KR20210146410A - 본딩 장치, 프레임 피더 및 히터 유닛 - Google Patents

본딩 장치, 프레임 피더 및 히터 유닛 Download PDF

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Publication number
KR20210146410A
KR20210146410A KR1020217037044A KR20217037044A KR20210146410A KR 20210146410 A KR20210146410 A KR 20210146410A KR 1020217037044 A KR1020217037044 A KR 1020217037044A KR 20217037044 A KR20217037044 A KR 20217037044A KR 20210146410 A KR20210146410 A KR 20210146410A
Authority
KR
South Korea
Prior art keywords
lead frame
unit
bonding
heater
heater block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020217037044A
Other languages
English (en)
Korean (ko)
Inventor
카즈아키 나가노
마사토 코지마
타카마사 미야치카
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20210146410A publication Critical patent/KR20210146410A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H01L24/78—
    • H01L21/67144—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H01L2224/78281—
    • H01L2224/78501—
    • H01L2224/7865—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
KR1020217037044A 2020-03-06 2020-03-06 본딩 장치, 프레임 피더 및 히터 유닛 Withdrawn KR20210146410A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (1)

Publication Number Publication Date
KR20210146410A true KR20210146410A (ko) 2021-12-03

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217037044A Withdrawn KR20210146410A (ko) 2020-03-06 2020-03-06 본딩 장치, 프레임 피더 및 히터 유닛

Country Status (5)

Country Link
JP (1) JP7216451B2 (https=)
KR (1) KR20210146410A (https=)
CN (1) CN113785385A (https=)
SG (1) SG11202111143PA (https=)
WO (1) WO2021176739A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682472B (zh) * 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169340A (ja) 1986-01-21 1987-07-25 Nec Corp 半導体装置組立用ワイヤボンデイング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529343B2 (ja) * 1988-03-24 1996-08-28 松下電器産業株式会社 ワイヤボンディング装置
JP2531024Y2 (ja) * 1988-10-05 1997-04-02 松下電器産業株式会社 セラミック基板の共晶加熱ボンディング装置
JP3231882B2 (ja) * 1993-03-09 2001-11-26 ソニー株式会社 リードフレームの加熱機構
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록
TWI682472B (zh) 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169340A (ja) 1986-01-21 1987-07-25 Nec Corp 半導体装置組立用ワイヤボンデイング装置

Also Published As

Publication number Publication date
CN113785385A (zh) 2021-12-10
SG11202111143PA (en) 2021-11-29
JPWO2021176739A1 (https=) 2021-09-10
JP7216451B2 (ja) 2023-02-01
WO2021176739A1 (ja) 2021-09-10

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PC1202 Submission of document of withdrawal before decision of registration

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000