KR20200115205A - 다이싱 테이프 일체형 반도체 배면 밀착 필름 - Google Patents

다이싱 테이프 일체형 반도체 배면 밀착 필름 Download PDF

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Publication number
KR20200115205A
KR20200115205A KR1020200034236A KR20200034236A KR20200115205A KR 20200115205 A KR20200115205 A KR 20200115205A KR 1020200034236 A KR1020200034236 A KR 1020200034236A KR 20200034236 A KR20200034236 A KR 20200034236A KR 20200115205 A KR20200115205 A KR 20200115205A
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KR
South Korea
Prior art keywords
film
semiconductor back
dicing tape
adhesion
peel
Prior art date
Application number
KR1020200034236A
Other languages
English (en)
Korean (ko)
Inventor
고시 시가
사토시 사토
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20200115205A publication Critical patent/KR20200115205A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
KR1020200034236A 2019-03-25 2020-03-20 다이싱 테이프 일체형 반도체 배면 밀착 필름 KR20200115205A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-057336 2019-03-25
JP2019057336A JP7160739B2 (ja) 2019-03-25 2019-03-25 ダイシングテープ一体型半導体背面密着フィルム

Publications (1)

Publication Number Publication Date
KR20200115205A true KR20200115205A (ko) 2020-10-07

Family

ID=72643626

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200034236A KR20200115205A (ko) 2019-03-25 2020-03-20 다이싱 테이프 일체형 반도체 배면 밀착 필름

Country Status (4)

Country Link
JP (1) JP7160739B2 (ja)
KR (1) KR20200115205A (ja)
CN (1) CN111739832A (ja)
TW (1) TW202039728A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7281623B2 (ja) 2019-01-29 2023-05-26 パナソニックＩｐマネジメント株式会社 フロアレイアウト作成装置およびフロアレイアウト表示システムならびにフロアレイアウト作成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151360A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp フリップチップ型半導体裏面用フィルム
WO2014092200A1 (ja) 2012-12-14 2014-06-19 リンテック株式会社 保護膜形成用フィルム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000234079A (ja) 1999-02-15 2000-08-29 Nitta Ind Corp 半導体ウエハ加工用シート
JP3766304B2 (ja) 2001-10-09 2006-04-12 クレハエラストマー株式会社 加熱剥離型粘着シート
JP2005255960A (ja) 2004-03-15 2005-09-22 Nitta Ind Corp 基材フィルムの収縮を抑制した感温性粘着テープ
JP5433293B2 (ja) 2009-04-30 2014-03-05 ニッタ株式会社 粘着テープ
JP5681374B2 (ja) 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
JP6328992B2 (ja) 2014-05-01 2018-05-23 株式会社クラレ ホットメルト接着剤組成物
JP6530242B2 (ja) 2015-06-01 2019-06-12 日東電工株式会社 半導体裏面用フィルム及びその用途
JP6921644B2 (ja) 2017-06-27 2021-08-18 日東電工株式会社 ダイシングテープ一体型裏面保護フィルム
JP7053194B2 (ja) 2017-09-04 2022-04-12 ニッタ株式会社 感温性粘着剤、感温性粘着シートおよび感温性粘着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011151360A (ja) 2009-12-24 2011-08-04 Nitto Denko Corp フリップチップ型半導体裏面用フィルム
WO2014092200A1 (ja) 2012-12-14 2014-06-19 リンテック株式会社 保護膜形成用フィルム

Also Published As

Publication number Publication date
TW202039728A (zh) 2020-11-01
JP7160739B2 (ja) 2022-10-25
JP2020161571A (ja) 2020-10-01
CN111739832A (zh) 2020-10-02

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