KR20210141455A - 보호막 형성용 시트 및 기판 장치의 제조 방법 - Google Patents
보호막 형성용 시트 및 기판 장치의 제조 방법 Download PDFInfo
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- KR20210141455A KR20210141455A KR1020217025337A KR20217025337A KR20210141455A KR 20210141455 A KR20210141455 A KR 20210141455A KR 1020217025337 A KR1020217025337 A KR 1020217025337A KR 20217025337 A KR20217025337 A KR 20217025337A KR 20210141455 A KR20210141455 A KR 20210141455A
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Images
Classifications
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
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JPJP-P-2019-048936 | 2019-03-15 | ||
JP2019048936 | 2019-03-15 | ||
PCT/JP2020/010590 WO2020189447A1 (ja) | 2019-03-15 | 2020-03-11 | 保護膜形成用シートおよび基板装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
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KR20210141455A true KR20210141455A (ko) | 2021-11-23 |
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Family Applications (1)
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KR1020217025337A KR20210141455A (ko) | 2019-03-15 | 2020-03-11 | 보호막 형성용 시트 및 기판 장치의 제조 방법 |
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JP (1) | JP7340007B2 (ja) |
KR (1) | KR20210141455A (ja) |
CN (1) | CN113396057B (ja) |
TW (1) | TW202100701A (ja) |
WO (1) | WO2020189447A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2023102566A (ja) | 2022-01-12 | 2023-07-25 | リンテック株式会社 | 第1保護膜形成用シート、半導体装置の製造方法、及びシートの使用 |
JP2023102567A (ja) | 2022-01-12 | 2023-07-25 | リンテック株式会社 | 第1保護膜形成用シート、半導体装置の製造方法、及びシートの使用 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
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JP4877689B2 (ja) * | 2001-08-30 | 2012-02-15 | 日東電工株式会社 | エネルギー線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
CN101189317A (zh) * | 2005-06-06 | 2008-05-28 | 积水化学工业株式会社 | 表面保护膜 |
JP4810565B2 (ja) * | 2008-11-26 | 2011-11-09 | 日東電工株式会社 | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
JP6386696B1 (ja) * | 2016-10-03 | 2018-09-05 | リンテック株式会社 | 半導体加工用粘着テープおよび半導体装置の製造方法 |
JP6820724B2 (ja) * | 2016-11-18 | 2021-01-27 | 積水化学工業株式会社 | 半導体デバイスの製造方法及び保護テープ |
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2020
- 2020-03-11 JP JP2021507241A patent/JP7340007B2/ja active Active
- 2020-03-11 KR KR1020217025337A patent/KR20210141455A/ko not_active Application Discontinuation
- 2020-03-11 WO PCT/JP2020/010590 patent/WO2020189447A1/ja active Application Filing
- 2020-03-11 CN CN202080012109.0A patent/CN113396057B/zh active Active
- 2020-03-13 TW TW109108379A patent/TW202100701A/zh unknown
Patent Citations (1)
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JP2015092594A (ja) | 2014-12-10 | 2015-05-14 | 日東電工株式会社 | 保護層形成用フィルム |
Also Published As
Publication number | Publication date |
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CN113396057A (zh) | 2021-09-14 |
JPWO2020189447A1 (ja) | 2020-09-24 |
WO2020189447A1 (ja) | 2020-09-24 |
CN113396057B (zh) | 2022-11-04 |
TW202100701A (zh) | 2021-01-01 |
JP7340007B2 (ja) | 2023-09-06 |
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