JP7216451B2 - ボンディング装置、フレームフィーダ及びヒータユニット - Google Patents

ボンディング装置、フレームフィーダ及びヒータユニット Download PDF

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Publication number
JP7216451B2
JP7216451B2 JP2021549567A JP2021549567A JP7216451B2 JP 7216451 B2 JP7216451 B2 JP 7216451B2 JP 2021549567 A JP2021549567 A JP 2021549567A JP 2021549567 A JP2021549567 A JP 2021549567A JP 7216451 B2 JP7216451 B2 JP 7216451B2
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JP
Japan
Prior art keywords
lead frame
bonding
heater
unit
depth direction
Prior art date
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Active
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JP2021549567A
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English (en)
Japanese (ja)
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JPWO2021176739A1 (https=
Inventor
一昭 長野
和仁 小島
峻匡 宮近
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
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Shinkawa Ltd
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Publication date
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Publication of JPWO2021176739A1 publication Critical patent/JPWO2021176739A1/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2021549567A 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット Active JP7216451B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (2)

Publication Number Publication Date
JPWO2021176739A1 JPWO2021176739A1 (https=) 2021-09-10
JP7216451B2 true JP7216451B2 (ja) 2023-02-01

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549567A Active JP7216451B2 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Country Status (5)

Country Link
JP (1) JP7216451B2 (https=)
KR (1) KR20210146410A (https=)
CN (1) CN113785385A (https=)
SG (1) SG11202111143PA (https=)
WO (1) WO2021176739A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682472B (zh) * 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026916A1 (ja) 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置
JP2529343B2 (ja) * 1988-03-24 1996-08-28 松下電器産業株式会社 ワイヤボンディング装置
JP2531024Y2 (ja) * 1988-10-05 1997-04-02 松下電器産業株式会社 セラミック基板の共晶加熱ボンディング装置
JP3231882B2 (ja) * 1993-03-09 2001-11-26 ソニー株式会社 リードフレームの加熱機構
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019026916A1 (ja) 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Also Published As

Publication number Publication date
CN113785385A (zh) 2021-12-10
SG11202111143PA (en) 2021-11-29
JPWO2021176739A1 (https=) 2021-09-10
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10

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