SG11202111143PA - Bonding apparatus, frame feeder, and heater unit - Google Patents

Bonding apparatus, frame feeder, and heater unit

Info

Publication number
SG11202111143PA
SG11202111143PA SG11202111143PA SG11202111143PA SG11202111143PA SG 11202111143P A SG11202111143P A SG 11202111143PA SG 11202111143P A SG11202111143P A SG 11202111143PA SG 11202111143P A SG11202111143P A SG 11202111143PA SG 11202111143P A SG11202111143P A SG 11202111143PA
Authority
SG
Singapore
Prior art keywords
lead frame
heater
bonding
fins
heater block
Prior art date
Application number
SG11202111143PA
Other languages
English (en)
Inventor
Kazuaki Nagano
Masato Kojima
Takamasa Miyachika
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202111143PA publication Critical patent/SG11202111143PA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG11202111143PA 2020-03-06 2020-03-06 Bonding apparatus, frame feeder, and heater unit SG11202111143PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (1)

Publication Number Publication Date
SG11202111143PA true SG11202111143PA (en) 2021-11-29

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202111143PA SG11202111143PA (en) 2020-03-06 2020-03-06 Bonding apparatus, frame feeder, and heater unit

Country Status (5)

Country Link
JP (1) JP7216451B2 (https=)
KR (1) KR20210146410A (https=)
CN (1) CN113785385A (https=)
SG (1) SG11202111143PA (https=)
WO (1) WO2021176739A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682472B (zh) * 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置
JP2529343B2 (ja) * 1988-03-24 1996-08-28 松下電器産業株式会社 ワイヤボンディング装置
JP2531024Y2 (ja) * 1988-10-05 1997-04-02 松下電器産業株式会社 セラミック基板の共晶加熱ボンディング装置
JP3231882B2 (ja) * 1993-03-09 2001-11-26 ソニー株式会社 リードフレームの加熱機構
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록
TWI682472B (zh) 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Also Published As

Publication number Publication date
CN113785385A (zh) 2021-12-10
JPWO2021176739A1 (https=) 2021-09-10
JP7216451B2 (ja) 2023-02-01
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10

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