CN112655099A - Led显示面板的制造方法以及led显示面板 - Google Patents

Led显示面板的制造方法以及led显示面板 Download PDF

Info

Publication number
CN112655099A
CN112655099A CN201980057901.5A CN201980057901A CN112655099A CN 112655099 A CN112655099 A CN 112655099A CN 201980057901 A CN201980057901 A CN 201980057901A CN 112655099 A CN112655099 A CN 112655099A
Authority
CN
China
Prior art keywords
light
shielding wall
display panel
led
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980057901.5A
Other languages
English (en)
Chinese (zh)
Inventor
柳川良胜
平野贵文
深谷康一郎
大仓直也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
V Technology Co Ltd
Original Assignee
V Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by V Technology Co Ltd filed Critical V Technology Co Ltd
Publication of CN112655099A publication Critical patent/CN112655099A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Optical Filters (AREA)
CN201980057901.5A 2018-09-06 2019-07-29 Led显示面板的制造方法以及led显示面板 Pending CN112655099A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018167241A JP2020043140A (ja) 2018-09-06 2018-09-06 Ｌｅｄ表示パネルの製造方法及びｌｅｄ表示パネル
JP2018-167241 2018-09-06
PCT/JP2019/029601 WO2020049896A1 (ja) 2018-09-06 2019-07-29 Ｌｅｄ表示パネルの製造方法及びｌｅｄ表示パネル

Publications (1)

Publication Number Publication Date
CN112655099A true CN112655099A (zh) 2021-04-13

Family

ID=69722864

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980057901.5A Pending CN112655099A (zh) 2018-09-06 2019-07-29 Led显示面板的制造方法以及led显示面板

Country Status (5)

Country Link
JP (1) JP2020043140A (ja)
KR (1) KR20210055676A (ja)
CN (1) CN112655099A (ja)
TW (1) TW202025474A (ja)
WO (1) WO2020049896A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113782552A (zh) * 2020-06-10 2021-12-10 旭丰半导体股份有限公司 具有微芯片阵列的光学组件制造方法及该组件
CN111681985B (zh) * 2020-06-23 2023-06-23 广东聚华印刷显示技术有限公司 显示面板剥离方法
CN112164334B (zh) * 2020-10-27 2022-08-26 湖北长江新型显示产业创新中心有限公司 显示面板、显示装置及显示面板的制备方法
CN112802949B (zh) * 2021-03-30 2021-07-06 北京芯海视界三维科技有限公司 显示器件的制作方法
JP2024017711A (ja) * 2022-07-28 2024-02-08 デクセリアルズ株式会社 発光装置の製造方法及び黒色転写フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087224A (ja) * 2008-09-30 2010-04-15 Toyoda Gosei Co Ltd Ｌｅｄ表示装置およびｌｅｄ表示装置用隔壁の製造方法
TWI594661B (zh) * 2013-04-19 2017-08-01 隆達電子股份有限公司 發光二極體顯示器及其製造方法
US8987765B2 (en) * 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
JP2015215429A (ja) * 2014-05-09 2015-12-03 株式会社明電舎 Ｌｅｄ表示装置及びｌｅｄ表示装置の製造方法
KR102427644B1 (ko) * 2015-11-16 2022-08-02 삼성전자주식회사 광원 모듈, 광원 모듈의 제조방법 및 이를 포함하는 디스플레이 장치
US10606121B2 (en) * 2016-09-12 2020-03-31 Seoul Semiconductor Co., Ltd. Display apparatus
JP2019102664A (ja) * 2017-12-04 2019-06-24 株式会社ブイ・テクノロジー Ｌｅｄ表示パネルの製造方法

Also Published As

Publication number Publication date
TW202025474A (zh) 2020-07-01
WO2020049896A1 (ja) 2020-03-12
JP2020043140A (ja) 2020-03-19
KR20210055676A (ko) 2021-05-17

Similar Documents

Publication Publication Date Title
US20200295224A1 (en) Manufacturing method for led display panel
US20200243739A1 (en) Board connection structure, board mounting method, and micro-led display
CN112655099A (zh) Led显示面板的制造方法以及led显示面板
US20200243712A1 (en) Inspection method for led chip, inspection device therefor, and manufacturing method for led display
CN112352472A (zh) 基板安装方法以及电子部件安装基板
WO2020100470A1 (ja) フルカラーｌｅｄ表示パネル
WO2020116207A1 (ja) マイクロｌｅｄ実装構造、マイクロｌｅｄディスプレイ及びマイクロｌｅｄディスプレイの製造方法
US20200411588A1 (en) Full-Color Led Diplay Panel And Method For Manufacturing Same
JP2020013954A (ja) 基板接続構造、マイクロｌｅｄディスプレイ及び部品実装方法
KR20120061376A (ko) 반도체 발광 소자에 형광체를 도포하는 방법
US20200373350A1 (en) Full-Color Led Display Panel And Method For Manufacturing Same
TW202114251A (zh) 電子零件封裝構造、電子零件封裝方法及led顯示面板
JP2021056386A (ja) Ｌｅｄ表示装置の製造方法及びｌｅｄ表示装置
CN111081685B (zh) 显示装置
WO2020003869A1 (ja) 基板実装方法及び電子部品実装基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210413

WD01 Invention patent application deemed withdrawn after publication