KR20200108280A - 펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법 - Google Patents
펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법 Download PDFInfo
- Publication number
- KR20200108280A KR20200108280A KR1020207019887A KR20207019887A KR20200108280A KR 20200108280 A KR20200108280 A KR 20200108280A KR 1020207019887 A KR1020207019887 A KR 1020207019887A KR 20207019887 A KR20207019887 A KR 20207019887A KR 20200108280 A KR20200108280 A KR 20200108280A
- Authority
- KR
- South Korea
- Prior art keywords
- pellicle
- frame
- mask
- distance
- measurement unit
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 22
- 238000005259 measurement Methods 0.000 claims abstract description 85
- 239000000853 adhesive Substances 0.000 claims abstract description 31
- 230000001070 adhesive effect Effects 0.000 claims abstract description 31
- 239000012528 membrane Substances 0.000 claims abstract description 4
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000010408 film Substances 0.000 description 32
- 238000010586 diagram Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000007689 inspection Methods 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- -1 for example Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2018-010999 | 2018-01-25 | ||
JP2018010999A JP6921412B2 (ja) | 2018-01-25 | 2018-01-25 | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
PCT/JP2019/001668 WO2019146547A1 (ja) | 2018-01-25 | 2019-01-21 | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20200108280A true KR20200108280A (ko) | 2020-09-17 |
KR102703121B1 KR102703121B1 (ko) | 2024-09-05 |
Family
ID=
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016133054A1 (ja) | 2015-02-19 | 2016-08-25 | 株式会社ブイ・テクノロジー | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016133054A1 (ja) | 2015-02-19 | 2016-08-25 | 株式会社ブイ・テクノロジー | ペリクルフレーム把持装置及びペリクルフレーム把持方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2019128501A (ja) | 2019-08-01 |
TW201933512A (zh) | 2019-08-16 |
JP6921412B2 (ja) | 2021-08-18 |
WO2019146547A1 (ja) | 2019-08-01 |
CN111630453B (zh) | 2023-08-25 |
TWI798327B (zh) | 2023-04-11 |
CN111630453A (zh) | 2020-09-04 |
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