KR20200134291A - 밀봉용 접착제 - Google Patents

밀봉용 접착제 Download PDF

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Publication number
KR20200134291A
KR20200134291A KR1020207030387A KR20207030387A KR20200134291A KR 20200134291 A KR20200134291 A KR 20200134291A KR 1020207030387 A KR1020207030387 A KR 1020207030387A KR 20207030387 A KR20207030387 A KR 20207030387A KR 20200134291 A KR20200134291 A KR 20200134291A
Authority
KR
South Korea
Prior art keywords
acid
adhesive
epoxy resin
mass
sealing
Prior art date
Application number
KR1020207030387A
Other languages
English (en)
Korean (ko)
Inventor
마사시 구로누시
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20200134291A publication Critical patent/KR20200134291A/ko

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Liquid Crystal (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
KR1020207030387A 2018-03-23 2019-03-15 밀봉용 접착제 KR20200134291A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-056530 2018-03-23
JP2018056530 2018-03-23
PCT/JP2019/010872 WO2019181789A1 (ja) 2018-03-23 2019-03-15 封止用接着剤

Publications (1)

Publication Number Publication Date
KR20200134291A true KR20200134291A (ko) 2020-12-01

Family

ID=67987241

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207030387A KR20200134291A (ko) 2018-03-23 2019-03-15 밀봉용 접착제

Country Status (5)

Country Link
JP (1) JP7250255B2 (ja)
KR (1) KR20200134291A (ja)
CN (1) CN111902511A (ja)
TW (1) TWI813651B (ja)
WO (1) WO2019181789A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980372B (zh) * 2019-12-16 2022-11-22 深圳市优宝新材料科技有限公司 一种粘结剂及其制备方法
CN114605953B (zh) * 2022-01-27 2024-04-23 北京东方雨虹防水技术股份有限公司 一种聚氨酯密封胶

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157205A (ja) 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571719A (en) * 1978-11-27 1980-05-30 Hitachi Ltd Epoxy resin composition having improved crack resistance
JPH06224239A (ja) * 1993-01-21 1994-08-12 Toshiba Corp 樹脂封止型半導体装置の製造方法
JPH11286594A (ja) * 1998-03-31 1999-10-19 Toshiba Chem Corp 封止用樹脂組成物および半導体封止装置
JP2001114992A (ja) * 1999-10-18 2001-04-24 Toshiba Chem Corp 封止用樹脂組成物および半導体封止装置
JP2005281624A (ja) * 2004-03-30 2005-10-13 Kyocera Chemical Corp 封止用樹脂組成物および半導体装置
JP2005290111A (ja) * 2004-03-31 2005-10-20 Kyocera Chemical Corp 封止用樹脂組成物および半導体装置
JP2007224167A (ja) * 2006-02-24 2007-09-06 Nitto Denko Corp 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
JP5023773B2 (ja) * 2007-04-04 2012-09-12 株式会社デンソー 硬化性樹脂組成物
JP2011063715A (ja) * 2009-09-17 2011-03-31 Sekisui Chem Co Ltd 電子部品接合用接着剤
JP4854807B2 (ja) * 2009-09-30 2012-01-18 積水化学工業株式会社 フリップチップ実装用接着剤、フリップチップ実装用接着フィルム、半導体チップの実装方法及び半導体装置
JP6032593B2 (ja) * 2012-08-06 2016-11-30 パナソニックIpマネジメント株式会社 液状エポキシ樹脂組成物と複合部材および電子部品装置
KR20180075431A (ko) * 2015-10-26 2018-07-04 세키스이가가쿠 고교가부시키가이샤 액정 표시 소자용 시일제, 상하 도통 재료 및 액정 표시 소자

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157205A (ja) 2012-01-30 2013-08-15 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス表示素子用封止剤

Also Published As

Publication number Publication date
CN111902511A (zh) 2020-11-06
TWI813651B (zh) 2023-09-01
JPWO2019181789A1 (ja) 2021-03-18
JP7250255B2 (ja) 2023-04-03
WO2019181789A1 (ja) 2019-09-26
TW201940636A (zh) 2019-10-16

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