KR20200094078A - 키 패턴의 검출 방법, 및 장치 - Google Patents

키 패턴의 검출 방법, 및 장치 Download PDF

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Publication number
KR20200094078A
KR20200094078A KR1020190177264A KR20190177264A KR20200094078A KR 20200094078 A KR20200094078 A KR 20200094078A KR 1020190177264 A KR1020190177264 A KR 1020190177264A KR 20190177264 A KR20190177264 A KR 20190177264A KR 20200094078 A KR20200094078 A KR 20200094078A
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KR
South Korea
Prior art keywords
unit
imaging
key pattern
pattern
detected
Prior art date
Application number
KR1020190177264A
Other languages
English (en)
Korean (ko)
Inventor
다스쿠 고조
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20200094078A publication Critical patent/KR20200094078A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/22—Matching criteria, e.g. proximity measures
    • G06K9/6201—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
KR1020190177264A 2019-01-29 2019-12-30 키 패턴의 검출 방법, 및 장치 KR20200094078A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019013388A JP7191473B2 (ja) 2019-01-29 2019-01-29 キーパターンの検出方法、及び装置
JPJP-P-2019-013388 2019-01-29

Publications (1)

Publication Number Publication Date
KR20200094078A true KR20200094078A (ko) 2020-08-06

Family

ID=71798638

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190177264A KR20200094078A (ko) 2019-01-29 2019-12-30 키 패턴의 검출 방법, 및 장치

Country Status (4)

Country Link
JP (1) JP7191473B2 (zh)
KR (1) KR20200094078A (zh)
CN (1) CN111489981A (zh)
TW (1) TWI824103B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7191473B2 (ja) * 2019-01-29 2022-12-19 株式会社ディスコ キーパターンの検出方法、及び装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244803A (ja) 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd 自動精密位置合せシステム
JPH07321073A (ja) 1994-05-20 1995-12-08 Disco Abrasive Syst Ltd ストリートピッチ自動計測システム
JP2005166991A (ja) 2003-12-03 2005-06-23 Disco Abrasive Syst Ltd アライメント装置及び加工装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015078852A (ja) * 2013-10-15 2015-04-23 株式会社ディスコ アライメント方法
JP7191473B2 (ja) * 2019-01-29 2022-12-19 株式会社ディスコ キーパターンの検出方法、及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244803A (ja) 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd 自動精密位置合せシステム
JPH07321073A (ja) 1994-05-20 1995-12-08 Disco Abrasive Syst Ltd ストリートピッチ自動計測システム
JP2005166991A (ja) 2003-12-03 2005-06-23 Disco Abrasive Syst Ltd アライメント装置及び加工装置

Also Published As

Publication number Publication date
JP2020123622A (ja) 2020-08-13
JP7191473B2 (ja) 2022-12-19
TWI824103B (zh) 2023-12-01
TW202029312A (zh) 2020-08-01
CN111489981A (zh) 2020-08-04

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