KR20210055676A - Led 표시 패널 제조 방법 및 led 표시 패널 - Google Patents
Led 표시 패널 제조 방법 및 led 표시 패널 Download PDFInfo
- Publication number
- KR20210055676A KR20210055676A KR1020217004277A KR20217004277A KR20210055676A KR 20210055676 A KR20210055676 A KR 20210055676A KR 1020217004277 A KR1020217004277 A KR 1020217004277A KR 20217004277 A KR20217004277 A KR 20217004277A KR 20210055676 A KR20210055676 A KR 20210055676A
- Authority
- KR
- South Korea
- Prior art keywords
- light
- led
- display panel
- shielding wall
- array substrate
- Prior art date
Links
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- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
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- 229910052759 nickel Inorganic materials 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 1
- VAYOSLLFUXYJDT-RDTXWAMCSA-N Lysergic acid diethylamide Chemical compound C1=CC(C=2[C@H](N(C)C[C@@H](C=2)C(=O)N(CC)CC)C2)=C3C2=CNC3=C1 VAYOSLLFUXYJDT-RDTXWAMCSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Optical Filters (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-167241 | 2018-09-06 | ||
JP2018167241A JP2020043140A (ja) | 2018-09-06 | 2018-09-06 | Led表示パネルの製造方法及びled表示パネル |
PCT/JP2019/029601 WO2020049896A1 (ja) | 2018-09-06 | 2019-07-29 | Led表示パネルの製造方法及びled表示パネル |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20210055676A true KR20210055676A (ko) | 2021-05-17 |
Family
ID=69722864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217004277A KR20210055676A (ko) | 2018-09-06 | 2019-07-29 | Led 표시 패널 제조 방법 및 led 표시 패널 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2020043140A (ja) |
KR (1) | KR20210055676A (ja) |
CN (1) | CN112655099A (ja) |
TW (1) | TW202025474A (ja) |
WO (1) | WO2020049896A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113782552A (zh) * | 2020-06-10 | 2021-12-10 | 旭丰半导体股份有限公司 | 具有微芯片阵列的光学组件制造方法及该组件 |
CN111681985B (zh) * | 2020-06-23 | 2023-06-23 | 广东聚华印刷显示技术有限公司 | 显示面板剥离方法 |
CN112164334B (zh) * | 2020-10-27 | 2022-08-26 | 湖北长江新型显示产业创新中心有限公司 | 显示面板、显示装置及显示面板的制备方法 |
CN112802949B (zh) * | 2021-03-30 | 2021-07-06 | 北京芯海视界三维科技有限公司 | 显示器件的制作方法 |
JP2024017711A (ja) * | 2022-07-28 | 2024-02-08 | デクセリアルズ株式会社 | 発光装置の製造方法及び黒色転写フィルム |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016523450A (ja) | 2013-06-18 | 2016-08-08 | ルクスビュー テクノロジー コーポレイション | 波長変換層を有するledディスプレイ |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010087224A (ja) * | 2008-09-30 | 2010-04-15 | Toyoda Gosei Co Ltd | Led表示装置およびled表示装置用隔壁の製造方法 |
TWI594661B (zh) * | 2013-04-19 | 2017-08-01 | 隆達電子股份有限公司 | 發光二極體顯示器及其製造方法 |
US8987765B2 (en) * | 2013-06-17 | 2015-03-24 | LuxVue Technology Corporation | Reflective bank structure and method for integrating a light emitting device |
JP2015215429A (ja) * | 2014-05-09 | 2015-12-03 | 株式会社明電舎 | Led表示装置及びled表示装置の製造方法 |
KR102427644B1 (ko) * | 2015-11-16 | 2022-08-02 | 삼성전자주식회사 | 광원 모듈, 광원 모듈의 제조방법 및 이를 포함하는 디스플레이 장치 |
US10606121B2 (en) * | 2016-09-12 | 2020-03-31 | Seoul Semiconductor Co., Ltd. | Display apparatus |
JP2019102664A (ja) * | 2017-12-04 | 2019-06-24 | 株式会社ブイ・テクノロジー | Led表示パネルの製造方法 |
-
2018
- 2018-09-06 JP JP2018167241A patent/JP2020043140A/ja active Pending
-
2019
- 2019-07-29 KR KR1020217004277A patent/KR20210055676A/ko unknown
- 2019-07-29 CN CN201980057901.5A patent/CN112655099A/zh active Pending
- 2019-07-29 WO PCT/JP2019/029601 patent/WO2020049896A1/ja active Application Filing
- 2019-08-08 TW TW108128223A patent/TW202025474A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016523450A (ja) | 2013-06-18 | 2016-08-08 | ルクスビュー テクノロジー コーポレイション | 波長変換層を有するledディスプレイ |
Also Published As
Publication number | Publication date |
---|---|
WO2020049896A1 (ja) | 2020-03-12 |
CN112655099A (zh) | 2021-04-13 |
TW202025474A (zh) | 2020-07-01 |
JP2020043140A (ja) | 2020-03-19 |
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