CN113785385A - 接合装置、导线架馈入器以及加热单元 - Google Patents

接合装置、导线架馈入器以及加热单元 Download PDF

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Publication number
CN113785385A
CN113785385A CN202080028931.6A CN202080028931A CN113785385A CN 113785385 A CN113785385 A CN 113785385A CN 202080028931 A CN202080028931 A CN 202080028931A CN 113785385 A CN113785385 A CN 113785385A
Authority
CN
China
Prior art keywords
lead frame
heating
bonding
heating block
heating unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080028931.6A
Other languages
English (en)
Chinese (zh)
Inventor
长野一昭
小岛和仁
宫近峻匡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN113785385A publication Critical patent/CN113785385A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

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  • Wire Bonding (AREA)
  • Die Bonding (AREA)
CN202080028931.6A 2020-03-06 2020-03-06 接合装置、导线架馈入器以及加热单元 Pending CN113785385A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (1)

Publication Number Publication Date
CN113785385A true CN113785385A (zh) 2021-12-10

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080028931.6A Pending CN113785385A (zh) 2020-03-06 2020-03-06 接合装置、导线架馈入器以及加热单元

Country Status (5)

Country Link
JP (1) JP7216451B2 (https=)
KR (1) KR20210146410A (https=)
CN (1) CN113785385A (https=)
SG (1) SG11202111143PA (https=)
WO (1) WO2021176739A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682472B (zh) * 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (https=) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
KR20000050301A (ko) * 1999-01-05 2000-08-05 윤종용 롱 루프 와이어 본딩을 위한 히터블록
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (https=) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
KR20000050301A (ko) * 1999-01-05 2000-08-05 윤종용 롱 루프 와이어 본딩을 위한 히터블록
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Also Published As

Publication number Publication date
SG11202111143PA (en) 2021-11-29
JPWO2021176739A1 (https=) 2021-09-10
JP7216451B2 (ja) 2023-02-01
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10

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Application publication date: 20211210

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