 7540347B2 JP 2021006651 A JP2021006651 A JP 2021006651A JP 2021006651 A JP2021006651 A JP 2021006651A JP 7540347 B2 JP7540347 B2 JP 7540347B2
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Prior art keywords
resin composition
resin
mass
dome
dispensing
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JP2021006651A
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English (en)
Japanese (ja)
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JP2022110920A (ja
Inventor
啓之 阪内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
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Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP2021006651A priority Critical patent/JP7540347B2/ja
Priority to TW110143104A priority patent/TW202237369A/zh
Priority to KR1020220006765A priority patent/KR20220105136A/ko
Priority to CN202210048324.7A priority patent/CN114806080A/zh
Publication of JP2022110920A publication Critical patent/JP2022110920A/ja
Priority to JP2024020521A priority patent/JP7736098B2/ja
Application granted granted Critical
Publication of JP7540347B2 publication Critical patent/JP7540347B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)
  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
JP2021006651A 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ Active JP7540347B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021006651A JP7540347B2 (ja) 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ
TW110143104A TW202237369A (zh) 2021-01-19 2021-11-19 樹脂組成物及已填充樹脂組成物之注射器
KR1020220006765A KR20220105136A (ko) 2021-01-19 2022-01-17 수지 조성물 및 수지 조성물 충전 완료 시린지
CN202210048324.7A CN114806080A (zh) 2021-01-19 2022-01-17 树脂组合物及填充有树脂组合物的注射器
JP2024020521A JP7736098B2 (ja) 2021-01-19 2024-02-14 樹脂組成物及び樹脂組成物充填済みシリンジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021006651A JP7540347B2 (ja) 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ

Related Child Applications (1)

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JP2024020521A Division JP7736098B2 (ja) 2021-01-19 2024-02-14 樹脂組成物及び樹脂組成物充填済みシリンジ

Publications (2)

Publication Number Publication Date
JP2022110920A JP2022110920A (ja) 2022-07-29
JP7540347B2 true JP7540347B2 (ja) 2024-08-27

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JP2021006651A Active JP7540347B2 (ja) 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ
JP2024020521A Active JP7736098B2 (ja) 2021-01-19 2024-02-14 樹脂組成物及び樹脂組成物充填済みシリンジ

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JP2024020521A Active JP7736098B2 (ja) 2021-01-19 2024-02-14 樹脂組成物及び樹脂組成物充填済みシリンジ

Country Status (4)

Country Link
JP (2) JP7540347B2 (https=)
KR (1) KR20220105136A (https=)
CN (1) CN114806080A (https=)
TW (1) TW202237369A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024069215A (ja) * 2021-01-19 2024-05-21 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025142909A1 (https=) * 2023-12-27 2025-07-03

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013010940A (ja) 2011-06-01 2013-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物およびそれを用いた半導体装置
JP2013080837A (ja) 2011-10-04 2013-05-02 Sekisui Chem Co Ltd フリップチップ実装用封止剤及び半導体チップ実装体の製造方法
JP2018123340A (ja) 2018-04-27 2018-08-09 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
JP2021004314A (ja) 2019-06-26 2021-01-14 味の素株式会社 樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP5799532B2 (ja) 2011-03-10 2015-10-28 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置および半導体装置の製造方法
KR20160074920A (ko) 2014-12-19 2016-06-29 에스케이하이닉스 주식회사 메모리 장치
KR20200127919A (ko) 2020-09-14 2020-11-11 강성구 커먼레일 디젤엔진의 인젝터 고장진단방법
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013010940A (ja) 2011-06-01 2013-01-17 Sumitomo Bakelite Co Ltd 液状樹脂組成物およびそれを用いた半導体装置
JP2013080837A (ja) 2011-10-04 2013-05-02 Sekisui Chem Co Ltd フリップチップ実装用封止剤及び半導体チップ実装体の製造方法
JP2018123340A (ja) 2018-04-27 2018-08-09 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
JP2021004314A (ja) 2019-06-26 2021-01-14 味の素株式会社 樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024069215A (ja) * 2021-01-19 2024-05-21 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ
JP7736098B2 (ja) 2021-01-19 2025-09-09 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

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Publication number Publication date
JP2022110920A (ja) 2022-07-29
KR20220105136A (ko) 2022-07-26
JP7736098B2 (ja) 2025-09-09
CN114806080A (zh) 2022-07-29
TW202237369A (zh) 2022-10-01
JP2024069215A (ja) 2024-05-21

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