KR20210143761A - 표면 처리 동박, 그리고 이것을 이용한 동클래드 적층판 및 프린트 배선판 - Google Patents
표면 처리 동박, 그리고 이것을 이용한 동클래드 적층판 및 프린트 배선판 Download PDFInfo
- Publication number
- KR20210143761A KR20210143761A KR1020217029665A KR20217029665A KR20210143761A KR 20210143761 A KR20210143761 A KR 20210143761A KR 1020217029665 A KR1020217029665 A KR 1020217029665A KR 20217029665 A KR20217029665 A KR 20217029665A KR 20210143761 A KR20210143761 A KR 20210143761A
- Authority
- KR
- South Korea
- Prior art keywords
- particle
- copper foil
- roughened
- roughening
- treated
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 182
- 239000011889 copper foil Substances 0.000 title claims abstract description 155
- 239000010949 copper Substances 0.000 title abstract description 32
- 229910052802 copper Inorganic materials 0.000 title abstract description 28
- 239000002245 particle Substances 0.000 claims abstract description 293
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 238000007788 roughening Methods 0.000 claims description 146
- 238000000034 method Methods 0.000 claims description 82
- 230000005540 biological transmission Effects 0.000 abstract description 43
- 239000000843 powder Substances 0.000 abstract description 19
- 239000004020 conductor Substances 0.000 abstract description 13
- 239000011347 resin Substances 0.000 description 51
- 229920005989 resin Polymers 0.000 description 51
- 238000011156 evaluation Methods 0.000 description 46
- 238000007747 plating Methods 0.000 description 42
- 238000012360 testing method Methods 0.000 description 29
- 238000005259 measurement Methods 0.000 description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 239000006087 Silane Coupling Agent Substances 0.000 description 19
- 238000012545 processing Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 239000011701 zinc Substances 0.000 description 17
- 239000011651 chromium Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000008961 swelling Effects 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 10
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 10
- 230000002265 prevention Effects 0.000 description 10
- 229910000077 silane Inorganic materials 0.000 description 10
- 239000000243 solution Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910052725 zinc Inorganic materials 0.000 description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000001878 scanning electron micrograph Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910000365 copper sulfate Inorganic materials 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229920001955 polyphenylene ether Polymers 0.000 description 4
- 238000000992 sputter etching Methods 0.000 description 4
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000003287 bathing Methods 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- FRTIVUOKBXDGPD-UHFFFAOYSA-M sodium;3-sulfanylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CCCS FRTIVUOKBXDGPD-UHFFFAOYSA-M 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- -1 that is Substances 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019059395A JP6816193B2 (ja) | 2019-03-26 | 2019-03-26 | 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 |
| JPJP-P-2019-059395 | 2019-03-26 | ||
| PCT/JP2020/012303 WO2020196265A1 (ja) | 2019-03-26 | 2020-03-19 | 表面処理銅箔、並びにこれを用いた銅張積層板及びプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20210143761A true KR20210143761A (ko) | 2021-11-29 |
| KR102706307B1 KR102706307B1 (ko) | 2024-09-11 |
Family
ID=72609848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020217029665A KR102706307B1 (ko) | 2019-03-26 | 2020-03-19 | 표면 처리 동박, 그리고 이것을 이용한 동클래드 적층판 및 프린트 배선판 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6816193B2 (zh) |
| KR (1) | KR102706307B1 (zh) |
| CN (1) | CN113795614B (zh) |
| TW (1) | TWI742575B (zh) |
| WO (1) | WO2020196265A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117083419A (zh) * | 2021-03-26 | 2023-11-17 | 三菱综合材料株式会社 | 金属板材、层叠体、绝缘电路基板以及金属板材的制造方法 |
| JP2022157676A (ja) * | 2021-03-31 | 2022-10-14 | 古河電気工業株式会社 | 紫外線吸収シート、紫外線吸収シートに用いる金属箔および内装材 |
| KR20230110591A (ko) * | 2021-07-09 | 2023-07-24 | 제이엑스금속주식회사 | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 |
| CN116867929A (zh) * | 2021-07-09 | 2023-10-10 | Ｊｘ金属株式会社 | 表面处理铜箔、覆铜积层板及印刷配线板 |
| CN117062943A (zh) * | 2021-07-09 | 2023-11-14 | Ｊｘ金属株式会社 | 表面处理铜箔、覆铜积层板及印刷配线板 |
| JPWO2023281778A1 (zh) * | 2021-07-09 | 2023-01-12 | ||
| CN116867930A (zh) * | 2021-07-09 | 2023-10-10 | Ｊｘ金属株式会社 | 表面处理铜箔、覆铜积层板及印刷配线板 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015147978A (ja) | 2014-02-06 | 2015-08-20 | 古河電気工業株式会社 | 高周波回路用銅箔、銅張積層板及びプリント配線板 |
| JP2017515456A (ja) | 2014-05-16 | 2017-06-15 | ソンホ チョ | 植木鉢の加湿兼用自動給水装置 |
| JP2017520558A (ja) | 2014-06-24 | 2017-07-27 | ダウ アグロサイエンシィズ エルエルシー | ある種の農薬的利用性を有する分子、ならびにそれに関する中間体、組成物および方法 |
| WO2018181726A1 (ja) * | 2017-03-30 | 2018-10-04 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 |
| JP2018172790A (ja) | 2017-03-31 | 2018-11-08 | Ｊｘ金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
| WO2019021895A1 (ja) * | 2017-07-24 | 2019-01-31 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028638B (zh) * | 2010-09-27 | 2019-09-03 | 吉坤日矿日石金属株式会社 | 印刷电路板用铜箔、其制造方法以及印刷电路板 |
| CN107429417B (zh) * | 2015-03-31 | 2019-11-22 | 三井金属矿业株式会社 | 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板 |
| JP6200042B2 (ja) * | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP2018145519A (ja) * | 2017-03-03 | 2018-09-20 | Ｊｘ金属株式会社 | 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP7492808B2 (ja) * | 2017-03-31 | 2024-05-30 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
-
2019
- 2019-03-26 JP JP2019059395A patent/JP6816193B2/ja active Active
-
2020
- 2020-03-19 KR KR1020217029665A patent/KR102706307B1/ko active IP Right Grant
- 2020-03-19 WO PCT/JP2020/012303 patent/WO2020196265A1/ja active Application Filing
- 2020-03-19 TW TW109109266A patent/TWI742575B/zh active
- 2020-03-19 CN CN202080023613.0A patent/CN113795614B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015147978A (ja) | 2014-02-06 | 2015-08-20 | 古河電気工業株式会社 | 高周波回路用銅箔、銅張積層板及びプリント配線板 |
| JP2017515456A (ja) | 2014-05-16 | 2017-06-15 | ソンホ チョ | 植木鉢の加湿兼用自動給水装置 |
| JP2017520558A (ja) | 2014-06-24 | 2017-07-27 | ダウ アグロサイエンシィズ エルエルシー | ある種の農薬的利用性を有する分子、ならびにそれに関する中間体、組成物および方法 |
| WO2018181726A1 (ja) * | 2017-03-30 | 2018-10-04 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 |
| JP2018172790A (ja) | 2017-03-31 | 2018-11-08 | Ｊｘ金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
| WO2019021895A1 (ja) * | 2017-07-24 | 2019-01-31 | 古河電気工業株式会社 | 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020196265A1 (ja) | 2020-10-01 |
| TWI742575B (zh) | 2021-10-11 |
| CN113795614B (zh) | 2024-03-26 |
| TW202100812A (zh) | 2021-01-01 |
| CN113795614A (zh) | 2021-12-14 |
| JP2020158832A (ja) | 2020-10-01 |
| JP6816193B2 (ja) | 2021-01-20 |
| KR102706307B1 (ko) | 2024-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20210143761A (ko) | 표면 처리 동박, 그리고 이것을 이용한 동클래드 적층판 및 프린트 배선판 | |
| KR101853519B1 (ko) | 액정 폴리머 구리 피복 적층판 및 당해 적층판에 사용하는 구리박 | |
| CN104717831B (zh) | 表面处理铜箔、层压板、印刷布线板、电子机器、附载体铜箔、及印刷布线板的制造方法 | |
| TWI716210B (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| JP7019876B1 (ja) | プリント配線板用表面処理銅箔、並びにこれを用いたプリント配線板用銅張積層板及びプリント配線板 | |
| TW202122642A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| WO2022176648A1 (ja) | 表面処理銅箔 | |
| TW202122641A (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| TWI747088B (zh) | 表面處理銅箔、覆銅積層板及印刷配線板 | |
| KR102353143B1 (ko) | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 | |
| KR101623713B1 (ko) | 인쇄 회로용 동박 | |
| KR20220013547A (ko) | 표면 처리 동박, 동클래드 적층판 및, 프린트 배선판 | |
| KR102390417B1 (ko) | 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판 | |
| WO2024070248A1 (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
| WO2024070247A1 (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
| WO2024070246A1 (ja) | 表面処理銅箔、銅張積層板及びプリント配線板 | |
| KR20230121117A (ko) | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 | |
| KR20230113357A (ko) | 표면 처리 구리박, 동장 적층판 및 프린트 배선판 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| GRNT | Written decision to grant |