JPWO2021176739A1 - - Google Patents

Info

Publication number
JPWO2021176739A1
JPWO2021176739A1 JP2021549567A JP2021549567A JPWO2021176739A1 JP WO2021176739 A1 JPWO2021176739 A1 JP WO2021176739A1 JP 2021549567 A JP2021549567 A JP 2021549567A JP 2021549567 A JP2021549567 A JP 2021549567A JP WO2021176739 A1 JPWO2021176739 A1 JP WO2021176739A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021549567A
Other languages
Japanese (ja)
Other versions
JP7216451B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021176739A1 publication Critical patent/JPWO2021176739A1/ja
Application granted granted Critical
Publication of JP7216451B2 publication Critical patent/JP7216451B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07152—Means for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2021549567A 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット Active JP7216451B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/009886 WO2021176739A1 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Publications (2)

Publication Number Publication Date
JPWO2021176739A1 true JPWO2021176739A1 (https=) 2021-09-10
JP7216451B2 JP7216451B2 (ja) 2023-02-01

Family

ID=77614184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549567A Active JP7216451B2 (ja) 2020-03-06 2020-03-06 ボンディング装置、フレームフィーダ及びヒータユニット

Country Status (5)

Country Link
JP (1) JP7216451B2 (https=)
KR (1) KR20210146410A (https=)
CN (1) CN113785385A (https=)
SG (1) SG11202111143PA (https=)
WO (1) WO2021176739A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI682472B (zh) * 2017-08-01 2020-01-11 日商新川股份有限公司 框架饋入器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (https=) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0646646B2 (ja) 1986-01-21 1994-06-15 日本電気株式会社 半導体装置組立用ワイヤボンデイング装置
KR100546280B1 (ko) * 1999-01-05 2006-01-26 삼성전자주식회사 롱 루프 와이어 본딩을 위한 히터블록

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01241837A (ja) * 1988-03-24 1989-09-26 Matsushita Electric Ind Co Ltd ワイヤボンディング装置
JPH0252334U (https=) * 1988-10-05 1990-04-16
JPH06260526A (ja) * 1993-03-09 1994-09-16 Sony Corp リードフレームの加熱機構
WO2019026916A1 (ja) * 2017-08-01 2019-02-07 株式会社新川 フレームフィーダ

Also Published As

Publication number Publication date
CN113785385A (zh) 2021-12-10
SG11202111143PA (en) 2021-11-29
JP7216451B2 (ja) 2023-02-01
KR20210146410A (ko) 2021-12-03
WO2021176739A1 (ja) 2021-09-10

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