CN114806080A - 树脂组合物及填充有树脂组合物的注射器 - Google Patents

树脂组合物及填充有树脂组合物的注射器 Download PDF

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Publication number
CN114806080A
CN114806080A CN202210048324.7A CN202210048324A CN114806080A CN 114806080 A CN114806080 A CN 114806080A CN 202210048324 A CN202210048324 A CN 202210048324A CN 114806080 A CN114806080 A CN 114806080A
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CN
China
Prior art keywords
resin composition
resin
dome
silicon wafer
dispensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210048324.7A
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English (en)
Chinese (zh)
Inventor
阪内启之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of CN114806080A publication Critical patent/CN114806080A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Containers And Packaging Bodies Having A Special Means To Remove Contents (AREA)
  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
CN202210048324.7A 2021-01-19 2022-01-17 树脂组合物及填充有树脂组合物的注射器 Pending CN114806080A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021006651A JP7540347B2 (ja) 2021-01-19 2021-01-19 樹脂組成物及び樹脂組成物充填済みシリンジ
JP2021-006651 2021-01-19

Publications (1)

Publication Number Publication Date
CN114806080A true CN114806080A (zh) 2022-07-29

Family

ID=82527478

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210048324.7A Pending CN114806080A (zh) 2021-01-19 2022-01-17 树脂组合物及填充有树脂组合物的注射器

Country Status (4)

Country Link
JP (2) JP7540347B2 (https=)
KR (1) KR20220105136A (https=)
CN (1) CN114806080A (https=)
TW (1) TW202237369A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ
JPWO2025142909A1 (https=) * 2023-12-27 2025-07-03

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004137370A (ja) 2002-10-17 2004-05-13 Hitachi Chem Co Ltd ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料
JP5799532B2 (ja) 2011-03-10 2015-10-28 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置および半導体装置の製造方法
TW201302907A (zh) 2011-06-01 2013-01-16 住友電木股份有限公司 液狀樹脂組成物及利用此液狀樹脂組成物之半導體裝置
JP6009751B2 (ja) 2011-10-04 2016-10-19 積水化学工業株式会社 フリップチップ実装用封止剤及び半導体チップ実装体の製造方法
KR20160074920A (ko) 2014-12-19 2016-06-29 에스케이하이닉스 주식회사 메모리 장치
JP6540858B2 (ja) 2018-04-27 2019-07-10 日立化成株式会社 アンダーフィル材及び該アンダーフィル材により封止する電子部品とその製造方法
JP7302331B2 (ja) 2019-06-26 2023-07-04 味の素株式会社 樹脂組成物
KR20200127919A (ko) 2020-09-14 2020-11-11 강성구 커먼레일 디젤엔진의 인젝터 고장진단방법
JP7540347B2 (ja) * 2021-01-19 2024-08-27 味の素株式会社 樹脂組成物及び樹脂組成物充填済みシリンジ

Also Published As

Publication number Publication date
JP7540347B2 (ja) 2024-08-27
JP2022110920A (ja) 2022-07-29
KR20220105136A (ko) 2022-07-26
JP7736098B2 (ja) 2025-09-09
TW202237369A (zh) 2022-10-01
JP2024069215A (ja) 2024-05-21

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