KR20210130696A - 열경화성 수지 필름 및 제1 보호막 형성용 시트 - Google Patents

열경화성 수지 필름 및 제1 보호막 형성용 시트 Download PDF

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Publication number
KR20210130696A
KR20210130696A KR1020217009867A KR20217009867A KR20210130696A KR 20210130696 A KR20210130696 A KR 20210130696A KR 1020217009867 A KR1020217009867 A KR 1020217009867A KR 20217009867 A KR20217009867 A KR 20217009867A KR 20210130696 A KR20210130696 A KR 20210130696A
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KR
South Korea
Prior art keywords
thermosetting resin
resin film
thermosetting
protective film
film
Prior art date
Application number
KR1020217009867A
Other languages
English (en)
Korean (ko)
Inventor
케이스케 시노미야
모토키 노즈에
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20210130696A publication Critical patent/KR20210130696A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
KR1020217009867A 2019-02-26 2020-02-25 열경화성 수지 필름 및 제1 보호막 형성용 시트 KR20210130696A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-032828 2019-02-26
JP2019032828 2019-02-26
PCT/JP2020/007293 WO2020175421A1 (ja) 2019-02-26 2020-02-25 熱硬化性樹脂フィルム及び第１保護膜形成用シート

Publications (1)

Publication Number Publication Date
KR20210130696A true KR20210130696A (ko) 2021-11-01

Family

ID=72239176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217009867A KR20210130696A (ko) 2019-02-26 2020-02-25 열경화성 수지 필름 및 제1 보호막 형성용 시트

Country Status (5)

Country Link
JP (1) JPWO2020175421A1 (ja)
KR (1) KR20210130696A (ja)
CN (1) CN112805824A (ja)
TW (1) TWI834820B (ja)
WO (1) WO2020175421A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5662810B2 (ja) * 2011-01-14 2015-02-04 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
JP5830250B2 (ja) * 2011-02-15 2015-12-09 日東電工株式会社 半導体装置の製造方法
JP5666335B2 (ja) * 2011-02-15 2015-02-12 日東電工株式会社 保護層形成用フィルム
JP6393449B2 (ja) * 2012-03-27 2018-09-19 リンテック株式会社 接着剤組成物、接着シートおよび半導体装置の製造方法
KR102587310B1 (ko) * 2015-11-04 2023-10-10 린텍 가부시키가이샤 경화성 수지 필름 및 제1 보호막 형성용 시트
WO2017077958A1 (ja) * 2015-11-04 2017-05-11 リンテック株式会社 半導体装置の製造方法
KR102303923B1 (ko) * 2016-04-28 2021-09-17 린텍 가부시키가이샤 보호막 형성용 필름, 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
CN110249414B (zh) * 2017-02-09 2023-04-04 琳得科株式会社 固化性树脂膜及第一保护膜形成用片
JP6914698B2 (ja) * 2017-03-31 2021-08-04 リンテック株式会社 樹脂膜形成用複合シート

Also Published As

Publication number Publication date
TW202104508A (zh) 2021-02-01
TWI834820B (zh) 2024-03-11
WO2020175421A1 (ja) 2020-09-03
JPWO2020175421A1 (ja) 2021-12-23
CN112805824A (zh) 2021-05-14

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